KR20130114184A - 리플로우 납땜 장치 및 방법 - Google Patents

리플로우 납땜 장치 및 방법 Download PDF

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Publication number
KR20130114184A
KR20130114184A KR1020137015766A KR20137015766A KR20130114184A KR 20130114184 A KR20130114184 A KR 20130114184A KR 1020137015766 A KR1020137015766 A KR 1020137015766A KR 20137015766 A KR20137015766 A KR 20137015766A KR 20130114184 A KR20130114184 A KR 20130114184A
Authority
KR
South Korea
Prior art keywords
chamber
substrate
decompression chamber
blower
board
Prior art date
Application number
KR1020137015766A
Other languages
English (en)
Korean (ko)
Inventor
야츠하루 요코타
Original Assignee
유겐가이샤 요코타테쿠니카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010283093A external-priority patent/JP5801047B2/ja
Application filed by 유겐가이샤 요코타테쿠니카 filed Critical 유겐가이샤 요코타테쿠니카
Publication of KR20130114184A publication Critical patent/KR20130114184A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020137015766A 2010-12-20 2011-12-16 리플로우 납땜 장치 및 방법 KR20130114184A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-283093 2010-12-20
JP2010283093A JP5801047B2 (ja) 2010-01-19 2010-12-20 リフロー半田付け装置及び方法
PCT/JP2011/079146 WO2012086533A1 (ja) 2010-12-20 2011-12-16 リフロー半田付け装置及び方法

Publications (1)

Publication Number Publication Date
KR20130114184A true KR20130114184A (ko) 2013-10-16

Family

ID=46318743

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015766A KR20130114184A (ko) 2010-12-20 2011-12-16 리플로우 납땜 장치 및 방법

Country Status (4)

Country Link
KR (1) KR20130114184A (ja)
CN (1) CN103262670B (ja)
DE (1) DE112011104460B4 (ja)
WO (1) WO2012086533A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101481404B1 (ko) * 2013-10-30 2015-01-21 비케이전자 주식회사 인라인 메거진 진공 리플로우 장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9161459B2 (en) * 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
CN106378508B (zh) * 2016-11-22 2019-03-08 上海无线电设备研究所 一种适用于纳米复合焊料的真空焊接方法
CN107124835B (zh) * 2017-05-25 2019-08-30 杭州晶志康电子科技有限公司 回流焊贴片工艺
CN107222982B (zh) * 2017-05-25 2019-09-03 杭州晶志康电子科技有限公司 一种smt贴片工艺
EP3637966B1 (en) * 2017-06-05 2022-03-16 Senju Metal Industry Co., Ltd Soldering device
CN111375857B (zh) * 2020-04-10 2021-12-17 柳州市易昇热导技术有限公司 一种双层复合式水箱的钎焊方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2772699B2 (ja) * 1990-03-07 1998-07-02 日本真空技術株式会社 真空熱処理装置
JPH06226484A (ja) * 1993-02-04 1994-08-16 Koyo Rindobaagu Kk 熱処理装置
JP4041628B2 (ja) 1998-10-13 2008-01-30 松下電器産業株式会社 加熱装置と加熱方法
JP2004181483A (ja) * 2002-12-03 2004-07-02 Senju Metal Ind Co Ltd リフロー炉
JP2009226456A (ja) * 2008-03-24 2009-10-08 Toyota Motor Corp 接合構造体の製造方法および接合装置
JP5075806B2 (ja) * 2008-12-25 2012-11-21 有限会社ヨコタテクニカ リフロー半田付け装置
JP5343566B2 (ja) 2009-01-08 2013-11-13 富士通株式会社 接合方法及びリフロー装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101481404B1 (ko) * 2013-10-30 2015-01-21 비케이전자 주식회사 인라인 메거진 진공 리플로우 장치

Also Published As

Publication number Publication date
DE112011104460T5 (de) 2013-09-19
CN103262670A (zh) 2013-08-21
WO2012086533A1 (ja) 2012-06-28
CN103262670B (zh) 2016-05-25
DE112011104460B4 (de) 2023-10-12

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E601 Decision to refuse application