KR20120095902A - 태양전지 모듈 적용에서 물 소거제로서 칼슘 옥사이드의 사용 - Google Patents

태양전지 모듈 적용에서 물 소거제로서 칼슘 옥사이드의 사용 Download PDF

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KR20120095902A
KR20120095902A KR1020127012107A KR20127012107A KR20120095902A KR 20120095902 A KR20120095902 A KR 20120095902A KR 1020127012107 A KR1020127012107 A KR 1020127012107A KR 20127012107 A KR20127012107 A KR 20127012107A KR 20120095902 A KR20120095902 A KR 20120095902A
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South Korea
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weight
amount
total composition
sealant
composition
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KR1020127012107A
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Korean (ko)
Inventor
하랄드 베케르
하이크 브뤼허
노르베르트 쇼트
라훌 라스알
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에이디씨오 프로덕츠 인코포레이티드
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Publication of KR20120095902A publication Critical patent/KR20120095902A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sealing Material Composition (AREA)
  • Photovoltaic Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020127012107A 2009-10-14 2010-10-14 태양전지 모듈 적용에서 물 소거제로서 칼슘 옥사이드의 사용 Withdrawn KR20120095902A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25152709P 2009-10-14 2009-10-14
US61/251,527 2009-10-14
US67925010A 2010-03-19 2010-03-19
US12/679,250 2010-03-19

Publications (1)

Publication Number Publication Date
KR20120095902A true KR20120095902A (ko) 2012-08-29

Family

ID=44115225

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127012107A Withdrawn KR20120095902A (ko) 2009-10-14 2010-10-14 태양전지 모듈 적용에서 물 소거제로서 칼슘 옥사이드의 사용

Country Status (5)

Country Link
EP (1) EP2489070A1 (enExample)
JP (1) JP2013509453A (enExample)
KR (1) KR20120095902A (enExample)
CN (1) CN102742006A (enExample)
WO (1) WO2011068597A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210027969A (ko) * 2019-09-03 2021-03-11 엘지전자 주식회사 태양 전지 패널 및 이의 제조 방법

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101382774B1 (ko) * 2011-11-16 2014-04-09 엘지이노텍 주식회사 태양전지 모듈
KR101251853B1 (ko) 2011-11-21 2013-04-10 엘지이노텍 주식회사 태양전지 모듈 및 이의 제조방법
JP5895492B2 (ja) * 2011-12-07 2016-03-30 三菱化学株式会社 シラン架橋ポリオレフィン樹脂及びその製造方法
DE102011089565A1 (de) * 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
JP6050017B2 (ja) * 2012-03-31 2016-12-21 アイカ工業株式会社 ホットメルトシール組成物
JP5959352B2 (ja) * 2012-07-23 2016-08-02 アイカ工業株式会社 ホットメルトシール組成物
CN102779904B (zh) * 2012-08-17 2016-01-20 常州天合光能有限公司 防止晶硅太阳能模块的有害极化和黑线现象发生的方法
JP6068214B2 (ja) * 2013-03-18 2017-01-25 アイカ工業株式会社 ホットメルトシール組成物
KR20150141967A (ko) * 2013-03-19 2015-12-21 아이지에이피 에스.피.에이. 재생 폴리올레핀을 함유하는 열가소성 폴리머 제형 및 제조방법
FR3019180B1 (fr) * 2014-03-26 2016-03-25 Saint Gobain Composition d'elastomere thermoplastique pour encapsulation
ES2748292T3 (es) * 2014-10-30 2020-03-16 Dow Global Technologies Llc Módulo PV con capa de película que comprende gel de sílice micronizada
JP6499490B2 (ja) * 2015-04-02 2019-04-10 アイカ工業株式会社 ホットメルトシール組成物
JP6530241B2 (ja) * 2015-05-29 2019-06-12 ニチアス株式会社 ガスケット劣化防止材及び該ガスケット劣化防止材を備えるガスケット
CN106928883B (zh) * 2015-12-31 2019-02-26 比亚迪股份有限公司 一种密封胶带组合物和密封胶带及其应用
CN110872477A (zh) * 2018-09-03 2020-03-10 中国石油天然气集团有限公司 丁基压敏胶及其制备方法和应用
JP6924887B1 (ja) * 2020-11-02 2021-08-25 ジョジアン ジンコ ソーラー カンパニー リミテッド 光起電力モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3016A (en) * 1843-03-21 Burning bricks
US5855972A (en) * 1993-11-12 1999-01-05 Kaeding; Konrad H Sealant strip useful in the fabrication of insulated glass and compositions and methods relating thereto
DE19821355B4 (de) * 1998-05-13 2005-02-24 Chemetall Gmbh Verwendung einer Dichtungsmasse zur Herstellung von Mehrscheibenisolierglas
DE10015290A1 (de) * 2000-03-28 2001-10-11 Henkel Teroson Gmbh Reaktives Schmelzstoff-Granulat für Isoliergals
WO2006121086A1 (ja) * 2005-05-11 2006-11-16 Mitsui Chemicals, Inc. α－オレフィン・非共役環状ポリエン共重合体及びその製造方法、ならびに該共重合体を用いた架橋可能な組成物
JP5143835B2 (ja) * 2006-07-03 2013-02-13 ダウ・コーニング・コーポレイション 化学的硬化性一体型ウォームエッジスペーサー及びシール
EP2072577B1 (en) * 2006-10-05 2010-08-04 Kaneka Corporation Curable composition
DE102007045104A1 (de) * 2007-09-20 2009-04-02 Kömmerling Chemische Fabrik GmbH Dichtungsmasse zur Herstellung von Zwei- oder Mehrscheiben-Isolierglas oder Solarmodulen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210027969A (ko) * 2019-09-03 2021-03-11 엘지전자 주식회사 태양 전지 패널 및 이의 제조 방법

Also Published As

Publication number Publication date
JP2013509453A (ja) 2013-03-14
EP2489070A1 (en) 2012-08-22
CN102742006A (zh) 2012-10-17
WO2011068597A1 (en) 2011-06-09

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PA0105 International application

Patent event date: 20120510

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid