KR20140009023A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR20140009023A KR20140009023A KR1020130071457A KR20130071457A KR20140009023A KR 20140009023 A KR20140009023 A KR 20140009023A KR 1020130071457 A KR1020130071457 A KR 1020130071457A KR 20130071457 A KR20130071457 A KR 20130071457A KR 20140009023 A KR20140009023 A KR 20140009023A
- Authority
- KR
- South Korea
- Prior art keywords
- oxide semiconductor
- layer
- semiconductor layer
- film
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Thin Film Transistor (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2012-157653 | 2012-07-13 | ||
| JP2012157653 | 2012-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140009023A true KR20140009023A (ko) | 2014-01-22 |
Family
ID=49913207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130071457A Withdrawn KR20140009023A (ko) | 2012-07-13 | 2013-06-21 | 반도체 장치 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20140014947A1 (enExample) |
| JP (1) | JP6301600B2 (enExample) |
| KR (1) | KR20140009023A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200034457A (ko) * | 2018-09-21 | 2020-03-31 | 주성엔지니어링(주) | 박막 트랜지스터 및 이의 제조 방법 |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9153699B2 (en) * | 2012-06-15 | 2015-10-06 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with multiple oxide semiconductor layers |
| JP6134598B2 (ja) | 2012-08-02 | 2017-05-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2014021442A1 (en) | 2012-08-03 | 2014-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor stacked film and semiconductor device |
| CN104584229B (zh) | 2012-08-10 | 2018-05-15 | 株式会社半导体能源研究所 | 半导体装置及其制造方法 |
| US9245958B2 (en) | 2012-08-10 | 2016-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP6220597B2 (ja) | 2012-08-10 | 2017-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2014024808A1 (en) | 2012-08-10 | 2014-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR102171650B1 (ko) | 2012-08-10 | 2020-10-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US9929276B2 (en) | 2012-08-10 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2014046222A1 (en) | 2012-09-24 | 2014-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| TWI671910B (zh) | 2012-09-24 | 2019-09-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2014061762A1 (en) | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102220279B1 (ko) | 2012-10-19 | 2021-02-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법 |
| JP6285150B2 (ja) | 2012-11-16 | 2018-02-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI624949B (zh) | 2012-11-30 | 2018-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2014103901A1 (en) | 2012-12-25 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US20150008428A1 (en) | 2013-07-08 | 2015-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| TWI721409B (zh) | 2013-12-19 | 2021-03-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| TWI658597B (zh) | 2014-02-07 | 2019-05-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| CN118588742A (zh) * | 2014-02-21 | 2024-09-03 | 株式会社半导体能源研究所 | 半导体膜、晶体管、半导体装置、显示装置以及电子设备 |
| JP2015180994A (ja) * | 2014-03-06 | 2015-10-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2015132694A1 (en) * | 2014-03-07 | 2015-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Touch sensor, touch panel, and manufacturing method of touch panel |
| US9324747B2 (en) * | 2014-03-13 | 2016-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
| TWI663726B (zh) | 2014-05-30 | 2019-06-21 | Semiconductor Energy Laboratory Co., Ltd. | 半導體裝置、模組及電子裝置 |
| CN104167448B (zh) * | 2014-08-05 | 2017-06-30 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制备方法、阵列基板和显示装置 |
| KR102518392B1 (ko) * | 2014-12-16 | 2023-04-06 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 |
| KR20160114511A (ko) | 2015-03-24 | 2016-10-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| US9806200B2 (en) | 2015-03-27 | 2017-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN104916703B (zh) * | 2015-05-07 | 2018-07-31 | 京东方科技集团股份有限公司 | 一种氧化物薄膜晶体管、阵列基板和显示装置 |
| US10297694B2 (en) | 2015-10-14 | 2019-05-21 | Sharp Kabushiki Kaisha | Semiconductor device and method for manufacturing same |
| US10714633B2 (en) | 2015-12-15 | 2020-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
| KR20180123028A (ko) | 2016-03-11 | 2018-11-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장비, 상기 반도체 장치의 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
| KR102330605B1 (ko) | 2016-06-22 | 2021-11-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN110024135B (zh) * | 2016-12-02 | 2023-10-17 | 株式会社半导体能源研究所 | 半导体装置 |
| KR102752953B1 (ko) | 2017-06-05 | 2025-01-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치의 제작 방법 |
| JP2019067791A (ja) * | 2017-09-28 | 2019-04-25 | シャープ株式会社 | 半導体装置 |
| JP7190729B2 (ja) | 2018-08-31 | 2022-12-16 | 三国電子有限会社 | キャリア注入量制御電極を有する有機エレクトロルミネセンス素子 |
| JP7246681B2 (ja) | 2018-09-26 | 2023-03-28 | 三国電子有限会社 | トランジスタ及びトランジスタの製造方法、並びにトランジスタを含む表示装置 |
| WO2020089733A1 (ja) | 2018-11-02 | 2020-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2020240332A1 (ja) * | 2019-05-31 | 2020-12-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US20220230878A1 (en) * | 2019-09-05 | 2022-07-21 | Hewlett-Packard Development Company, L.P. | Semiconductor composite layers |
| CN113838801B (zh) * | 2020-06-24 | 2024-10-22 | 京东方科技集团股份有限公司 | 半导体基板的制造方法和半导体基板 |
| KR20230063231A (ko) | 2021-11-01 | 2023-05-09 | 삼성전자주식회사 | 반도체 장치 |
| CN114695394A (zh) * | 2022-03-29 | 2022-07-01 | 广州华星光电半导体显示技术有限公司 | 阵列基板和显示面板 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7145174B2 (en) * | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| WO2007125671A1 (ja) * | 2006-03-31 | 2007-11-08 | Nippon Kayaku Kabushiki Kaisha | 電界効果トランジスタ |
| JP5242083B2 (ja) * | 2007-06-13 | 2013-07-24 | 出光興産株式会社 | 結晶酸化物半導体、及びそれを用いてなる薄膜トランジスタ |
| JP5345456B2 (ja) * | 2008-08-14 | 2013-11-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタ |
| KR101648927B1 (ko) * | 2009-01-16 | 2016-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| CN105206514B (zh) * | 2009-11-28 | 2018-04-10 | 株式会社半导体能源研究所 | 层叠的氧化物材料、半导体器件、以及用于制造该半导体器件的方法 |
| JP5497417B2 (ja) * | 2009-12-10 | 2014-05-21 | 富士フイルム株式会社 | 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置 |
| JP2011187506A (ja) * | 2010-03-04 | 2011-09-22 | Sony Corp | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
| KR102276768B1 (ko) * | 2010-04-02 | 2021-07-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5606787B2 (ja) * | 2010-05-18 | 2014-10-15 | 富士フイルム株式会社 | 薄膜トランジスタの製造方法、並びに、薄膜トランジスタ、イメージセンサー、x線センサー及びx線デジタル撮影装置 |
| US8759820B2 (en) * | 2010-08-20 | 2014-06-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5806043B2 (ja) * | 2010-08-27 | 2015-11-10 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8835917B2 (en) * | 2010-09-13 | 2014-09-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, power diode, and rectifier |
-
2013
- 2013-06-21 KR KR1020130071457A patent/KR20140009023A/ko not_active Withdrawn
- 2013-07-01 US US13/932,759 patent/US20140014947A1/en not_active Abandoned
- 2013-07-11 JP JP2013145786A patent/JP6301600B2/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200034457A (ko) * | 2018-09-21 | 2020-03-31 | 주성엔지니어링(주) | 박막 트랜지스터 및 이의 제조 방법 |
| KR20220137863A (ko) * | 2018-09-21 | 2022-10-12 | 주성엔지니어링(주) | 박막 트랜지스터 및 이의 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140014947A1 (en) | 2014-01-16 |
| JP6301600B2 (ja) | 2018-03-28 |
| JP2014033194A (ja) | 2014-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20130621 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |