JP5604524B2 - 高温摩耗用途向けポリイミド樹脂 - Google Patents

高温摩耗用途向けポリイミド樹脂 Download PDF

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Publication number
JP5604524B2
JP5604524B2 JP2012536986A JP2012536986A JP5604524B2 JP 5604524 B2 JP5604524 B2 JP 5604524B2 JP 2012536986 A JP2012536986 A JP 2012536986A JP 2012536986 A JP2012536986 A JP 2012536986A JP 5604524 B2 JP5604524 B2 JP 5604524B2
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polyimide
weight
parts
wear
aromatic
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Japanese (ja)
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JP2013508534A5 (enExample
JP2013508534A (ja
Inventor
ジーザス・ジー・モラレズ
ロバート・レイ・バーチ
ロイド・エイブラムス
ティモシー・ディー・クリザン
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2012536986A 2009-10-27 2010-10-27 高温摩耗用途向けポリイミド樹脂 Expired - Fee Related JP5604524B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25514509P 2009-10-27 2009-10-27
US61/255,145 2009-10-27
PCT/US2010/054226 WO2011056634A2 (en) 2009-10-27 2010-10-27 Polyimide resins for high temperature wear applications

Publications (3)

Publication Number Publication Date
JP2013508534A JP2013508534A (ja) 2013-03-07
JP2013508534A5 JP2013508534A5 (enExample) 2013-12-12
JP5604524B2 true JP5604524B2 (ja) 2014-10-08

Family

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Family Applications (1)

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JP2012536986A Expired - Fee Related JP5604524B2 (ja) 2009-10-27 2010-10-27 高温摩耗用途向けポリイミド樹脂

Country Status (6)

Country Link
US (1) US8507615B2 (enExample)
EP (1) EP2493961A4 (enExample)
JP (1) JP5604524B2 (enExample)
KR (1) KR20120113718A (enExample)
CN (1) CN102666660B (enExample)
WO (1) WO2011056634A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8824945B2 (en) * 2011-02-09 2014-09-02 Xerox Corporation Metallic nanoparticle reinforced polyimide for fuser belt with high thermal conductivity
US9890298B2 (en) * 2013-12-31 2018-02-13 Saint-Gobain Performance Plastics Corporation Composite bearings having a polyimide matrix
EP3615593B1 (en) 2017-04-26 2024-05-15 Henkel AG & Co. KGaA Silane modified polymers with improved properties
CA3061730A1 (en) 2017-05-03 2018-11-08 Henkel IP & Holding GmbH Silane modified polymers with improved characteristics for adhesive compositions
CN110494475B (zh) 2017-09-04 2022-09-20 株式会社Lg化学 用于柔性显示装置基底的聚酰亚胺膜
KR102202054B1 (ko) 2018-01-22 2021-01-11 주식회사 엘지화학 액정 배향제 조성물, 이를 이용한 액정 배향막의 제조 방법, 및 이를 이용한 액정 배향막
CN112601917B (zh) * 2018-08-20 2025-05-27 大金工业株式会社 冷冻循环装置
CN112223131A (zh) * 2020-11-02 2021-01-15 惠州市新科磨具有限公司 耐磨薄片树脂切割片及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3998786A (en) * 1973-05-25 1976-12-21 University Of Notre Dame Du Lac Process for preparing aromatic polyimides, polyimides prepared thereby
US4107125A (en) * 1976-07-01 1978-08-15 E. I. Du Pont De Nemours And Company Crosslinked aromatic polyimides and articles made therefrom
US4552931A (en) * 1984-09-11 1985-11-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process of end-capping a polyimide system
US5116939A (en) * 1987-08-11 1992-05-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimide processing additives
US5055116A (en) * 1989-05-22 1991-10-08 Hoechst Celanese Corp. Gas separation membranes comprising miscible blends of polyimide polymers
US5312866A (en) * 1989-11-30 1994-05-17 Mitsui Toatsu Chemicals, Incorporated Polyimide based resin composition
JPH03215581A (ja) * 1990-01-19 1991-09-20 Daicel Chem Ind Ltd ポリイミド塗膜の密着性改良方法
US5115090A (en) * 1990-03-30 1992-05-19 Sachdev Krishna G Viscosity stable, essentially gel-free polyamic acid compositions
US5886129A (en) * 1997-07-01 1999-03-23 E. I. Du Pont De Nemours And Company Oxidatively stable rigid aromatic polyimide compositions and process for their preparation
US6501934B1 (en) * 2000-10-26 2002-12-31 Xerox Corporation Transfer/transfuse member having increased durability
JP2004123857A (ja) * 2002-10-01 2004-04-22 Teijin Ltd ポリアミド酸組成物およびポリアミド酸の製造方法
US20050070658A1 (en) * 2003-09-30 2005-03-31 Soumyadeb Ghosh Electrically conductive compositions, methods of manufacture thereof and articles derived from such compositions
US7265181B2 (en) * 2004-07-09 2007-09-04 E.I. Du Pont De Nemours And Company Polyimide cross-linked polymer and shaped article thereof
CN101495548B (zh) * 2006-07-23 2012-01-25 宇部兴产株式会社 由多成分聚酰亚胺形成的聚酰亚胺膜及其制造方法
US20080119616A1 (en) * 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
JP4853534B2 (ja) * 2009-03-13 2012-01-11 富士ゼロックス株式会社 ポリアミック酸組成物、ポリイミド無端ベルト、定着装置および画像形成装置

Also Published As

Publication number Publication date
US8507615B2 (en) 2013-08-13
EP2493961A4 (en) 2013-03-13
CN102666660B (zh) 2015-01-28
KR20120113718A (ko) 2012-10-15
CN102666660A (zh) 2012-09-12
WO2011056634A2 (en) 2011-05-12
JP2013508534A (ja) 2013-03-07
EP2493961A2 (en) 2012-09-05
US20120273731A1 (en) 2012-11-01
WO2011056634A3 (en) 2011-09-22

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