KR20130132769A - 기반 상에 배치된 리소그래피 시스템과 기반 상에 리소그래피 시스템을 배치하는 방법 - Google Patents

기반 상에 배치된 리소그래피 시스템과 기반 상에 리소그래피 시스템을 배치하는 방법 Download PDF

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Publication number
KR20130132769A
KR20130132769A KR1020137006705A KR20137006705A KR20130132769A KR 20130132769 A KR20130132769 A KR 20130132769A KR 1020137006705 A KR1020137006705 A KR 1020137006705A KR 20137006705 A KR20137006705 A KR 20137006705A KR 20130132769 A KR20130132769 A KR 20130132769A
Authority
KR
South Korea
Prior art keywords
base plate
base
struts
lithographic system
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137006705A
Other languages
English (en)
Korean (ko)
Inventor
예리 페이스터
Original Assignee
마퍼 리쏘그라피 아이피 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마퍼 리쏘그라피 아이피 비.브이. filed Critical 마퍼 리쏘그라피 아이피 비.브이.
Publication of KR20130132769A publication Critical patent/KR20130132769A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/046—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means using combinations of springs of different kinds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Vibration Prevention Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
KR1020137006705A 2010-09-20 2011-09-20 기반 상에 배치된 리소그래피 시스템과 기반 상에 리소그래피 시스템을 배치하는 방법 Withdrawn KR20130132769A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38469010P 2010-09-20 2010-09-20
NL2005374 2010-09-20
NL2005374A NL2005374C2 (en) 2010-09-20 2010-09-20 Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation.
US61/384,690 2010-09-20
PCT/NL2011/050630 WO2012039606A1 (en) 2010-09-20 2011-09-20 Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation

Publications (1)

Publication Number Publication Date
KR20130132769A true KR20130132769A (ko) 2013-12-05

Family

ID=43920813

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137006705A Withdrawn KR20130132769A (ko) 2010-09-20 2011-09-20 기반 상에 배치된 리소그래피 시스템과 기반 상에 리소그래피 시스템을 배치하는 방법

Country Status (6)

Country Link
EP (1) EP2619629A1 (enExample)
JP (1) JP2013543254A (enExample)
KR (1) KR20130132769A (enExample)
NL (1) NL2005374C2 (enExample)
TW (1) TW201217915A (enExample)
WO (1) WO2012039606A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6817621B2 (ja) * 2016-10-25 2021-01-20 株式会社マルテー大塚 道路鋲と、道路鋲の補修方法
US10048599B2 (en) 2016-12-30 2018-08-14 Mapper Lithography Ip B.V. Adjustment assembly and substrate exposure system comprising such an adjustment assembly
EP3563197B1 (en) 2016-12-30 2024-01-31 ASML Netherlands B.V. Substrate exposure system
TWI794964B (zh) * 2021-09-09 2023-03-01 協崑股份有限公司 極紫外光設備（ｅｕｖ）之高精密度承載基座及其實施方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805000A (en) * 1986-01-17 1989-02-14 Matsushita Electric Industrial Co., Ltd. Exposure apparatus
KR100250152B1 (ko) * 1997-11-15 2000-03-15 유무성 노광장치
EP1143492A4 (en) * 1998-09-03 2004-06-02 Nikon Corp EXPOSURE APPARATUS AND METHOD, DEVICE AND METHOD FOR PRODUCING SAID APPARATUS
US6999162B1 (en) * 1998-10-28 2006-02-14 Nikon Corporation Stage device, exposure system, method of device manufacture, and device
JP2001148341A (ja) * 1999-11-19 2001-05-29 Nikon Corp 露光装置
JP2004063653A (ja) * 2002-07-26 2004-02-26 Nikon Corp 防振装置、ステージ装置及び露光装置
TWI307526B (en) * 2002-08-06 2009-03-11 Nikon Corp Supporting device and the mamufacturing method thereof, stage device and exposure device
US20040149881A1 (en) * 2003-01-31 2004-08-05 Allen David S Adjustable support structure for air conditioner and the like
US7460208B2 (en) * 2005-02-18 2008-12-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2009164307A (ja) * 2007-12-28 2009-07-23 Canon Inc 支持構造、露光装置、支持構造の形成方法、及び、デバイス製造方法
US8739383B2 (en) * 2009-04-20 2014-06-03 Nikon Corporation Method and apparatus for aligning mirror blocks of a multi-element mirror assembly

Also Published As

Publication number Publication date
TW201217915A (en) 2012-05-01
JP2013543254A (ja) 2013-11-28
WO2012039606A1 (en) 2012-03-29
WO2012039606A9 (en) 2012-06-28
WO2012039606A4 (en) 2012-05-18
NL2005374C2 (en) 2012-03-22
EP2619629A1 (en) 2013-07-31

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Date Code Title Description
PA0105 International application

Patent event date: 20130315

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid