KR20120120278A - Manufacturing method for contact for current inspection jig, contact for current inspection jig manufactured using said method, and current inspection jig provided with said contact - Google Patents

Abstract

A very thin, thin, energized inspection jig contactor having a spring structure is manufactured with higher precision and more precision. After forming a plating layer of gold or gold alloy on the outer circumference of the core material, forming a Ni electroforming layer on the outer circumference of the formed plating layer by electroforming and forming a resist layer on the outer circumference of the Ni electroforming layer, and then exposing with a laser. Forming a spiral groove in the resist layer, etching using the resist layer as a masking material, removing a Ni electroforming layer in a portion where the spiral groove is formed in the resist layer, and removing the resist layer; In addition, the plating layer of the spiral groove portion from which the Ni electrode layer is removed is removed, and only the core material is removed while leaving the plating layer on the inner circumference of the Ni electrode layer.

Description

MANUFACTURING METHOD FOR CONTACT FOR CURRENT INSPECTION JIG, CONTACT FOR CURRENT INSPECTION JIG MANUFACTURED USING SAID METHOD, AND CURRENT INSPECTION JIG PROVIDED WITH SAID CONTACT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an energization inspection jig for use in an energization inspection device, and more particularly, to a contactor for an energization inspection jig disposed in an energization inspection jig and elastically contacting a specimen to be energized.

An energization test has been conventionally performed in various technical fields. Examples of conduction inspections include semiconductor integrated circuits, electronic device substrates such as flat panel displays (FPDs), and circuit wiring boards. As these miniaturization, high density, and high performance are in progress, microminiaturization and miniaturization are also required for contacts for energization inspection jigs, such as contact probes, which are disposed in the energization inspection jig used for energization inspection and elastically contact the specimen.

The inventors of the present application propose a Ni electroforming pipe having a spring structure in part as a contactor for an energization inspection jig corresponding to such miniaturization and miniaturization (Patent Document 1).

The Ni pole pipe provided with a part of the spring structure of patent document 1 is 32 micrometers-500 micrometers in outer diameter, and 30 micrometers-450 micrometers in inner diameter can show a thin, thin, and high elasticity characteristic. This is manufactured by applying the manufacturing method (patent document 2) of the electric pipe which the inventors of this application propose.

In the ultrafine spring structure, a resist layer is formed on the outer periphery of the hollow ultrafine pipe, and an exposure beam is directed to the resist layer to form a spiral groove having a uniform groove width in the resist layer. A manufacturing method is proposed in which a masking material is etched to remove the ultrafine pipe walls of portions where the grooves are formed (Patent Document 3).

Japanese Laid-Open Patent Publication 2008-25833 Japanese Unexamined Patent Publication No. 2004-115838 Japanese Unexamined Patent Publication No. 2009-160722

Ni pole pipe having a spring structure proposed in Patent Literature 1 in part can exhibit very thin, thin, and high elasticity characteristics, and thus is widely used for conduction inspection in various technical fields in which a sample is reduced in size, high in density, and high in performance. The possibilities are wider.

While miniaturization, high density, and high performance of samples subjected to conduction inspection are in progress, a contactor for an energization inspection jig made of Ni pole pipe having a spring structure in part is required to be manufactured with higher precision and more precision. have.

Accordingly, the present invention provides a manufacturing method of a contactor for an energization inspection jig capable of manufacturing a very thin and thin current conduction inspection jig contactor having a spring structure of a main agent, which can be manufactured more precisely and more precisely. An object of the present invention is to propose a contactor for an energization inspection jig and an energization inspection jig provided with the same.

According to a first aspect of the present invention,

After the plating layer of gold or gold alloy is formed on the outer circumference of the core material, a Ni electroforming layer is formed on the outer circumference of the formed plating layer by electroforming.

After forming a resist layer on the outer periphery of said Ni electroforming layer, it exposes by a laser and forms a spiral groove in the said resist layer,

Etching is performed using the resist layer as a masking material, and a Ni electroforming layer in a portion where a spiral groove is formed in the resist layer is removed,

While removing the resist layer, the plating layer of the spiral groove portion from which the Ni electroforming layer was removed,

By removing only the core material while leaving the plating layer on the inner circumference of the Ni electroforming layer

It is a method of manufacturing the contactor for energization test jig provided with the spring structure of the electroplating agent.

The invention according to claim 2,

Contact for energization inspection jig having one end side of contact for jig for jig provided with spring structure of electroforming agent manufactured by the method according to claim 1 as a contact end for the specimen, and the other end as a connection to the conduction inspection jig to be.

The invention according to claim 3,

It is an electricity supply inspection jig provided with the contactor for electricity supply inspection jig of Claim 2.

ADVANTAGE OF THE INVENTION According to this invention, the contactor for the very thin and thin electricity supply test jig provided with the spring structure of the electroforming agent can be manufactured more precisely and more precisely. The contact for jig for electrical conduction inspection jig can exhibit excellent electrical conduction in that the plating layer of gold or gold alloy is provided inside. And the electricity supply inspection jig provided with the contactor for electricity supply inspection jig which is manufactured with high precision and is precisely in this way, and can exhibit the outstanding electricity supply property can be provided.

1 schematically illustrates an example of a configuration of arrangement of a continuous processing apparatus in which a step of forming a plating layer on the outer circumference of the core material by plating and then forming a Ni electroforming layer on the outer circumference of the formed plating layer is performed. (A) is a top view, (b) is a side view.
2 is a block diagram schematically illustrating a manufacturing method of the present invention.
FIG. 3 is a view for explaining a manufacturing process according to the present invention, wherein (a) is a side view showing a state in which a spiral groove is formed in a resist layer and a core material, a gold plating layer, and a Ni electroforming layer in XX, YY, and ZZ portions. (B) is a side view showing a state in which a Ni electroforming layer of a portion where a spiral groove is formed in a resist layer by etching is removed, and in XX, YY, and ZZ portions. (C) is a side view showing a state in which a plating layer of a spiral groove portion from which a resist layer and a Ni electroforming layer has been removed has been removed. An enlarged sectional view in which parts of the core, the plating layer, and the Ni electroforming layer in the YY and ZZ portions are omitted, (d) is a side view showing a state in which the core is removed, and the plating layer in the XX and YY portions, and Ni. Jeonju An enlarged cross-sectional view omitting a portion for explaining the stacked state.
Fig.4 (a), (b) is a side view which shows an example of the contactor for electricity supply jig manufactured by the manufacturing method of this invention.
Fig. 5 is a sectional view of the contactor for the energization inspection jig shown in Fig. 4A.
6 (a) and 6 (b) are side views illustrating another example of the contactor for the energization inspection jig manufactured by the manufacturing method of the present invention.
It is sectional drawing which shows another example of the contactor for electricity supply jig manufactured by the manufacturing method of this invention.
8 (a), (b), (c) and (d) are side views in which part of the tip shape of the side in contact with the specimen of the contactor for the energization inspection jig manufactured by the manufacturing method of the present invention is omitted;

A very thin and thin contact for jig according to the present invention having a spring structure of a main agent can be manufactured as follows.

After the plating layer of gold or gold alloy is formed on the outer circumference of the core material, a Ni electroforming layer is formed on the outer circumference of the formed plating layer by electroforming.

As the core material, an ultrafine metal wire or resin wire having an outer diameter of 5 μm or more can be used. As the metal wire, a stainless wire, an aluminum wire, or the like can be used.

As the resin wire, a synthetic resin wire made of nylon resin, polyethylene resin, or the like can be used, and in the case where a resin wire is used as the core material, it is necessary to form the plating layer of gold or gold alloy by electroless plating. Therefore, when productivity is considered, it is preferable to use the metal wire for a core material, and to form the plating layer of gold or a gold alloy by electroplating.

It is preferable that the plating layer of gold or a gold alloy is formed in thickness of 0.2 micrometer-1 micrometer, and the thickness of the Ni electroplating layer formed in the outer periphery by 5 micrometers-35 micrometers.

The contactor for the electricity supply inspection jig manufactured by the manufacturing method of this invention, and the electricity supply inspection jig provided with this are the contact probe for board | substrate inspection in manufacture of integrated circuits, such as an LSI, and an electricity supply provided with this, for example. Used as inspection jig. That is, it is used for conduction inspection of electronic device substrates, circuit wiring boards, etc. which are downsized, high density, and high performance, and the conduction inspection of other ultrafine and high density samples. Therefore, the size of the contactor for the energization inspection jig to be manufactured is required to be very thin and thin with an outer diameter of 20 µm to 500 µm and a thickness of about 2.5 µm to 50 µm. The above-mentioned thickness of the plating layer of a gold or gold alloy and Ni electroplating layer corresponds to the above-mentioned size of the contactor for electricity supply jig manufactured, and also melt | dissolves and removes the predetermined location of Ni electroplating layer by etching as mentioned later. In addition, by dissolving and removing a predetermined portion of the plating layer by subsequent processing, a spiral groove of a desired shape and size is accurately and precisely formed, thereby having a groove width (slit width) of accurate and precise size. It is determined from the point of view of forming a spiral structure.

Next, a resist layer (2 micrometers-50 micrometers in thickness) is formed in the outer periphery of the core material in which the plating layer of gold or a gold alloy and Ni electroplating layer are formed in the outer periphery.

For example, the resist layer is formed by immersing an electric core material in which a plating layer of gold or a gold alloy and a Ni electroforming layer are formed on an outer circumference of a photoresist bath containing a photoresist liquid for a predetermined time.

In this manner, a resist layer is formed on the outer circumference of the Ni electroforming layer, and then exposed by laser to form a spiral groove in the resist layer.

The exposure by the laser moves the core material in the vertical direction or in the vertical direction at a predetermined speed while rotating the core material with the center axis of the core material on which the resist layer is formed as the rotation center. On the other hand, a laser beam is aimed at the outer periphery of the core material of the predetermined longitudinal direction which should form a spiral structure in the longitudinal direction of the core material.

In addition, when a positive photoresist is used, the part exposed by the laser melt | dissolves in a developing solution, and a spiral groove is formed in a resist layer. On the other hand, in the case where a negative photoresist is used, the portion exposed by the laser becomes insoluble in the developer, so that the portion not exposed to the laser is dissolved in the developer and a spiral groove is formed in the resist layer. Consider this and shoot the laser beam.

In this way, by forming a spiral groove in the resist layer, the outer periphery of the Ni electroforming layer in the place where the spiral groove is formed in the resist layer is exposed.

Next, etching is performed using the resist layer remaining on the outer circumference of the Ni electroforming layer as a masking material to remove the Ni electroforming layer of the portion where the spiral grooves are formed in the resist layer.

For example, as described above, the core material in which the spiral grooves are formed in the resist layer formed on the outer periphery of the Ni electroforming layer is immersed in an acidic electrolytic polishing liquid for electropolishing. Thereby, the resist layer remaining on the outer circumference of the Ni electroforming layer is etched using the masking material, and the Ni electroforming layer of the portion where the spiral grooves are formed in the resist layer is removed.

Next, the resist layer is removed, and the plating layer of gold or gold alloy in the spiral groove portion from which the Ni electrode layer is removed is removed.

Removal of the plating layer is performed by, for example, ultrasonic cleaning treatment of a core material in which a Ni electroforming layer is removed in a spiral groove in a predetermined solution.

Finally, the core material is removed while leaving the plating layer of gold or gold alloy inside the Ni electroforming layer.

In order to remove the core material while leaving the plating layer of gold or gold alloy inside the nickel electroplating layer, the core material is pulled from one or both sides to be deformed so as to have a small cross-sectional area, and a gap is formed between the core outer periphery and the plating layer inner periphery. A drawing method can be adopted. In addition, the core material is immersed in the solution, and the core material can be dissolved and removed chemically or electrochemically.

In the case of using a stainless steel wire or a resin wire in the core material, the former may be removed by a method of drawing the former. In the case of using an aluminum wire in the core material, the latter chemical and electrochemical removal methods may be adopted. In this case, a strong alkaline liquid such as sodium hydroxide or potassium hydroxide, which hardly affects the electrodeposited material, can be used for the solution.

According to the manufacturing method of this invention, although it depends also whether a negative type or a positive type is used as a resist material, the width | variety of the groove | channel (slit) in a spiral structure part can be basically set by laser exposure. Therefore, in addition to being able to arbitrarily set a region for forming a spiral structure portion in a very thin and thin Ni electroplating tube, it is possible to arbitrarily set the width of the groove (slit) in the spiral structure portion, thereby providing high precision and elasticity. A contactor for the energization inspection jig having characteristics can be provided.

According to the manufacturing method of the present invention, as described above, by etching the resist layer remaining on the outer circumference of the Ni electroforming layer as a masking material, the Ni electroforming layer of the portion where the spiral grooves are formed in the resist layer is removed. .

At this time, since the plating layer of gold or a gold alloy exists inside the Ni electroforming layer, the etching liquid can be prevented from entering into the Ni electroforming layer portions other than the portion where the spiral grooves are formed. Thereby, only the part in which the spiral groove is formed in Ni electroplating layer is immersed and melt | dissolved by etching liquid. As a result, the groove width in the spiral structure portion of the Ni electroforming tube formed when the core material is removed can be made the precise groove width formed by laser exposure, and the groove width (slit width) of the spiral structure portion is desired to be uniform. I can do it with groove width.

When the width of the groove (slit) in the spiral structure portion is the desired uniform groove width, the elasticity when the one end side of the manufactured energization inspection jig contactor is connected to the energization inspection jig and the other end is pressed against the specimen to make contact Characteristics are improved.

Moreover, according to the manufacturing method of this invention, since the plating layer of gold or a gold alloy exists in the inside of Ni electroplating layer at the time of an etching, an etching liquid can be prevented from reaching a core material. When the etching liquid contacts the core material, the core material is eroded. When the drawing method is used when removing the core material, breakage of the core material occurs, etc., making it difficult to remove the core material neatly.

In the present invention, as described above, first, a plating layer of gold or a gold alloy is formed on the outer circumference of the core material, and a Ni electroforming layer is formed on the outer circumference of the formed plating layer by electroforming.

The significance of the gold or gold alloy plated layer being formed inside the Ni electroplating layer as described above was etched using the resist layer as a masking material to remove the Ni electroplating layer of the portion where the spiral groove was formed in the resist layer. Is exhibited in the process.

That is, as mentioned above, since the plating layer of gold or a gold alloy exists inside the Ni electroforming layer, etching liquid can be prevented from returning to Ni electroforming layer parts other than the part in which a spiral groove is formed. And the groove width (slit width) of the spiral structure part can be made into desired uniform groove width.

In the present invention, when etching, the outer side of the Ni electrode layer layer portion (the Ni electrode layer portion other than the portion where the spiral groove is formed in the resist layer) to remain as a spring structure portion is a resist layer, and the inner side is formed of a gold or gold alloy. Each is masked by a plating layer. Thus, it becomes possible to form the spring structure part by the thickness (thickness) of the design dimension by etching.

In particular, since the Ni electroforming layer is formed on the outer circumference of the plating layer of the inner gold or gold alloy, an etching solution penetrates into the contact surface between the plating layer and the Ni electroforming layer (the etching solution is returned). There is no fear that the end face and the inner side facing the groove (slit) are eroded by the etching solution.

As a result, the groove width (slit width) of the spiral structure portion can be set to a desired uniform groove width, and the thickness of the spiral structure portion can be made precise according to design dimensions.

