KR20130079315A - 도전성 페이스트용 구리분 및 도전성 페이스트 - Google Patents

도전성 페이스트용 구리분 및 도전성 페이스트 Download PDF

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Publication number
KR20130079315A
KR20130079315A KR1020127021007A KR20127021007A KR20130079315A KR 20130079315 A KR20130079315 A KR 20130079315A KR 1020127021007 A KR1020127021007 A KR 1020127021007A KR 20127021007 A KR20127021007 A KR 20127021007A KR 20130079315 A KR20130079315 A KR 20130079315A
Authority
KR
South Korea
Prior art keywords
copper powder
concentration
electrically conductive
atm
conductive paste
Prior art date
Application number
KR1020127021007A
Other languages
English (en)
Korean (ko)
Inventor
고유 오타
다쿠야 사사키
가츠히코 요시마루
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20130079315A publication Critical patent/KR20130079315A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020127021007A 2010-05-19 2011-03-01 도전성 페이스트용 구리분 및 도전성 페이스트 KR20130079315A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-115024 2010-05-19
JP2010115024 2010-05-19
PCT/JP2011/054598 WO2011145378A1 (ja) 2010-05-19 2011-03-01 導電性ペースト用銅粉及び導電性ペースト

Publications (1)

Publication Number Publication Date
KR20130079315A true KR20130079315A (ko) 2013-07-10

Family

ID=44991496

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127021007A KR20130079315A (ko) 2010-05-19 2011-03-01 도전성 페이스트용 구리분 및 도전성 페이스트

Country Status (4)

Country Link
JP (1) JP5932638B2 (ja)
KR (1) KR20130079315A (ja)
TW (1) TWI432588B (ja)
WO (1) WO2011145378A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5598739B2 (ja) 2012-05-18 2014-10-01 株式会社マテリアル・コンセプト 導電性ペースト
US10773311B2 (en) 2015-09-03 2020-09-15 Dowa Electronics Materials Co., Ltd. Phosphorus-containing copper powder and method for producing the same
JP6854114B2 (ja) * 2016-01-04 2021-04-07 Ｊｘ金属株式会社 表面処理銅箔
CN105834418B (zh) * 2016-03-17 2018-01-05 西安工程大学 一种电子浆料中铜粉的乙基纤维素微胶囊处理方法
JP7008076B2 (ja) * 2017-08-21 2022-02-10 Ｊｘ金属株式会社 積層造形用銅合金粉末、積層造形物の製造方法及び積層造形物
CN110578070B (zh) * 2019-10-30 2021-04-13 吉林大学 一种自生非金属氧化物复合膜提高铜抗氧化能力的方法
WO2024090449A1 (ja) * 2022-10-24 2024-05-02 三菱マテリアル株式会社 金属ａｍ銅合金粉末および積層造形物の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3690552B2 (ja) * 1997-05-02 2005-08-31 株式会社アルバック 金属ペーストの焼成方法
JP2000328232A (ja) * 1999-05-18 2000-11-28 Nisshin Steel Co Ltd 導電性粉末およびその製造方法並びにそれを使用した塗料
JP2004263205A (ja) * 2003-01-31 2004-09-24 Toho Titanium Co Ltd 金属微粉末およびその製造方法ならびにこの金属微粉末を用いた導電ペースト
JP2009079269A (ja) * 2007-09-26 2009-04-16 Dowa Electronics Materials Co Ltd 導電性ペースト用銅粉およびその製造方法、並びに、導電性ペースト
JP5405814B2 (ja) * 2007-12-28 2014-02-05 三井金属鉱業株式会社 導電性ペースト用銅粉及び導電性ペースト
WO2010004852A1 (ja) * 2008-07-11 2010-01-14 三井金属鉱業株式会社 導電性ペースト用銅粉及び導電性ペースト

Also Published As

Publication number Publication date
JP5932638B2 (ja) 2016-06-08
JPWO2011145378A1 (ja) 2013-07-22
TWI432588B (zh) 2014-04-01
TW201211283A (en) 2012-03-16
WO2011145378A1 (ja) 2011-11-24

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application