NL2005374C2 - Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation. - Google Patents

Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation. Download PDF

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Publication number
NL2005374C2
NL2005374C2 NL2005374A NL2005374A NL2005374C2 NL 2005374 C2 NL2005374 C2 NL 2005374C2 NL 2005374 A NL2005374 A NL 2005374A NL 2005374 A NL2005374 A NL 2005374A NL 2005374 C2 NL2005374 C2 NL 2005374C2
Authority
NL
Netherlands
Prior art keywords
base plate
foundation
supports
resin material
lithography system
Prior art date
Application number
NL2005374A
Other languages
English (en)
Dutch (nl)
Inventor
Jerry Peijster
Original Assignee
Mapper Lithography Ip Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithography Ip Bv filed Critical Mapper Lithography Ip Bv
Priority to NL2005374A priority Critical patent/NL2005374C2/en
Priority to JP2013529091A priority patent/JP2013543254A/ja
Priority to TW100133722A priority patent/TW201217915A/zh
Priority to PCT/NL2011/050630 priority patent/WO2012039606A1/en
Priority to KR1020137006705A priority patent/KR20130132769A/ko
Priority to EP11761728.2A priority patent/EP2619629A1/en
Application granted granted Critical
Publication of NL2005374C2 publication Critical patent/NL2005374C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/046—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means using combinations of springs of different kinds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Vibration Prevention Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
NL2005374A 2010-09-20 2010-09-20 Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation. NL2005374C2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL2005374A NL2005374C2 (en) 2010-09-20 2010-09-20 Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation.
JP2013529091A JP2013543254A (ja) 2010-09-20 2011-09-20 基礎上に配置されるリソグラフィシステム、及び基礎上にリソグラフィシステムを配置する方法
TW100133722A TW201217915A (en) 2010-09-20 2011-09-20 Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
PCT/NL2011/050630 WO2012039606A1 (en) 2010-09-20 2011-09-20 Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
KR1020137006705A KR20130132769A (ko) 2010-09-20 2011-09-20 기반 상에 배치된 리소그래피 시스템과 기반 상에 리소그래피 시스템을 배치하는 방법
EP11761728.2A EP2619629A1 (en) 2010-09-20 2011-09-20 Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2005374 2010-09-20
NL2005374A NL2005374C2 (en) 2010-09-20 2010-09-20 Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation.

Publications (1)

Publication Number Publication Date
NL2005374C2 true NL2005374C2 (en) 2012-03-22

Family

ID=43920813

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2005374A NL2005374C2 (en) 2010-09-20 2010-09-20 Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation.

Country Status (6)

Country Link
EP (1) EP2619629A1 (enExample)
JP (1) JP2013543254A (enExample)
KR (1) KR20130132769A (enExample)
NL (1) NL2005374C2 (enExample)
TW (1) TW201217915A (enExample)
WO (1) WO2012039606A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6817621B2 (ja) * 2016-10-25 2021-01-20 株式会社マルテー大塚 道路鋲と、道路鋲の補修方法
US10048599B2 (en) 2016-12-30 2018-08-14 Mapper Lithography Ip B.V. Adjustment assembly and substrate exposure system comprising such an adjustment assembly
EP3563197B1 (en) 2016-12-30 2024-01-31 ASML Netherlands B.V. Substrate exposure system
TWI794964B (zh) * 2021-09-09 2023-03-01 協崑股份有限公司 極紫外光設備（ｅｕｖ）之高精密度承載基座及其實施方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805000A (en) * 1986-01-17 1989-02-14 Matsushita Electric Industrial Co., Ltd. Exposure apparatus
EP1143492A1 (en) * 1998-09-03 2001-10-10 Nikon Corporation Exposure apparatus and exposure method, and device and method for producing the same
US20040149881A1 (en) * 2003-01-31 2004-08-05 Allen David S Adjustable support structure for air conditioner and the like
US20100263192A1 (en) * 2009-04-20 2010-10-21 Nikon Corporation Multi-Element Mirror Assembly and Alignment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100250152B1 (ko) * 1997-11-15 2000-03-15 유무성 노광장치
US6999162B1 (en) * 1998-10-28 2006-02-14 Nikon Corporation Stage device, exposure system, method of device manufacture, and device
JP2001148341A (ja) * 1999-11-19 2001-05-29 Nikon Corp 露光装置
JP2004063653A (ja) * 2002-07-26 2004-02-26 Nikon Corp 防振装置、ステージ装置及び露光装置
TWI307526B (en) * 2002-08-06 2009-03-11 Nikon Corp Supporting device and the mamufacturing method thereof, stage device and exposure device
US7460208B2 (en) * 2005-02-18 2008-12-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2009164307A (ja) * 2007-12-28 2009-07-23 Canon Inc 支持構造、露光装置、支持構造の形成方法、及び、デバイス製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805000A (en) * 1986-01-17 1989-02-14 Matsushita Electric Industrial Co., Ltd. Exposure apparatus
EP1143492A1 (en) * 1998-09-03 2001-10-10 Nikon Corporation Exposure apparatus and exposure method, and device and method for producing the same
US20040149881A1 (en) * 2003-01-31 2004-08-05 Allen David S Adjustable support structure for air conditioner and the like
US20100263192A1 (en) * 2009-04-20 2010-10-21 Nikon Corporation Multi-Element Mirror Assembly and Alignment

Also Published As

Publication number Publication date
TW201217915A (en) 2012-05-01
JP2013543254A (ja) 2013-11-28
WO2012039606A1 (en) 2012-03-29
WO2012039606A9 (en) 2012-06-28
WO2012039606A4 (en) 2012-05-18
KR20130132769A (ko) 2013-12-05
EP2619629A1 (en) 2013-07-31

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MM Lapsed because of non-payment of the annual fee

Effective date: 20171001