KR20120113718A - 고온 마모 용도를 위한 폴리이미드 수지 - Google Patents

고온 마모 용도를 위한 폴리이미드 수지 Download PDF

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Publication number
KR20120113718A
KR20120113718A KR1020127013659A KR20127013659A KR20120113718A KR 20120113718 A KR20120113718 A KR 20120113718A KR 1020127013659 A KR1020127013659 A KR 1020127013659A KR 20127013659 A KR20127013659 A KR 20127013659A KR 20120113718 A KR20120113718 A KR 20120113718A
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KR
South Korea
Prior art keywords
polyimide
weight
parts
aromatic
acid
Prior art date
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KR1020127013659A
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English (en)
Korean (ko)
Inventor
지저스 지 모랄레즈
로버트 레이 버치
로이드 아브람스
티모시 디. 크리잔
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20120113718A publication Critical patent/KR20120113718A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020127013659A 2009-10-27 2010-10-27 고온 마모 용도를 위한 폴리이미드 수지 Withdrawn KR20120113718A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25514509P 2009-10-27 2009-10-27
US61/255,145 2009-10-27

Publications (1)

Publication Number Publication Date
KR20120113718A true KR20120113718A (ko) 2012-10-15

Family

ID=43970678

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127013659A Withdrawn KR20120113718A (ko) 2009-10-27 2010-10-27 고온 마모 용도를 위한 폴리이미드 수지

Country Status (6)

Country Link
US (1) US8507615B2 (enExample)
EP (1) EP2493961A4 (enExample)
JP (1) JP5604524B2 (enExample)
KR (1) KR20120113718A (enExample)
CN (1) CN102666660B (enExample)
WO (1) WO2011056634A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11485859B2 (en) 2017-09-04 2022-11-01 Lg Chem, Ltd. Polyimide film for flexible display device substrate

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8824945B2 (en) * 2011-02-09 2014-09-02 Xerox Corporation Metallic nanoparticle reinforced polyimide for fuser belt with high thermal conductivity
US9890298B2 (en) * 2013-12-31 2018-02-13 Saint-Gobain Performance Plastics Corporation Composite bearings having a polyimide matrix
EP3615593B1 (en) 2017-04-26 2024-05-15 Henkel AG & Co. KGaA Silane modified polymers with improved properties
CA3061730A1 (en) 2017-05-03 2018-11-08 Henkel IP & Holding GmbH Silane modified polymers with improved characteristics for adhesive compositions
KR102202054B1 (ko) 2018-01-22 2021-01-11 주식회사 엘지화학 액정 배향제 조성물, 이를 이용한 액정 배향막의 제조 방법, 및 이를 이용한 액정 배향막
CN112601917B (zh) * 2018-08-20 2025-05-27 大金工业株式会社 冷冻循环装置
CN112223131A (zh) * 2020-11-02 2021-01-15 惠州市新科磨具有限公司 耐磨薄片树脂切割片及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3998786A (en) * 1973-05-25 1976-12-21 University Of Notre Dame Du Lac Process for preparing aromatic polyimides, polyimides prepared thereby
US4107125A (en) * 1976-07-01 1978-08-15 E. I. Du Pont De Nemours And Company Crosslinked aromatic polyimides and articles made therefrom
US4552931A (en) * 1984-09-11 1985-11-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process of end-capping a polyimide system
US5116939A (en) * 1987-08-11 1992-05-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimide processing additives
US5055116A (en) * 1989-05-22 1991-10-08 Hoechst Celanese Corp. Gas separation membranes comprising miscible blends of polyimide polymers
US5312866A (en) * 1989-11-30 1994-05-17 Mitsui Toatsu Chemicals, Incorporated Polyimide based resin composition
JPH03215581A (ja) * 1990-01-19 1991-09-20 Daicel Chem Ind Ltd ポリイミド塗膜の密着性改良方法
US5115090A (en) * 1990-03-30 1992-05-19 Sachdev Krishna G Viscosity stable, essentially gel-free polyamic acid compositions
US5886129A (en) * 1997-07-01 1999-03-23 E. I. Du Pont De Nemours And Company Oxidatively stable rigid aromatic polyimide compositions and process for their preparation
US6501934B1 (en) * 2000-10-26 2002-12-31 Xerox Corporation Transfer/transfuse member having increased durability
JP2004123857A (ja) * 2002-10-01 2004-04-22 Teijin Ltd ポリアミド酸組成物およびポリアミド酸の製造方法
US20050070658A1 (en) * 2003-09-30 2005-03-31 Soumyadeb Ghosh Electrically conductive compositions, methods of manufacture thereof and articles derived from such compositions
US7265181B2 (en) * 2004-07-09 2007-09-04 E.I. Du Pont De Nemours And Company Polyimide cross-linked polymer and shaped article thereof
CN101495548B (zh) * 2006-07-23 2012-01-25 宇部兴产株式会社 由多成分聚酰亚胺形成的聚酰亚胺膜及其制造方法
US20080119616A1 (en) * 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
JP4853534B2 (ja) * 2009-03-13 2012-01-11 富士ゼロックス株式会社 ポリアミック酸組成物、ポリイミド無端ベルト、定着装置および画像形成装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11485859B2 (en) 2017-09-04 2022-11-01 Lg Chem, Ltd. Polyimide film for flexible display device substrate

Also Published As

Publication number Publication date
US8507615B2 (en) 2013-08-13
EP2493961A4 (en) 2013-03-13
CN102666660B (zh) 2015-01-28
JP5604524B2 (ja) 2014-10-08
CN102666660A (zh) 2012-09-12
WO2011056634A2 (en) 2011-05-12
JP2013508534A (ja) 2013-03-07
EP2493961A2 (en) 2012-09-05
US20120273731A1 (en) 2012-11-01
WO2011056634A3 (en) 2011-09-22

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Patent event date: 20120525

Patent event code: PA01051R01D

Comment text: International Patent Application

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PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20151027

Comment text: Request for Examination of Application

PC1202 Submission of document of withdrawal before decision of registration

Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment)

Patent event code: PC12021R01D

Patent event date: 20160223

WITB Written withdrawal of application