KR20140009323A - 프린트 배선판 및 프린트 배선판의 제조 방법 - Google Patents

프린트 배선판 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20140009323A
KR20140009323A KR1020137022431A KR20137022431A KR20140009323A KR 20140009323 A KR20140009323 A KR 20140009323A KR 1020137022431 A KR1020137022431 A KR 1020137022431A KR 20137022431 A KR20137022431 A KR 20137022431A KR 20140009323 A KR20140009323 A KR 20140009323A
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KR
South Korea
Prior art keywords
layer
copper foil
wiring board
printed wiring
resin
Prior art date
Application number
KR1020137022431A
Other languages
English (en)
Korean (ko)
Inventor
테페이 이토
노리유키 오히가시
Original Assignee
스미토모 베이클리트 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 베이클리트 컴퍼니 리미티드 filed Critical 스미토모 베이클리트 컴퍼니 리미티드
Publication of KR20140009323A publication Critical patent/KR20140009323A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
KR1020137022431A 2011-01-26 2012-01-18 프린트 배선판 및 프린트 배선판의 제조 방법 KR20140009323A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011014127 2011-01-26
JPJP-P-2011-014127 2011-01-26
PCT/JP2012/000263 WO2012101985A1 (ja) 2011-01-26 2012-01-18 プリント配線板およびプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
KR20140009323A true KR20140009323A (ko) 2014-01-22

Family

ID=46580564

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137022431A KR20140009323A (ko) 2011-01-26 2012-01-18 프린트 배선판 및 프린트 배선판의 제조 방법

Country Status (4)

Country Link
JP (1) JP5929220B2 (ja)
KR (1) KR20140009323A (ja)
TW (1) TWI600349B (ja)
WO (1) WO2012101985A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170017798A (ko) * 2015-08-06 2017-02-15 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법
KR20170028968A (ko) * 2014-09-02 2017-03-14 미쓰이금속광업주식회사 흑색화 표면 처리 동박 및 캐리어박 부착 동박
KR20170131832A (ko) * 2015-03-24 2017-11-30 미쓰이금속광업주식회사 캐리어 부착 극박 동박, 그 제조 방법, 동장 적층판 및 프린트 배선판

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
JP5481591B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
TWI452955B (zh) * 2012-10-08 2014-09-11 Subtron Technology Co Ltd 基板結構的製作方法
MY176308A (en) * 2012-11-26 2020-07-28 Jx Nippon Mining & Metals Corp Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device
CN105408525B (zh) * 2013-07-23 2019-03-08 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法
KR101556658B1 (ko) * 2013-11-26 2015-10-01 주식회사 두산 내열성 및 저유전 손실 특성을 가진 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
CN104902675B (zh) * 2014-03-05 2018-08-07 深南电路有限公司 一种台阶槽电路板及其加工方法
JP6498091B2 (ja) * 2015-09-25 2019-04-10 Ｊｘ金属株式会社 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
KR102511868B1 (ko) * 2017-12-20 2023-03-20 삼성전기주식회사 코일 전자부품
JP6826073B2 (ja) * 2018-05-31 2021-02-03 デクセリアルズ株式会社 偏光板及びその製造方法、並びに光学機器
CN112739542B (zh) * 2018-09-27 2023-04-25 京瓷株式会社 热敏头以及热敏打印机
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2680234B2 (ja) * 1992-11-12 1997-11-19 株式会社日立製作所 配線パターン形成方法
JPH07226575A (ja) * 1994-02-14 1995-08-22 Hitachi Chem Co Ltd プリント配線板の製造法
JP2754157B2 (ja) * 1994-03-31 1998-05-20 三井金属鉱業株式会社 プリント配線板用電解銅箔の製造方法
JP4137279B2 (ja) * 1999-04-23 2008-08-20 イビデン株式会社 プリント配線板及びその製造方法
JP2003243810A (ja) * 2002-02-15 2003-08-29 Mitsubishi Gas Chem Co Inc 極細線パターンを有するプリント配線板製造方法。
JP2003101183A (ja) * 2001-09-20 2003-04-04 Matsushita Electric Ind Co Ltd 回路基板と電力変換モジュールおよびその製造方法
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP4501492B2 (ja) * 2004-03-30 2010-07-14 住友ベークライト株式会社 多層プリント配線板の製造方法
JP5588607B2 (ja) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170028968A (ko) * 2014-09-02 2017-03-14 미쓰이금속광업주식회사 흑색화 표면 처리 동박 및 캐리어박 부착 동박
KR20170131832A (ko) * 2015-03-24 2017-11-30 미쓰이금속광업주식회사 캐리어 부착 극박 동박, 그 제조 방법, 동장 적층판 및 프린트 배선판
KR20170017798A (ko) * 2015-08-06 2017-02-15 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법

Also Published As

Publication number Publication date
JP5929220B2 (ja) 2016-06-01
TWI600349B (zh) 2017-09-21
JP2012169598A (ja) 2012-09-06
WO2012101985A1 (ja) 2012-08-02
TW201251533A (en) 2012-12-16

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