KR20130099099A - 3족 질화물계 녹색-레이저 다이오드 및 그 도파로 구조체 - Google Patents
3족 질화물계 녹색-레이저 다이오드 및 그 도파로 구조체 Download PDFInfo
- Publication number
- KR20130099099A KR20130099099A KR1020137009407A KR20137009407A KR20130099099A KR 20130099099 A KR20130099099 A KR 20130099099A KR 1020137009407 A KR1020137009407 A KR 1020137009407A KR 20137009407 A KR20137009407 A KR 20137009407A KR 20130099099 A KR20130099099 A KR 20130099099A
- Authority
- KR
- South Korea
- Prior art keywords
- waveguide layer
- layer
- thickness
- side waveguide
- cladding layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000004767 nitrides Chemical class 0.000 title claims abstract description 49
- 238000005253 cladding Methods 0.000 claims abstract description 131
- 229910052738 indium Inorganic materials 0.000 claims abstract description 94
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 433
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 21
- 230000008859 change Effects 0.000 claims description 16
- 230000004888 barrier function Effects 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims 2
- 229910002704 AlGaN Inorganic materials 0.000 claims 1
- 239000012792 core layer Substances 0.000 claims 1
- 239000002019 doping agent Substances 0.000 abstract description 10
- 229910002601 GaN Inorganic materials 0.000 description 41
- 239000000370 acceptor Substances 0.000 description 39
- 239000000463 material Substances 0.000 description 18
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 230000008901 benefit Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 125000002524 organometallic group Chemical group 0.000 description 3
- 229910002059 quaternary alloy Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910002058 ternary alloy Inorganic materials 0.000 description 3
- -1 InN) comprise GaN Chemical compound 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 230000004807 localization Effects 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 1
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2031—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers characterized by special waveguide layers, e.g. asymmetric waveguide layers or defined bandgap discontinuities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/885,951 | 2010-09-20 | ||
| US12/885,951 US8897329B2 (en) | 2010-09-20 | 2010-09-20 | Group III nitride-based green-laser diodes and waveguide structures thereof |
| PCT/US2011/051343 WO2012039997A2 (en) | 2010-09-20 | 2011-09-13 | Group iii nitride-based green-laser diodes and waveguide structures thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130099099A true KR20130099099A (ko) | 2013-09-05 |
Family
ID=44674908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137009407A Withdrawn KR20130099099A (ko) | 2010-09-20 | 2011-09-13 | 3족 질화물계 녹색-레이저 다이오드 및 그 도파로 구조체 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8897329B2 (enExample) |
| JP (1) | JP2013541209A (enExample) |
| KR (1) | KR20130099099A (enExample) |
| CN (1) | CN103119809B (enExample) |
| TW (1) | TW201220628A (enExample) |
| WO (1) | WO2012039997A2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8379684B1 (en) * | 2011-08-16 | 2013-02-19 | Corning Incorporated | Hole blocking layers in non-polar and semi-polar green light emitting devices |
| US20130322481A1 (en) * | 2012-05-31 | 2013-12-05 | Rajaram Bhat | Laser diodes including substrates having semipolar surface plane orientations and nonpolar cleaved facets |
| CN102723995B (zh) * | 2012-07-11 | 2015-12-09 | 东莞铭普光磁股份有限公司 | 一种有源光模块控制器 |
| JP5781032B2 (ja) * | 2012-07-30 | 2015-09-16 | 株式会社東芝 | 半導体発光素子 |
| US20140077153A1 (en) * | 2012-09-14 | 2014-03-20 | Tsmc Solid State Lighting Ltd. | Photonic Devices with Embedded Hole Injection Layer to Improve Efficiency and Droop Rate |
| DE102012220911A1 (de) * | 2012-09-27 | 2014-05-15 | Osram Opto Semiconductors Gmbh | Halbleiterlaser mit verbesserter Stromführung |
| TWI535055B (zh) | 2012-11-19 | 2016-05-21 | 新世紀光電股份有限公司 | 氮化物半導體結構及半導體發光元件 |
| US10153394B2 (en) | 2012-11-19 | 2018-12-11 | Genesis Photonics Inc. | Semiconductor structure |
| TWI524551B (zh) | 2012-11-19 | 2016-03-01 | 新世紀光電股份有限公司 | 氮化物半導體結構及半導體發光元件 |
| JP6255939B2 (ja) * | 2012-11-27 | 2018-01-10 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| DE102014111058A1 (de) * | 2014-08-04 | 2016-02-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
| TWI738640B (zh) * | 2016-03-08 | 2021-09-11 | 新世紀光電股份有限公司 | 半導體結構 |
| TWI717386B (zh) | 2016-09-19 | 2021-02-01 | 新世紀光電股份有限公司 | 含氮半導體元件 |
| CN107093628B (zh) * | 2017-04-07 | 2019-12-06 | 电子科技大学 | 一种极化掺杂增强型hemt器件 |
| WO2019002694A1 (en) * | 2017-06-30 | 2019-01-03 | Oulun Yliopisto | METHOD FOR MANUFACTURING SEMICONDUCTOR OPTICAL APPARATUS AND APPARATUS |
| EP3804055B1 (en) * | 2018-05-30 | 2024-07-03 | NLIGHT, Inc. | Large optical cavity (loc) laser diode having quantum well offset and efficient single mode laser emission along fast axis |
| CN111697428B (zh) * | 2020-06-16 | 2021-08-10 | 东莞理工学院 | 一种氮化镓基激光二极管外延结构及其制备方法 |
| JPWO2022202448A1 (enExample) * | 2021-03-24 | 2022-09-29 | ||
| CN114006266B (zh) * | 2021-10-12 | 2023-10-13 | 厦门三安光电有限公司 | 激光二极管 |
| WO2024091031A1 (ko) * | 2022-10-27 | 2024-05-02 | 주식회사 소프트에피 | 3족 질화물 반도체 발광소자 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5048038A (en) * | 1990-01-25 | 1991-09-10 | The United States Of America As Represented By The United States Department Of Energy | Ion-implanted planar-buried-heterostructure diode laser |
| US5751752A (en) * | 1994-09-14 | 1998-05-12 | Rohm Co., Ltd. | Semiconductor light emitting device and manufacturing method therefor |
| JP3372226B2 (ja) * | 1999-02-10 | 2003-01-27 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| CN1254869C (zh) | 2001-03-28 | 2006-05-03 | 日亚化学工业株式会社 | 氮化物半导体元件 |
| US6977953B2 (en) * | 2001-07-27 | 2005-12-20 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor light-emitting device and method of fabricating the same |
| US6724013B2 (en) | 2001-12-21 | 2004-04-20 | Xerox Corporation | Edge-emitting nitride-based laser diode with p-n tunnel junction current injection |
| US7279751B2 (en) | 2004-06-21 | 2007-10-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and manufacturing method thereof |
| US7751455B2 (en) * | 2004-12-14 | 2010-07-06 | Palo Alto Research Center Incorporated | Blue and green laser diodes with gallium nitride or indium gallium nitride cladding laser structure |
| KR100701006B1 (ko) * | 2005-05-31 | 2007-03-29 | 한국전자통신연구원 | 포물선 도파로형 평행광 렌즈 및 이를 포함한 파장 가변외부 공진 레이저 다이오드 |
| KR20070000290A (ko) * | 2005-06-27 | 2007-01-02 | 삼성전자주식회사 | 비대칭 광도파층을 지닌 반도체 레이저 다이오드 |
| KR100837404B1 (ko) | 2006-10-18 | 2008-06-12 | 삼성전자주식회사 | 반도체 광전 소자 |
| JP2008177213A (ja) | 2007-01-16 | 2008-07-31 | Toshiba Corp | 半導体レーザ装置 |
| JP2009059797A (ja) * | 2007-08-30 | 2009-03-19 | Sharp Corp | 窒化物半導体レーザ素子 |
| JP2009164233A (ja) * | 2007-12-28 | 2009-07-23 | Rohm Co Ltd | 窒化物半導体レーザ素子およびその製造方法 |
| JP4720834B2 (ja) * | 2008-02-25 | 2011-07-13 | 住友電気工業株式会社 | Iii族窒化物半導体レーザ |
| JP2009246005A (ja) | 2008-03-28 | 2009-10-22 | Furukawa Electric Co Ltd:The | 半導体発光素子 |
| JP2010109332A (ja) * | 2008-09-30 | 2010-05-13 | Sanyo Electric Co Ltd | 半導体レーザ装置および表示装置 |
| US8084763B2 (en) * | 2008-10-31 | 2011-12-27 | The Regents Of The University Of California | Optoelectronic device based on non-polar and semi-polar aluminum indium nitride and aluminum indium gallium nitride alloys |
| JP4912386B2 (ja) * | 2008-11-26 | 2012-04-11 | シャープ株式会社 | InGaN層の製造方法 |
| JP5316276B2 (ja) * | 2009-01-23 | 2013-10-16 | 住友電気工業株式会社 | 窒化物半導体発光素子、エピタキシャル基板、及び窒化物半導体発光素子を作製する方法 |
-
2010
- 2010-09-20 US US12/885,951 patent/US8897329B2/en not_active Expired - Fee Related
-
2011
- 2011-09-13 WO PCT/US2011/051343 patent/WO2012039997A2/en not_active Ceased
- 2011-09-13 KR KR1020137009407A patent/KR20130099099A/ko not_active Withdrawn
- 2011-09-13 CN CN201180045031.3A patent/CN103119809B/zh not_active Expired - Fee Related
- 2011-09-13 JP JP2013530187A patent/JP2013541209A/ja active Pending
- 2011-09-15 TW TW100133249A patent/TW201220628A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US8897329B2 (en) | 2014-11-25 |
| CN103119809B (zh) | 2015-09-16 |
| CN103119809A (zh) | 2013-05-22 |
| WO2012039997A3 (en) | 2012-10-04 |
| WO2012039997A2 (en) | 2012-03-29 |
| JP2013541209A (ja) | 2013-11-07 |
| US20120069863A1 (en) | 2012-03-22 |
| TW201220628A (en) | 2012-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20130412 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |