KR20130069591A - 봉공처리제 및 봉공처리 방법 - Google Patents
봉공처리제 및 봉공처리 방법 Download PDFInfo
- Publication number
- KR20130069591A KR20130069591A KR1020127027696A KR20127027696A KR20130069591A KR 20130069591 A KR20130069591 A KR 20130069591A KR 1020127027696 A KR1020127027696 A KR 1020127027696A KR 20127027696 A KR20127027696 A KR 20127027696A KR 20130069591 A KR20130069591 A KR 20130069591A
- Authority
- KR
- South Korea
- Prior art keywords
- sealing agent
- sealing
- ppm
- gold
- gold plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010113545A JP5740727B2 (ja) | 2010-05-17 | 2010-05-17 | 封孔処理剤および封孔処理方法 |
JPJP-P-2010-113545 | 2010-05-17 | ||
PCT/JP2011/060951 WO2011145508A1 (ja) | 2010-05-17 | 2011-05-12 | 封孔処理剤および封孔処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130069591A true KR20130069591A (ko) | 2013-06-26 |
Family
ID=44991614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127027696A KR20130069591A (ko) | 2010-05-17 | 2011-05-12 | 봉공처리제 및 봉공처리 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5740727B2 (ja) |
KR (1) | KR20130069591A (ja) |
CN (1) | CN102906312A (ja) |
TW (1) | TW201207154A (ja) |
WO (1) | WO2011145508A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015012306A1 (ja) * | 2013-07-24 | 2015-01-29 | Jx日鉱日石金属株式会社 | 電子部品およびその製造方法 |
CN103606688B (zh) * | 2013-12-02 | 2015-08-19 | 新源动力股份有限公司 | 一种燃料电池金属双极板板表面改性层的无微孔处理方法 |
CN108977868A (zh) * | 2017-05-31 | 2018-12-11 | 比亚迪股份有限公司 | 一种7系铝合金封孔方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311489A (ja) * | 1991-12-25 | 1993-11-22 | Nikko Kinzoku Kk | 金めっき材の封孔処理方法 |
JP2951462B2 (ja) * | 1991-12-25 | 1999-09-20 | 日鉱金属株式会社 | 金めっき材の封孔処理方法 |
JP2717063B2 (ja) * | 1994-03-24 | 1998-02-18 | 日鉱金属株式会社 | 金めっき材の封孔処理方法 |
JP2717062B2 (ja) * | 1994-03-24 | 1998-02-18 | 日鉱金属株式会社 | 金めっき材の封孔処理方法 |
-
2010
- 2010-05-17 JP JP2010113545A patent/JP5740727B2/ja active Active
-
2011
- 2011-05-12 KR KR1020127027696A patent/KR20130069591A/ko not_active Application Discontinuation
- 2011-05-12 WO PCT/JP2011/060951 patent/WO2011145508A1/ja active Application Filing
- 2011-05-12 CN CN2011800244797A patent/CN102906312A/zh active Pending
- 2011-05-16 TW TW100117016A patent/TW201207154A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201207154A (en) | 2012-02-16 |
WO2011145508A1 (ja) | 2011-11-24 |
CN102906312A (zh) | 2013-01-30 |
JP2011241428A (ja) | 2011-12-01 |
JP5740727B2 (ja) | 2015-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0085701A1 (en) | ARTICLE CONTAINING COPPER WITH CORROSION INHIBITOR PROTECTIVE LAYER AND METHOD FOR PRODUCING THE LAYER. | |
JP2002100718A (ja) | 半導体装置用リードフレーム及びその製造方法及びそれを用いた半導体装置 | |
JP6603756B2 (ja) | 環境に優しいニッケル電気めっき組成物及び方法 | |
CN102098880B (zh) | 一种印刷线路板的表面处理方法 | |
KR20130069591A (ko) | 봉공처리제 및 봉공처리 방법 | |
JP6192181B2 (ja) | 電子部品およびその製造方法 | |
CN111519223A (zh) | 应用于电连接器的表面电镀方法及电连接器 | |
Lee et al. | Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition | |
JP6603755B2 (ja) | 環境に優しいニッケル電気めっき組成物及び方法 | |
JP6114770B2 (ja) | 銅合金材のスズめっき方法 | |
JP6926291B2 (ja) | 金属端子及びその製造方法 | |
JP5098627B2 (ja) | 電子部品及びその製造方法 | |
JP5478708B2 (ja) | 間隙腐食から保護するための有機ポリマーコーティング | |
EP2180081A1 (en) | Post-treatment composition for increasing corrosion resistance of metal or metal alloy surfaces | |
JP5117796B2 (ja) | 化学研磨剤及びその化学研磨剤を用いてめっき前処理した銅又は銅合金を用いる金属めっき方法 | |
JP6370658B2 (ja) | 電子部品のNiめっき膜の酸化防止剤、電子部品、および電子部品の製造方法 | |
Xu et al. | Creep corrosion of OSP and ImAg PWB finishes | |
JP5715088B2 (ja) | 銅のエッチング方法 | |
JP6012393B2 (ja) | 銅の表面処理剤および表面処理方法 | |
JP2015067853A (ja) | 電子部品およびその製造方法 | |
JP2000017483A (ja) | 腐食防止膜の形成方法 | |
JP2014047396A (ja) | 金属の表面処理剤及び表面処理方法 | |
JP2005179765A (ja) | 銅及び銅合金の表面処理剤 | |
JP2007217798A (ja) | コネクタ用接続端子の表面処理方法 | |
TH81173B (th) | วิธีการเคลือบสับสเตรตที่มีสารประกอบแอนติโมนีโดยใช้ดีบุกและโลหะผสมดีบุก |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |