KR20120118686A - 발광소자 모듈 - Google Patents

발광소자 모듈 Download PDF

Info

Publication number
KR20120118686A
KR20120118686A KR1020110036206A KR20110036206A KR20120118686A KR 20120118686 A KR20120118686 A KR 20120118686A KR 1020110036206 A KR1020110036206 A KR 1020110036206A KR 20110036206 A KR20110036206 A KR 20110036206A KR 20120118686 A KR20120118686 A KR 20120118686A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
device package
device module
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020110036206A
Other languages
English (en)
Korean (ko)
Inventor
이상우
박동욱
진홍범
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110036206A priority Critical patent/KR20120118686A/ko
Priority to US13/443,504 priority patent/US8791477B2/en
Priority to EP12163689.8A priority patent/EP2515622B1/en
Priority to JP2012096078A priority patent/JP5856533B2/ja
Priority to CN201210116861.7A priority patent/CN102751271B/zh
Publication of KR20120118686A publication Critical patent/KR20120118686A/ko
Priority to US14/269,912 priority patent/US9356004B2/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020110036206A 2011-04-19 2011-04-19 발광소자 모듈 Ceased KR20120118686A (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020110036206A KR20120118686A (ko) 2011-04-19 2011-04-19 발광소자 모듈
US13/443,504 US8791477B2 (en) 2011-04-19 2012-04-10 Light emitting device array
EP12163689.8A EP2515622B1 (en) 2011-04-19 2012-04-11 Light emitting device array
JP2012096078A JP5856533B2 (ja) 2011-04-19 2012-04-19 発光素子アレイ
CN201210116861.7A CN102751271B (zh) 2011-04-19 2012-04-19 发光器件阵列
US14/269,912 US9356004B2 (en) 2011-04-19 2014-05-05 Light emitting device array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110036206A KR20120118686A (ko) 2011-04-19 2011-04-19 발광소자 모듈

Publications (1)

Publication Number Publication Date
KR20120118686A true KR20120118686A (ko) 2012-10-29

Family

ID=45937081

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110036206A Ceased KR20120118686A (ko) 2011-04-19 2011-04-19 발광소자 모듈

Country Status (5)

Country Link
US (2) US8791477B2 (OSRAM)
EP (1) EP2515622B1 (OSRAM)
JP (1) JP5856533B2 (OSRAM)
KR (1) KR20120118686A (OSRAM)
CN (1) CN102751271B (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012113220A1 (de) 2012-10-24 2014-04-24 Hyundai Motor Company Rücklaufkraftstoff-Kühlsystem für ein LPI-Fahrzeug und Steuerungsverfahren davon
KR20180021514A (ko) * 2016-08-22 2018-03-05 삼성전자주식회사 광원 모듈 및 이를 포함하는 백라이트 유닛
KR102578225B1 (ko) * 2023-03-16 2023-09-13 (주)솔라루체 방열 성능이 향상된 led 모듈

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102033928B1 (ko) * 2012-09-13 2019-10-18 엘지이노텍 주식회사 발광 소자 및 조명 시스템
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
GB2519587A (en) 2013-10-28 2015-04-29 Barco Nv Tiled Display and method for assembling same
TWI556425B (zh) * 2014-07-21 2016-11-01 友達光電股份有限公司 顯示面板畫素單元及包含其之顯示面板
DE102015202569A1 (de) * 2015-02-12 2016-08-18 Robert Bosch Gmbh Schaltungsträger, elektronisches Modul und Verfahren zur Herstellung eines Schaltungsträgers
US10424704B2 (en) 2015-07-16 2019-09-24 Lg Innotek Co., Ltd. Light-emitting device package
CN105261689B (zh) * 2015-10-25 2018-10-16 复旦大学 全串联的高功率密度led芯片封装结构
KR102501042B1 (ko) * 2016-02-25 2023-02-20 엘지디스플레이 주식회사 디스플레이 장치, 백라이트 유닛, 가이드 패널 및 가요성 인쇄회로
CN109935556B (zh) * 2017-12-15 2020-11-24 光宝科技股份有限公司 发光二极管封装结构、散热基板及散热基板的制造方法
US10964852B2 (en) 2018-04-24 2021-03-30 Samsung Electronics Co., Ltd. LED module and LED lamp including the same
CN112924474A (zh) * 2019-12-06 2021-06-08 佛山市顺德区顺达电脑厂有限公司 Aoi检测方法
JP7157345B2 (ja) * 2020-04-08 2022-10-20 日亜化学工業株式会社 発光モジュール
JP2022120339A (ja) * 2021-02-05 2022-08-18 スタンレー電気株式会社 基板構造体、発光装置及び基板構造体の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2940432B2 (ja) * 1995-04-27 1999-08-25 ヤマハ株式会社 半導体装置とその製造方法
JP2003060240A (ja) * 2001-08-08 2003-02-28 Citizen Electronics Co Ltd 発光ダイオード及びその製造方法
JP4596145B2 (ja) * 2005-04-28 2010-12-08 ミネベア株式会社 面状照明装置
KR101232505B1 (ko) * 2005-06-30 2013-02-12 엘지디스플레이 주식회사 발광다이오드 패키지 제조방법, 백라이트 유닛 및액정표시장치
KR20080057881A (ko) * 2006-12-21 2008-06-25 엘지전자 주식회사 인쇄회로기판, 이를 포함하는 발광 장치 및 그 제조 방법
KR100851183B1 (ko) * 2006-12-27 2008-08-08 엘지이노텍 주식회사 반도체 발광소자 패키지
KR100877877B1 (ko) * 2007-08-28 2009-01-13 엘지이노텍 주식회사 발광 소자
JP4833192B2 (ja) * 2007-12-27 2011-12-07 新光電気工業株式会社 電子装置
KR101418374B1 (ko) * 2008-01-29 2014-07-11 삼성디스플레이 주식회사 인쇄 회로 기판 및 이를 포함하는 백라이트 유니트, 액정표시 장치
JP2009302339A (ja) * 2008-06-13 2009-12-24 Sanken Electric Co Ltd 半導体発光装置
US8288785B2 (en) * 2008-12-03 2012-10-16 Seoul Semiconductor Co., Ltd. Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode
KR101014063B1 (ko) * 2009-08-26 2011-02-10 엘지이노텍 주식회사 발광 소자 및 이를 이용한 라이트 유닛

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012113220A1 (de) 2012-10-24 2014-04-24 Hyundai Motor Company Rücklaufkraftstoff-Kühlsystem für ein LPI-Fahrzeug und Steuerungsverfahren davon
KR20180021514A (ko) * 2016-08-22 2018-03-05 삼성전자주식회사 광원 모듈 및 이를 포함하는 백라이트 유닛
KR102578225B1 (ko) * 2023-03-16 2023-09-13 (주)솔라루체 방열 성능이 향상된 led 모듈

Also Published As

Publication number Publication date
US9356004B2 (en) 2016-05-31
CN102751271A (zh) 2012-10-24
US20140239322A1 (en) 2014-08-28
EP2515622A3 (en) 2014-08-27
CN102751271B (zh) 2016-10-05
EP2515622B1 (en) 2016-06-01
US20120267654A1 (en) 2012-10-25
JP2012227529A (ja) 2012-11-15
EP2515622A2 (en) 2012-10-24
JP5856533B2 (ja) 2016-02-09
US8791477B2 (en) 2014-07-29

Similar Documents

Publication Publication Date Title
KR101886715B1 (ko) 발광소자 패키지
KR20120056543A (ko) 발광소자 패키지
KR101731810B1 (ko) 발광소자 어레이
KR101781043B1 (ko) 발광소자 어레이
KR101920211B1 (ko) 발광소자 어레이
KR20130079921A (ko) 인쇄 회로 기판
KR101818752B1 (ko) 발광소자 어레이
KR20120128884A (ko) 발광소자 모듈
KR101849130B1 (ko) 발광소자 어레이
KR101929402B1 (ko) 발광소자 패키지
KR101849128B1 (ko) 발광소자 어레이
KR101731811B1 (ko) 발광소자 어레이
KR101843734B1 (ko) 발광소자 어레이
KR101877429B1 (ko) 발광소자 어레이
KR20120073932A (ko) 발광소자 어레이
KR101843736B1 (ko) 발광소자 어레이
KR20120072742A (ko) 발광소자모듈
KR101849127B1 (ko) 발광소자 어레이
KR101873558B1 (ko) 발광소자 어레이
KR101883344B1 (ko) 발광소자 어레이
KR101807097B1 (ko) 발광소자 모듈
KR101141323B1 (ko) 발광소자 패키지
KR20130039171A (ko) 발광소자 어레이
KR20130073348A (ko) 발광소자 패키지
KR20120071151A (ko) 발광소자 패키지

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000