KR20130115208A - 웨이퍼 지지 시스템을 위한 광학적으로 조정된 금속화된 광-열 변환층 - Google Patents
웨이퍼 지지 시스템을 위한 광학적으로 조정된 금속화된 광-열 변환층 Download PDFInfo
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- KR20130115208A KR20130115208A KR1020137000781A KR20137000781A KR20130115208A KR 20130115208 A KR20130115208 A KR 20130115208A KR 1020137000781 A KR1020137000781 A KR 1020137000781A KR 20137000781 A KR20137000781 A KR 20137000781A KR 20130115208 A KR20130115208 A KR 20130115208A
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Classifications
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- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35532410P | 2010-06-16 | 2010-06-16 | |
| US61/355,324 | 2010-06-16 | ||
| PCT/US2011/038281 WO2011159456A2 (en) | 2010-06-16 | 2011-05-27 | Optically tuned metalized light to heat conversion layer for wafer support system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130115208A true KR20130115208A (ko) | 2013-10-21 |
Family
ID=45348789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137000781A Withdrawn KR20130115208A (ko) | 2010-06-16 | 2011-05-27 | 웨이퍼 지지 시스템을 위한 광학적으로 조정된 금속화된 광-열 변환층 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20130087959A1 (enExample) |
| JP (1) | JP2013534721A (enExample) |
| KR (1) | KR20130115208A (enExample) |
| TW (1) | TWI523142B (enExample) |
| WO (1) | WO2011159456A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180137327A (ko) * | 2017-06-16 | 2018-12-27 | 울산과학기술원 | 광 열전 소자용 구조체 및 그 제조방법과 그를 이용한 광 열전 소자 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5735774B2 (ja) * | 2010-09-30 | 2015-06-17 | 芝浦メカトロニクス株式会社 | 保護体、基板積層体、貼り合わせ装置、剥離装置、および基板の製造方法 |
| JP6088230B2 (ja) * | 2012-12-05 | 2017-03-01 | 東京応化工業株式会社 | 積層体の形成方法 |
| DE102013100711B4 (de) * | 2013-01-24 | 2021-07-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl optoelektronischer Bauelemente |
| TWI576190B (zh) | 2013-08-01 | 2017-04-01 | Ibm | 使用中段波長紅外光輻射燒蝕之晶圓剝離 |
| EP2908335B1 (en) | 2014-02-14 | 2020-04-15 | ams AG | Dicing method |
| KR20160064031A (ko) * | 2014-11-27 | 2016-06-07 | 어드밴스 프로세스 인테그레이트 테크놀로지 리미티드 | 웨이퍼 기판을 사용하지 않는 인터포저층의 제작 방법 |
| US10074626B2 (en) | 2016-06-06 | 2018-09-11 | Shin-Etsu Chemical Co., Ltd. | Wafer laminate and making method |
| JP2017224718A (ja) * | 2016-06-15 | 2017-12-21 | 日本電信電話株式会社 | 半導体デバイスのガラス基板固定方法及び剥離方法 |
| JP6791086B2 (ja) | 2016-10-11 | 2020-11-25 | 信越化学工業株式会社 | ウエハ積層体、その製造方法、及びウエハ積層用接着剤組成物 |
| JP6614090B2 (ja) | 2016-10-11 | 2019-12-04 | 信越化学工業株式会社 | ウエハ積層体及びその製造方法 |
| JP7035915B2 (ja) | 2018-09-03 | 2022-03-15 | 信越化学工業株式会社 | 薄型ウエハの製造方法 |
| TWI844589B (zh) * | 2018-11-29 | 2024-06-11 | 日商力森諾科股份有限公司 | 製造半導體裝置的方法、光吸收積層體及暫時固定用積層體 |
| JP7597025B2 (ja) * | 2019-05-22 | 2024-12-10 | 株式会社レゾナック | 半導体装置を製造する方法 |
| KR102713057B1 (ko) * | 2019-10-18 | 2024-10-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착 필름 |
| US11996384B2 (en) * | 2020-12-15 | 2024-05-28 | Pulseforge, Inc. | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications |
| US11908723B2 (en) | 2021-12-03 | 2024-02-20 | International Business Machines Corporation | Silicon handler with laser-release layers |
| KR20250006814A (ko) | 2022-06-03 | 2025-01-13 | 에베 그룹 에. 탈너 게엠베하 | 접착을 위한 얇은 층으로 구성된 다층 시스템 |
| JP2023181886A (ja) * | 2022-06-13 | 2023-12-25 | 日東電工株式会社 | 電子部品仮固定用粘着シート |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2686511B2 (ja) * | 1989-05-31 | 1997-12-08 | 日東電工株式会社 | 半導体ウエハ保護フィルムの剥離方法 |
| JP3809681B2 (ja) * | 1996-08-27 | 2006-08-16 | セイコーエプソン株式会社 | 剥離方法 |
| US7534498B2 (en) * | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
| JP4565804B2 (ja) * | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
| JP2005209829A (ja) * | 2004-01-22 | 2005-08-04 | Taiyo Yuden Co Ltd | 半導体ウェハ固定方法及び装置、並びに半導体ウェハが固定された構造体 |
| JP2006013000A (ja) * | 2004-06-23 | 2006-01-12 | Sekisui Chem Co Ltd | Ｉｃチップの製造方法 |
| JP4387297B2 (ja) * | 2004-12-28 | 2009-12-16 | シャープ株式会社 | メモリ素子、記録層に対する記録方法、及び記録装置 |
| JP4200458B2 (ja) * | 2006-05-10 | 2008-12-24 | ソニー株式会社 | 薄膜トランジスタの製造方法 |
| JP4932758B2 (ja) * | 2008-02-06 | 2012-05-16 | 富士フイルム株式会社 | 発光デバイス及びその製造方法 |
| JP4934620B2 (ja) * | 2008-03-25 | 2012-05-16 | 古河電気工業株式会社 | ウエハ加工用テープ |
| JP5252283B2 (ja) * | 2008-10-15 | 2013-07-31 | 富士電機株式会社 | 半導体装置の製造方法及びそのための装置 |
| JP5257314B2 (ja) * | 2009-09-29 | 2013-08-07 | 大日本印刷株式会社 | 積層体、準備用支持体、積層体の製造方法、及びデバイスの製造方法 |
| JP2010056562A (ja) * | 2009-11-26 | 2010-03-11 | Nitto Denko Corp | 半導体チップの製造方法 |
-
2011
- 2011-05-27 WO PCT/US2011/038281 patent/WO2011159456A2/en not_active Ceased
- 2011-05-27 JP JP2013515360A patent/JP2013534721A/ja active Pending
- 2011-05-27 KR KR1020137000781A patent/KR20130115208A/ko not_active Withdrawn
- 2011-05-27 US US13/704,146 patent/US20130087959A1/en not_active Abandoned
- 2011-06-09 TW TW100120252A patent/TWI523142B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180137327A (ko) * | 2017-06-16 | 2018-12-27 | 울산과학기술원 | 광 열전 소자용 구조체 및 그 제조방법과 그를 이용한 광 열전 소자 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011159456A2 (en) | 2011-12-22 |
| TW201222713A (en) | 2012-06-01 |
| TWI523142B (zh) | 2016-02-21 |
| US20130087959A1 (en) | 2013-04-11 |
| JP2013534721A (ja) | 2013-09-05 |
| WO2011159456A3 (en) | 2012-04-05 |
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Patent event date: 20130111 Patent event code: PA01051R01D Comment text: International Patent Application |
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