JP2014524957A5 - - Google Patents

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Publication number
JP2014524957A5
JP2014524957A5 JP2014520234A JP2014520234A JP2014524957A5 JP 2014524957 A5 JP2014524957 A5 JP 2014524957A5 JP 2014520234 A JP2014520234 A JP 2014520234A JP 2014520234 A JP2014520234 A JP 2014520234A JP 2014524957 A5 JP2014524957 A5 JP 2014524957A5
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JP
Japan
Prior art keywords
semiconductor package
resin composition
package resin
substrate
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014520234A
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English (en)
Japanese (ja)
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JP6155261B2 (ja
JP2014524957A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/045916 external-priority patent/WO2013012587A2/en
Publication of JP2014524957A publication Critical patent/JP2014524957A/ja
Publication of JP2014524957A5 publication Critical patent/JP2014524957A5/ja
Application granted granted Critical
Publication of JP6155261B2 publication Critical patent/JP6155261B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014520234A 2011-07-15 2012-07-09 半導体パッケージ樹脂組成物及びその使用方法 Expired - Fee Related JP6155261B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161508344P 2011-07-15 2011-07-15
US61/508,344 2011-07-15
PCT/US2012/045916 WO2013012587A2 (en) 2011-07-15 2012-07-09 Semiconductor package resin composition and usage method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017043422A Division JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Publications (3)

Publication Number Publication Date
JP2014524957A JP2014524957A (ja) 2014-09-25
JP2014524957A5 true JP2014524957A5 (https=) 2015-08-27
JP6155261B2 JP6155261B2 (ja) 2017-06-28

Family

ID=47558664

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014520234A Expired - Fee Related JP6155261B2 (ja) 2011-07-15 2012-07-09 半導体パッケージ樹脂組成物及びその使用方法
JP2017043422A Pending JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017043422A Pending JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Country Status (5)

Country Link
US (2) US9230873B2 (https=)
JP (2) JP6155261B2 (https=)
KR (1) KR20140058557A (https=)
TW (1) TWI550018B (https=)
WO (1) WO2013012587A2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2691466B1 (en) * 2011-03-28 2017-12-27 3M Innovative Properties Company Curable composition, article, method of curing, and reaction product
JP6271164B2 (ja) * 2013-06-17 2018-01-31 日立オートモティブシステムズ株式会社 箱型車載制御装置
JP6679488B2 (ja) 2014-01-02 2020-04-15 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ粒子フィラーを含むフィルム
US9220183B1 (en) * 2014-07-16 2015-12-22 International Business Machines Corporation Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
JP6872313B2 (ja) * 2015-10-13 2021-05-19 リンテック株式会社 半導体装置および複合シート
US20190031790A1 (en) * 2016-01-12 2019-01-31 Hitachi Chemical Company, Ltd. Photosensitive resin composition, dry film using same, printed wiring board, and method for manufacturing printed wiring board
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7218378B2 (ja) * 2018-02-19 2023-02-06 シグニファイ ホールディング ビー ヴィ ライトエンジンを備える封止デバイス
JP7109940B2 (ja) * 2018-03-08 2022-08-01 日東電工株式会社 封止用接着シート
KR20260012727A (ko) * 2023-05-04 2026-01-27 인팩 테크놀로지스 - 리미티드 파트너십 제어된 열팽창 계수를 갖는 비전도성 폴리머 층을 형성하는 방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228681B1 (en) 1999-03-10 2001-05-08 Fry's Metals, Inc. Flip chip having integral mask and underfill providing two-stage bump formation
US6245595B1 (en) 1999-07-22 2001-06-12 National Semiconductor Corporation Techniques for wafer level molding of underfill encapsulant
US6281046B1 (en) 2000-04-25 2001-08-28 Atmel Corporation Method of forming an integrated circuit package at a wafer level
US6573122B2 (en) 2001-03-28 2003-06-03 International Rectifier Corporation Wafer level insulation underfill for die attach
US6794761B2 (en) 2001-04-26 2004-09-21 Intel Corporation No-flow underfill material
US20030111519A1 (en) 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
DE60232942D1 (de) 2001-10-09 2009-08-27 Mitsubishi Chem Corp Strahlungshärtbare Beschichtungszusammensetzung
US20030162911A1 (en) 2002-01-31 2003-08-28 Yue Xiao No flow underfill composition
US20060194064A1 (en) 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US20040101688A1 (en) 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US7022410B2 (en) 2003-12-16 2006-04-04 General Electric Company Combinations of resin compositions and methods of use thereof
US20060147719A1 (en) 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
KR100774798B1 (ko) * 2004-05-13 2007-11-07 닛토덴코 가부시키가이샤 반도체 캡슐화용 에폭시 수지 조성물 및 이것을 이용한 반도체 장치
US7985476B2 (en) * 2005-10-28 2011-07-26 Sumitomo Osaka Cement Co., Ltd. Transparent zirconia dispersion and zirconia particle-containing resin composition, composition for sealing light emitting element and light emitting element, hard coat film and optical functional film and optical component, and method for producing zirconia particle-containing resin
JP2008180992A (ja) * 2007-01-25 2008-08-07 Hitachi Chem Co Ltd 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法、プリント配線板及び半導体パッケージ
EP2135276A2 (en) 2007-03-13 2009-12-23 Lord Corporation Die attachment method with a covex surface underfill
JP2008297373A (ja) * 2007-05-29 2008-12-11 Somar Corp 液状エポキシ樹脂組成物からなるアンダーフィル材及びフリップチップ型半導体装置
JP5004351B2 (ja) 2007-11-30 2012-08-22 信越化学工業株式会社 半導体装置の製造方法
EP2402406B1 (en) 2009-02-27 2014-05-14 LG Chem, Ltd. Outstandingly abrasion resistant and pollution resistant coating composition and coating film
EP2435178B1 (en) * 2009-05-26 2020-08-12 3M Innovative Properties Company Process for making filled resins

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