The groove width (slit width) of the spiral structure portion is formed to the desired uniform groove width, and the thickness is formed to the desired thickness (constant thickness) to exhibit the desired elastic characteristics in the spring portion, and to provide a plurality of times such as a probe. It is very important for showing stable durability even if the contraction movement of several hundred thousand times to one million times is repeated.

In the present invention, etching is performed using a resist layer as a masking material, and a Ni electroforming layer in a portion where a spiral groove is formed in the resist layer is removed. As described above, an etching solution is formed inside the Ni electroforming layer. Before forming the Ni electroforming layer on the outer periphery of the core material in order to prevent the intrusion (the etching liquid enters) and the end portion facing the groove (slit) inside the Ni electroforming layer and the inside thereof from being eroded by the etching solution. In the processing step, a layer formed of a member that functions as a resist or a mask material is formed on the outer circumference of the core material.

In this way, before the Ni electroforming layer is formed on the outer circumference of the core, the layer formed on the outer circumference of the core is inevitably left inside the Ni electroforming layer even after the spiral structure portion is formed. Gold or a gold alloy is adopted, and a plating layer of gold or a gold alloy is formed.

(Example 1)

An example of the method of manufacturing the ultra-thin and thin electricity supply inspection jig | contactor 20 provided with the spring structure of the main agent using the SUS wire of diameter (5 micrometers-450 micrometers) for a core material is demonstrated.

FIG. 1 shows a continuous process in which a gold plating layer 12 is formed on the outer circumference of the core material by plating, and then a process is performed until the Ni electroforming layer 13 is formed on the outer circumference of the formed gold plating layer 12 by electroforming. An example of arrangement | positioning structure of an apparatus is demonstrated schematically, and FIG. 2 is a block diagram explaining an example of the manufacturing method of this invention.

The supply unit 1 is provided with a reel 10 in which a SUS wire 11 serving as a core material is wound.

The SUS wire 11 is supplied from the reel 10 of the supply unit 1 by the conveyance roller 14 in the storage unit 5, and passes through the washing unit 2 and the electricity supply / conveying unit 3. It is conveyed to the gold plating unit 4.

Predetermined weak alkaline liquid or weak acid liquid is charged in the washing | cleaning unit 2, and the outer periphery of the SUS wire 11 is wash | cleaned here.

The gold plating unit 4 contains a predetermined electrolyte solution, for example, a non-cyanide Au solution, and has a predetermined thickness (0.2) by plating on the outer circumference of the SUS wire 11 to be conveyed in the gold plating unit 4. μm to 1 μm) of the gold plating layer 12 is formed.

Subsequently, the SUS wire 11 in which the gold plating layer 12 was formed in the outer periphery by the conveyance roller 15 in the storage unit 9 which is equipped with the cutting unit which is not shown in figure is a washing unit 6, an electricity supply, It conveys to the nickel electroplating unit 8 via the conveying unit 7.

The cleaning unit 6 contains a predetermined weak alkaline solution or weak acid solution, and the outer circumference of the gold plating layer 12 is cleaned.

A predetermined electrolytic solution, for example, a sulfonic acid nickel liquid, is put in the nickel electroforming unit 8, and the electroplating is performed on the outer periphery of the gold plating layer 12 of the SUS wire 11, which is conveyed in the nickel electroforming unit 8. Ni electroforming layer 13 of predetermined thickness (3 micrometers-50 micrometers) is formed.

The conveyance speed of the conveyance rollers 14 and 15 in the storage units 5 and 9 determines whether the thickness of the gold plating layer 12 and the Ni electroforming layer 13 are formed on the outer periphery of the SUS wire 11. Adjust accordingly.

In this way, the SUS wire 11 in which the gold plating layer 12 and the Ni electroplating layer 13 were laminated on the outer circumference has a desired length, for example, by a cutting unit (not shown) provided in the storage unit 9. Cut to 30mm

Next, the SUS wire 11 in which the gold plating layer 12 and the Ni electroforming layer 13 were formed in the outer periphery was immersed in the photoresist tank in which the positive photoresist liquid was accommodated for a predetermined time, and then the outer periphery of the Ni electroforming layer 13 was formed. The resist layer 30 of predetermined thickness (2 micrometers-30 micrometers) is formed.

