KR20140024878A - 투명 컴포넌트 개선 및 투명 컴포넌트 관련 개선 - Google Patents

투명 컴포넌트 개선 및 투명 컴포넌트 관련 개선 Download PDF

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Publication number
KR20140024878A
KR20140024878A KR1020137028747A KR20137028747A KR20140024878A KR 20140024878 A KR20140024878 A KR 20140024878A KR 1020137028747 A KR1020137028747 A KR 1020137028747A KR 20137028747 A KR20137028747 A KR 20137028747A KR 20140024878 A KR20140024878 A KR 20140024878A
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KR
South Korea
Prior art keywords
copper
sulfide
substrate
layer
coating
Prior art date
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KR1020137028747A
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English (en)
Korean (ko)
Inventor
필립 가레쓰 벤틀리
Original Assignee
컨덕티브 잉크젯 테크놀로지 리미티드
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Publication of KR20140024878A publication Critical patent/KR20140024878A/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63Treatment of copper or alloys based thereon
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0094Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y99/00Subject matter not provided for in other groups of this subclass
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142Conversion of conductive material into insulating material or into dissolvable compound
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
KR1020137028747A 2011-04-14 2012-04-12 투명 컴포넌트 개선 및 투명 컴포넌트 관련 개선 KR20140024878A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1106309.6A GB2489974B (en) 2011-04-14 2011-04-14 Improvements in and relating to transparent components
GB1106309.6 2011-04-14
PCT/GB2012/050806 WO2012140428A1 (en) 2011-04-14 2012-04-12 Improvements in and relating to transparent components

Publications (1)

Publication Number Publication Date
KR20140024878A true KR20140024878A (ko) 2014-03-03

Family

ID=44146998

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137028747A KR20140024878A (ko) 2011-04-14 2012-04-12 투명 컴포넌트 개선 및 투명 컴포넌트 관련 개선

Country Status (7)

Country Link
US (2) US8980531B2 (ja)
EP (1) EP2698045A1 (ja)
JP (1) JP2014522546A (ja)
KR (1) KR20140024878A (ja)
CN (1) CN103503586A (ja)
GB (1) GB2489974B (ja)
WO (1) WO2012140428A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6186805B2 (ja) * 2013-03-28 2017-08-30 大日本印刷株式会社 タッチパネル
WO2015163860A1 (en) * 2014-04-23 2015-10-29 Uni-Pixel Displays, Inc. Method of fabricating a conductive pattern with high optical transmission and low visibility
KR102477932B1 (ko) * 2015-12-15 2022-12-15 삼성전자주식회사 표시 장치 및 이를 포함하는 표시 시스템

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2460896A (en) 1944-08-19 1949-02-08 Enthone Composition for blackening copper and copper alloy surfaces
US3189481A (en) * 1961-08-29 1965-06-15 Gen Electric Method for the preparation of copper sulfide films and products obtained thereby
US3203836A (en) * 1961-08-29 1965-08-31 Gen Electric Method for the preparation of copper sulfide films and products obtained thereby
JPH04363336A (ja) * 1991-04-05 1992-12-16 Idemitsu Kosan Co Ltd 表面導電性透明高分子膜の製造方法
DE19707051A1 (de) 1997-02-21 1998-08-27 Merck Patent Gmbh Verfahren zur Herstellung von Glanzpigment-haltigen Pulverlacken
US6448492B1 (en) * 1997-12-24 2002-09-10 Gunze Limited Transparent member for shielding electromagnetic waves and method of producing the same
EP1215705A3 (en) * 2000-12-12 2003-05-21 Nisshinbo Industries, Inc. Transparent electromagnetic radiation shielding material
GB0328221D0 (en) * 2003-12-05 2004-01-07 Conductive Inkjet Tech Ltd Formation of solid layers on substrates
JP2005139546A (ja) 2003-10-14 2005-06-02 Mitsui Mining & Smelting Co Ltd 黒色化表面処理銅箔及びその黒色化表面処理銅箔の製造方法並びにその黒色化表面処理銅箔を用いて得られる電磁波遮蔽金属メッシュ。
KR101178334B1 (ko) 2003-12-05 2012-08-29 컨덕티브 잉크젯 테크놀로지 리미티드 기판 상의 고체층 형성 방법
JP5128841B2 (ja) * 2007-04-16 2013-01-23 日本写真印刷株式会社 透明薄板
CN104090673B (zh) 2008-02-28 2018-02-23 3M创新有限公司 具有低可见度导体的触屏传感器
JP4870699B2 (ja) 2008-03-10 2012-02-08 日立ビアメカニクス株式会社 銅の表面処理方法およびプリント配線板の表面処理方法
JP2009231426A (ja) 2008-03-21 2009-10-08 Toppan Printing Co Ltd プラズマディスプレイ前面板用黒色化シールドメッシュの製造方法及びプラズマディスプレイ前面板用黒色化シールドメッシュ及びプラズマディスプレイパネル
JP5256880B2 (ja) 2008-06-24 2013-08-07 凸版印刷株式会社 プラズマディスプレイ前面板用黒色化シールドメッシュおよびその製造方法
US20110279398A1 (en) * 2010-05-12 2011-11-17 Harald Philipp Touch screen electrode enhancements

Also Published As

Publication number Publication date
US20150173179A1 (en) 2015-06-18
JP2014522546A (ja) 2014-09-04
GB201106309D0 (en) 2011-06-01
US20140000945A1 (en) 2014-01-02
CN103503586A (zh) 2014-01-08
GB2489974B (en) 2015-10-21
EP2698045A1 (en) 2014-02-19
GB2489974A (en) 2012-10-17
US8980531B2 (en) 2015-03-17
WO2012140428A1 (en) 2012-10-18

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