KR20130143015A - 저온 경화성 에폭시 테이프 및 그의 제조 방법 - Google Patents

저온 경화성 에폭시 테이프 및 그의 제조 방법 Download PDF

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Publication number
KR20130143015A
KR20130143015A KR20137006629A KR20137006629A KR20130143015A KR 20130143015 A KR20130143015 A KR 20130143015A KR 20137006629 A KR20137006629 A KR 20137006629A KR 20137006629 A KR20137006629 A KR 20137006629A KR 20130143015 A KR20130143015 A KR 20130143015A
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KR
South Korea
Prior art keywords
layer
epoxy
curing agent
tape
scrim
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR20137006629A
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English (en)
Korean (ko)
Inventor
데이비드 제이 플라우트
세안 엠 트수지
친 테옹 옹
시앙 광 리
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20130143015A publication Critical patent/KR20130143015A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber; Homopolymers or copolymers of other iso-olefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/242—Applying crosslinking or accelerating agent onto compounding ingredients such as fillers, reinforcements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/102—Woven scrim
    • Y10T442/164—Including a preformed film, foil, or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/184—Nonwoven scrim
    • Y10T442/198—Coated or impregnated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
KR20137006629A 2010-08-20 2011-08-17 저온 경화성 에폭시 테이프 및 그의 제조 방법 Ceased KR20130143015A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
MYPI2010003937 2010-08-20
MYPI2010003937 2010-08-20
PCT/US2011/048010 WO2012024354A1 (en) 2010-08-20 2011-08-17 Low temperature curable epoxy tape and method of making same

Publications (1)

Publication Number Publication Date
KR20130143015A true KR20130143015A (ko) 2013-12-30

Family

ID=44584654

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20137006629A Ceased KR20130143015A (ko) 2010-08-20 2011-08-17 저온 경화성 에폭시 테이프 및 그의 제조 방법

Country Status (6)

Country Link
US (1) US9067395B2 (OSRAM)
JP (1) JP5818893B2 (OSRAM)
KR (1) KR20130143015A (OSRAM)
CN (1) CN103201320B (OSRAM)
TW (1) TWI516564B (OSRAM)
WO (1) WO2012024354A1 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170126796A (ko) * 2016-05-10 2017-11-20 닛토덴코 가부시키가이샤 시트, 테이프, 및 반도체 장치의 제조 방법
KR20220016317A (ko) * 2020-07-30 2022-02-09 현대자동차주식회사 구조용 접착제 테이프

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2877863A1 (en) 2012-07-03 2014-01-09 Larry S. Hebert Method of making structured hybrid adhesive articles
US20140302733A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Chemically Curable Bonding Film Adhesive with Uniform Thickness
US20150239205A1 (en) * 2014-02-25 2015-08-27 GM Global Technology Operations LLC Composite material and methods of making and using the same
JP6536104B2 (ja) * 2014-06-05 2019-07-03 中西金属工業株式会社 円環状インサート成形品の製造方法
KR102349012B1 (ko) 2014-09-05 2022-01-10 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 정합가능한 경화성 접착제 필름
KR101644117B1 (ko) * 2014-10-17 2016-07-29 삼성중공업 주식회사 페인트 대체 테이프
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
US11578237B2 (en) * 2015-10-07 2023-02-14 Dai Nippon Printing Co., Ltd. Adhesive sheet set and method for producing product
EP3170657B1 (en) 2015-11-19 2020-09-09 3M Innovative Properties Company Multilayer structural adhesive film
US9969419B2 (en) * 2016-04-01 2018-05-15 Tk Holdings Inc. Preimpregnated carbon fiber steering wheel
US10400072B2 (en) 2016-04-25 2019-09-03 3M Innovative Properties Company Composite particles for curing epoxy resin compositions and curable and cured epoxy resin compositions prepared using the particles
US11059967B2 (en) 2016-12-13 2021-07-13 3M Innovative Properties Company Epoxy stabilization using acid-coated nitrogen containing catalysts, particles, and methods
WO2018160614A1 (en) 2017-03-03 2018-09-07 3M Innovative Properties Company High performance photocurable optically clear adhesive
US11208576B2 (en) 2017-03-03 2021-12-28 3M Innovative Properties Company High performance photocurable optically clear adhesive
US11133550B2 (en) * 2018-07-19 2021-09-28 Ford Global Technologies, Llc Electrified vehicle battery packs with tear-away service panels
CN113631621A (zh) 2019-03-28 2021-11-09 日东电工株式会社 树脂组合物、及粘接结构体的制造方法
EP3719090A1 (en) 2019-04-02 2020-10-07 3M Innovative Properties Company Elastic one-part structural adhesive tape
US20220259471A1 (en) * 2019-05-31 2022-08-18 Sekisui Chemical Co., Ltd. Adhesive composition, optical component, electronic component, and electronic module
KR20210115293A (ko) * 2020-03-12 2021-09-27 주식회사 두산 접착 조성물 및 이를 포함하는 커버레이 필름 및 인쇄회로기판
WO2022123498A1 (en) 2020-12-10 2022-06-16 3M Innovative Properties Company Crosslinked polymer particles and related compositions and processes
CN114806447A (zh) * 2022-04-15 2022-07-29 中国航空制造技术研究院 一种长室温储存期环氧胶膜的制备方法
CN114922110A (zh) * 2022-06-06 2022-08-19 东南大学 一种预制耐磨持续性道路标线及其施工方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3894113A (en) 1966-09-15 1975-07-08 Minnesota Mining & Mfg Bonding film
USRE30843E (en) 1971-05-10 1982-01-05 Epoxy tape
GB8417319D0 (en) * 1984-07-06 1984-08-08 Exxon Research Engineering Co Curable rubber composition
BR8802908A (pt) * 1988-06-14 1990-01-23 Ciba Geigy Quimica Massa de amassamento,emprego e processo para sua preparacao
TW305860B (OSRAM) 1994-03-15 1997-05-21 Toray Industries
US5648407A (en) 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
JP3433878B2 (ja) 1996-05-29 2003-08-04 三菱レイヨン株式会社 エポキシ樹脂組成物、それからなるフィルム状接着剤およびエポキシ樹脂組成物の調製方法
JPH1025334A (ja) 1996-07-09 1998-01-27 Shinko Kagaku Kogyo Kk 潜在性硬化型樹脂組成物及びこれを用いて形成した潜在性硬化型接着性シート
CN1196744C (zh) * 1999-12-20 2005-04-13 3M创新有限公司 室温稳定的一份式可固化环氧树脂粘合剂
KR100419063B1 (ko) * 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판
GB0412196D0 (en) 2004-06-02 2004-07-07 Hexcel Composites Ltd Cure accelerators
GB0619401D0 (en) 2006-10-02 2006-11-08 Hexcel Composites Ltd Composite materials with improved performance
US20090076180A1 (en) 2007-09-03 2009-03-19 Kazuki Iwaya Epoxy resin composition using latent curing agent and curable by photo and heat in combination
GB0823403D0 (en) 2008-12-23 2009-01-28 Advanced Composites Group Ltd Curative fibre components
US20120024477A1 (en) 2009-02-06 2012-02-02 Kropp Michael A Room temperature curing epoxy adhesive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170126796A (ko) * 2016-05-10 2017-11-20 닛토덴코 가부시키가이샤 시트, 테이프, 및 반도체 장치의 제조 방법
KR20220016317A (ko) * 2020-07-30 2022-02-09 현대자동차주식회사 구조용 접착제 테이프
US12269974B2 (en) 2020-07-30 2025-04-08 Hyundai Motor Company Structural adhesive tape and method of manufacturing the same

Also Published As

Publication number Publication date
TWI516564B (zh) 2016-01-11
JP2013538271A (ja) 2013-10-10
US20130333838A1 (en) 2013-12-19
CN103201320A (zh) 2013-07-10
CN103201320B (zh) 2015-05-13
WO2012024354A1 (en) 2012-02-23
US9067395B2 (en) 2015-06-30
JP5818893B2 (ja) 2015-11-18
TW201213484A (en) 2012-04-01

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