Next, the SUS wire 11 is vertically upwardly rotated at a predetermined speed while the core is rotated in the direction of arrow 40 and arrow 41 with the center axis of the SUS wire 11 on which the resist layer 30 is formed as the rotation center. (Arrow 42) or vertical direction downward (arrow 43). At the same time, a laser beam is directed to the outer periphery of the predetermined longitudinal direction in which the spiral structure 14 (FIG. 3 (d)) should be formed in the longitudinal direction of the SUS line 11.

Thereafter, the developer is immersed in the developer to dissolve the resist layer 30 in the portion exposed by laser to form a spiral groove 31 in the resist layer 30 (Fig. 3 (a)). By forming the helical groove 31 in the resist layer 30, the outer circumference of the Ni electroforming layer 13 in the place where this helical groove 31 is formed is exposed (FIG. 3 (a)).

Next, the SUS wire 11 in a state where the spiral grooves 31 are formed in the resist layer 30 formed on the outer circumference of the Ni electroforming layer 13 is immersed in an acidic electrolytic polishing liquid for electropolishing. As a result, the resist layer 30 remaining on the outer circumference of the Ni electroplating layer 13 is etched using a masking material, and the Ni electroplating layer of the portion where the spiral grooves 31 are formed in the resist layer 30 ( 13) is removed (FIG. 3 (b)). In this way, the outer periphery of the gold plating layer 12 in the location where the spiral groove 31 was formed is exposed (FIG. 3 (b)).

Next, the resist layer 30 is removed, and the SUS wire 11 is ultrasonically cleaned in pure water at a temperature higher than normal temperature (about 50 degrees), whereby the spiral groove 31 in which the Ni electrode layer 13 is removed. The gold plated layer 12 of the portion corresponding to the film is removed ((FIG. 3 (c)). As a result, the outer circumference of the SUS wire 11 in the position where the spiral groove 31 is formed is exposed. (FIG. 3 (c)).

Finally, the SUS wire 11 is pulled from one or both sides to be deformed so as to have a small cross-sectional area, and a gap is formed between the outer circumference of the SUS wire 11 and the inner circumference of the gold plating layer 12 to form the SUS wire 11. By drawing, the SUS wire 11 was removed while leaving the gold plating layer 12 inside the Ni electroplating layer 13, and the contacts for the ultra-thin and thin current conduction inspection jig provided with the spring structure made of Ni electroplating. ((FIG. 3 (d), FIG. 4 (a), FIG. 5).

The contactor 20 for an energization test jig manufactured in this way is provided with the gold-plated layer 12 inside, as shown to FIG. 3 (d), FIG. 4 (a), and FIG. It is a thin Ni electroforming tube having (14). The thin Ni electroplating tube having the gold plating layer 12 therein is formed of the gold plating layer 12 from the gold plating layer 12 and the Ni electroforming layer 13 formed on the outer circumference of the SUS wire 11, which is made of a core material. Is formed by removing the SUS wire 11 while leaving the inside of the Ni electroforming layer 13.

The spiral structure portion 14 is a spiral groove portion (slit) 31a in the Ni electrode layer layer 13 because a portion corresponding to the spiral groove 31 of the Ni electrode layer layer 13 is dissolved by etching. ) Is formed.

Fig.4 (a) is a side view which shows an example of the contact point 20 for the very thin and thin electricity supply test jig provided with the spring structure of the whole agent manufactured by the manufacturing method of this invention, and is a spring structure part shown with the code | symbol 14. It is formed in this part.

Moreover, as shown in FIG. 6, the tubular part 23 which consists of Ni electroplating layers provided with the gold plating layer inside, and the some spring structure part 24a, 24b, 25a, 25b, 25c are provided. It can also be set as the contactors 21 and 22 for an electricity supply test jig | tool.

By using the SUS wire 11 of 21 micrometers in outer diameter, the length of the tubular part which consists of Ni electroplating layer 13 provided with the gold-plated layer 12 inside 1 mm and the inside length by the above-mentioned process length L1. The contactor 20 for energization inspection jig of this invention whose (L2, L4) is respectively 0.1 mm, the length L3 of the spring structure part 14 is 0.8 mm, the outer diameter phi 1 is 35 micrometers, and the inner diameter phi 2 is 21 micrometers. Could be prepared.

In addition, said numerical value L1, L2, L3, L4, phi 1, phi 2 can be set to the numerical value according to design conditions.

When manufacturing the contactor 20 of the minute length L1 in this way, after cutting the tubular body which consists of the Ni electroplating layer 13 in which the gold plating layer 12 is formed in every 1 mm length, SUS wire 11 is carried out. By removing the plurality of contacts, the plurality of contacts 20 can be manufactured at the same time.

That is, as mentioned above, when the SUS wire 11 of 30 mm in total length is used as a core material, the range of 0.1 mm is tubular from one end, and the following 0.8 mm is a spring structure part, and the range of 0.2 mm is continued. In the tubular form, the spring structure portion 14 is formed by laser exposure such that the range of 0.8 mm continues. And before removing the SUS wire 11 after the process shown in FIG.3 (c), it cuts every 1 mm using a laser, and after that, when removing the SUS wire 11, 30 contactors 20 are manufactured simultaneously. can do. As described above, in the case where the SUS wire 11 is pulled out from one or both sides, it is necessary to consider the clamping portion required on the end side, but in this case as well, the contactor 20 having a total length L1 of 1 mm. 25 to 26 can be prepared simultaneously.

In addition, a very thin and thin current conduction inspection jig contactor 20a having a spring structure made of Ni electroplating agent shown in Fig. 4B can be manufactured. In this case, laser exposure is performed so that the spring structure portion 14 is formed over the entire length of the SUS wire 11 having a total length of 30 mm, and before the SUS wire 11 is removed, the laser is cut to a desired length. Thereafter, the SUS wire 11 may be removed to manufacture a plurality of contacts 20a at the same time.

3 (d), 4 (a), and 5, a contactor for an energization inspection jig having a spring structure in part thereof, and an energization inspection jig composed of a spring structure as a whole is shown in FIG.4 (b). It can be called a contact person.

In any case, according to the manufacturing method of this invention, the predetermined location of the Ni electroforming layer 13 is melt | dissolved by the etching which used as the mask the resist layer 30 in which the spiral groove 31 is formed by laser exposure. Then, the gold plating layer 12 in the portion corresponding to the spiral groove 31 from which the Ni electroplating layer 13 has been removed is removed to form the spring structure portion 14. Therefore, spirals having spiral grooves (slits) 31a formed of groove widths (slit widths) of accurate and precise sizes are formed by forming spiral grooves 31 of desired shape and size accurately and precisely. The structure can be formed.

The ultra-thin, thin current-carrying inspection jig contactors 20 and 20a (FIG. 4) provided with the spring structure of the electroforming agent manufactured by the manufacturing method of this invention can exhibit the outstanding elasticity characteristic. This is one of the characteristics exhibited by the point that the width | variety of the groove | channel (slit) 31a in a spiral structure part is desired uniform groove width.

The thickness of the Ni electroforming layer 13 provided with the gold plating layer in the inside manufactured by the manufacturing method of this invention mentioned above is 10 micrometers, the outer diameter (phi) 1 is 80 micrometers, and the length L3 of the spring structure part 14 is 2 mm. , The number of turns: The spring load of the contactor for the energization inspection jig according to the present invention 25 times was 2 gf / 0.2 mm. Moreover, the thickness of the Ni electroplating layer 13 which has the gold plating layer inside is 10 micrometers, the outer diameter (phi) 1 is 50 micrometers, the length L3 of the spring structure part 14 is 2 mm, and the number of turns: 40 times by this invention The spring load of the contact for jig was 4gf / 0.2mm.

The ultra-thin, thin current conduction inspection jig contactors 20 and 20a (FIG. 4) provided with the spring structure of the electroforming agent manufactured by the manufacturing method of this invention make one end side a contact end with respect to a sample, and the other end side It is used as a connection to the energization inspection jig.

In this case, it is possible to use one end side indicated by reference numeral 17 in FIG. 4A as a contact end for the specimen and the other end side indicated by reference numeral 16 as a connection portion for the energization inspection jig.

In addition, as shown in Fig. 7, the conductive pin 26 is inserted therein, and the tip 27 of the pin 26, which is in contact with the tip 17 side of the contactor 20 for energization inspection jig, is placed on the specimen. By setting it as the contact end with respect to, the one end side of the contact 20 for electricity supply jig | tools may be made into the contact end with respect to a sample.

In the case of the form shown in FIG. 7, the pin 26 can be fixed by means, such as caulking, welding, an adhesive agent, in the part shown with the code | symbol 18 in the figure.

In the case shown in Fig. 7, the conductive pins 26 inserted therein are Au-plated on a conductive metal wire, for example, a fine wire made of platinum rhodium or an alloy thereof, or Ni plating. It can be made into an ultrafine wire made of tungsten or BeCu (beryllium copper).

When the one end side shown by the code | symbol 17 of the electricity supply inspection jig | contact_contact 20 is used as a contact end with respect to a sample, or the front end 27 of the pin 26 which touches the one end side of the electricity supply inspection jig-contact 20 is a specimen In either case, the contact end has a tapered shape (Fig. 8 (a)), a curved shape with R (Fig. 8 (b)), and a flat flat shape (Fig. 8 (c)). It can be made into various shapes, such as a crown (crown) shape (FIG. 8 (d)).

Contactors 20 and 20a (FIGS. 4 and 7) for the energization inspection jig can be used as contact probes for substrate inspection in the manufacture of integrated circuits such as LSI. Moreover, the energization test jig provided with the contactors 20 and 20a (FIG. 4, FIG. 7) for this electricity supply test jig not only conduction test of an electronic device board | substrate, a circuit wiring board, etc., but also a very fine and high density sample Used to check the energization of

As mentioned above, although preferred embodiment of this invention was described with reference to an accompanying drawing, this invention is not limited to this embodiment, It can change into various forms in the technical scope grasped | ascertained from description of a claim. For example, in the said Example, although the gold plating layer 12 was formed in the outer periphery of the SUS wire 11 used as a core material, you may form the plating layer of a gold alloy instead of a gold plating layer.

11 ... SUS wire (core material)
12... Gold plated layer
13 ... Ni pole layer
14 ... Spiral Rescue
30 ... Resist layer
31 ... Spiral home
31a... Spiral Grooves (Slits)
20, 20a, 21, 22... Contact for Jig

Claims (3)

After the plating layer of gold or gold alloy is formed on the outer circumference of the core material, a Ni electroforming layer is formed on the outer circumference of the formed plating layer by electroforming.
After forming a resist layer on the outer periphery of said Ni electroforming layer, it exposes by a laser and forms a spiral groove in the said resist layer,
Etching is performed using the resist layer as a masking material, and a Ni electroforming layer in a portion where a spiral groove is formed in the resist layer is removed,
While removing the resist layer, the plating layer of the spiral groove portion from which the Ni electroforming layer was removed,
By removing only the core material while leaving the plating layer on the inner circumference of the Ni electroforming layer
A method for manufacturing a contactor for an energization inspection jig having a spring structure of a main agent. The one end side of the contactor for electricity supply test jig provided with the spring structure of the electroplating agent manufactured by the method of Claim 1 is made into the contact end with respect to a sample, and the other end is used as the connection part to the electricity supply test jig. Contactor for current inspection jig. The energization test jig provided with the contactor for electricity supply test jig of Claim 2.

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