CN102742006A - 氧化钙作为除水剂在太阳能模块应用中的用途 - Google Patents

氧化钙作为除水剂在太阳能模块应用中的用途 Download PDF

Info

Publication number
CN102742006A
CN102742006A CN2010800568414A CN201080056841A CN102742006A CN 102742006 A CN102742006 A CN 102742006A CN 2010800568414 A CN2010800568414 A CN 2010800568414A CN 201080056841 A CN201080056841 A CN 201080056841A CN 102742006 A CN102742006 A CN 102742006A
Authority
CN
China
Prior art keywords
weight
amount
encapsulant composition
total compsn
calcium oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800568414A
Other languages
English (en)
Chinese (zh)
Inventor
H.贝克
H.布吕赫
N.肖特
R.拉萨尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adco Products Inc
Original Assignee
Adco Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adco Products Inc filed Critical Adco Products Inc
Publication of CN102742006A publication Critical patent/CN102742006A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sealing Material Composition (AREA)
  • Photovoltaic Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2010800568414A 2009-10-14 2010-10-14 氧化钙作为除水剂在太阳能模块应用中的用途 Pending CN102742006A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US25152709P 2009-10-14 2009-10-14
US61/251527 2009-10-14
US67925010A 2010-03-19 2010-03-19
US12/679250 2010-03-19
PCT/US2010/052726 WO2011068597A1 (en) 2009-10-14 2010-10-14 Use of calcium oxide as a water scavenger in solar module applications

Publications (1)

Publication Number Publication Date
CN102742006A true CN102742006A (zh) 2012-10-17

Family

ID=44115225

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800568414A Pending CN102742006A (zh) 2009-10-14 2010-10-14 氧化钙作为除水剂在太阳能模块应用中的用途

Country Status (5)

Country Link
EP (1) EP2489070A1 (enExample)
JP (1) JP2013509453A (enExample)
KR (1) KR20120095902A (enExample)
CN (1) CN102742006A (enExample)
WO (1) WO2011068597A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105143343A (zh) * 2014-03-26 2015-12-09 法国圣戈班玻璃厂 用于封装的热塑性弹性体组合物
WO2017114291A1 (zh) * 2015-12-31 2017-07-06 比亚迪股份有限公司 密封胶带组合物和密封胶带及其用途
CN107001693A (zh) * 2014-10-30 2017-08-01 陶氏环球技术有限责任公司 具有包含微粉化硅胶的膜层的光伏模块

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101382774B1 (ko) * 2011-11-16 2014-04-09 엘지이노텍 주식회사 태양전지 모듈
KR101251853B1 (ko) 2011-11-21 2013-04-10 엘지이노텍 주식회사 태양전지 모듈 및 이의 제조방법
JP5895492B2 (ja) * 2011-12-07 2016-03-30 三菱化学株式会社 シラン架橋ポリオレフィン樹脂及びその製造方法
DE102011089565A1 (de) * 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
JP6050017B2 (ja) * 2012-03-31 2016-12-21 アイカ工業株式会社 ホットメルトシール組成物
JP5959352B2 (ja) * 2012-07-23 2016-08-02 アイカ工業株式会社 ホットメルトシール組成物
CN102779904B (zh) * 2012-08-17 2016-01-20 常州天合光能有限公司 防止晶硅太阳能模块的有害极化和黑线现象发生的方法
JP6068214B2 (ja) * 2013-03-18 2017-01-25 アイカ工業株式会社 ホットメルトシール組成物
WO2014147106A2 (en) * 2013-03-19 2014-09-25 Dinunzio Giuseppe "thermoplastic polymer formulation containing recycled polyolefins and method of preparing"
JP6499490B2 (ja) * 2015-04-02 2019-04-10 アイカ工業株式会社 ホットメルトシール組成物
JP6530241B2 (ja) * 2015-05-29 2019-06-12 ニチアス株式会社 ガスケット劣化防止材及び該ガスケット劣化防止材を備えるガスケット
CN110872477A (zh) * 2018-09-03 2020-03-10 中国石油天然气集团有限公司 丁基压敏胶及其制备方法和应用
KR102663717B1 (ko) * 2019-09-03 2024-05-07 상라오 신위안 웨동 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 태양 전지 패널 및 이의 제조 방법
JP6924887B1 (ja) * 2020-11-02 2021-08-25 ジョジアン ジンコ ソーラー カンパニー リミテッド 光起電力モジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5855972A (en) * 1993-11-12 1999-01-05 Kaeding; Konrad H Sealant strip useful in the fabrication of insulated glass and compositions and methods relating thereto
US20030162882A1 (en) * 2000-03-28 2003-08-28 Stefan Grimm Reactive hot-melt-type adhesive granulate for insulating glass
CN101522789A (zh) * 2006-10-05 2009-09-02 株式会社钟化 固化性组合物
US20090234073A1 (en) * 2005-05-11 2009-09-17 Mitsui Chemicals, Inc. Alpha-Olefin/non-conjugated cyclic polyene copolymers, production processes thereof, and crosslinkable compositions including the copolymer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3016A (en) * 1843-03-21 Burning bricks
DE19821355B4 (de) * 1998-05-13 2005-02-24 Chemetall Gmbh Verwendung einer Dichtungsmasse zur Herstellung von Mehrscheibenisolierglas
RU2448127C2 (ru) * 2006-07-03 2012-04-20 Дау Корнинг Корпорейшн Химически отверждаемая "все в одном" уплотнение-проставка теплой кромки
DE102007045104A1 (de) * 2007-09-20 2009-04-02 Kömmerling Chemische Fabrik GmbH Dichtungsmasse zur Herstellung von Zwei- oder Mehrscheiben-Isolierglas oder Solarmodulen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5855972A (en) * 1993-11-12 1999-01-05 Kaeding; Konrad H Sealant strip useful in the fabrication of insulated glass and compositions and methods relating thereto
US20030162882A1 (en) * 2000-03-28 2003-08-28 Stefan Grimm Reactive hot-melt-type adhesive granulate for insulating glass
US20090234073A1 (en) * 2005-05-11 2009-09-17 Mitsui Chemicals, Inc. Alpha-Olefin/non-conjugated cyclic polyene copolymers, production processes thereof, and crosslinkable compositions including the copolymer
CN101522789A (zh) * 2006-10-05 2009-09-02 株式会社钟化 固化性组合物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105143343A (zh) * 2014-03-26 2015-12-09 法国圣戈班玻璃厂 用于封装的热塑性弹性体组合物
CN105143343B (zh) * 2014-03-26 2017-09-15 法国圣戈班玻璃厂 用于封装的热塑性弹性体组合物
CN107001693A (zh) * 2014-10-30 2017-08-01 陶氏环球技术有限责任公司 具有包含微粉化硅胶的膜层的光伏模块
CN107001693B (zh) * 2014-10-30 2019-05-21 陶氏环球技术有限责任公司 具有包含微粉化硅胶的膜层的光伏模块
WO2017114291A1 (zh) * 2015-12-31 2017-07-06 比亚迪股份有限公司 密封胶带组合物和密封胶带及其用途

Also Published As

Publication number Publication date
EP2489070A1 (en) 2012-08-22
JP2013509453A (ja) 2013-03-14
WO2011068597A1 (en) 2011-06-09
KR20120095902A (ko) 2012-08-29

Similar Documents

Publication Publication Date Title
CN102742006A (zh) 氧化钙作为除水剂在太阳能模块应用中的用途
US20120192946A1 (en) Use of calcium oxide as a water scavenger in solar applications
Lu et al. A review on encapsulation technology from organic light emitting diodes to organic and perovskite solar cells
TWI663242B (zh) 用於封裝有機電子元件的膠帶及保護設置在基材上的有機電子元件之方法
JP2013509694A (ja) 反応性又は不飽和ポリオレフィンを含有するエッジシーラント組成物
KR101448483B1 (ko) 복합 게터 시스템을 포함하는 폴리머 3중 층을 사용함에 의한 광전지 패널을 제조하는 방법
CN102362352B (zh) 光电子器件
JP5767364B2 (ja) 光起電性パネル製造用の複合材ゲッター
JP2005539374A (ja) 低水蒸気透過度の接着剤組成物を含むソーラパネル
KR20110014692A (ko) 접착성 캡슐화 조성물 및 그로 제조된 전자 소자
CN102347390A (zh) 太阳能板与太阳能板的制作方法
WO2009138990A1 (en) Encapsulation material
US20120199199A1 (en) Edge sealant composition with reactive or unsaturated polyolefins
WO2010146389A1 (en) Laminated structure
WO2010039836A1 (en) Solar module having an encapsulant mounting adhesive
CN110854225A (zh) 一种双玻光伏组件
CN102939651A (zh) 防湿层封装混合物
JP4890752B2 (ja) 太陽電池モジュール
WO2025052310A1 (en) Encapsulating material for perovskite -based solar cells
JP2013149800A (ja) 太陽電池モジュール

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121017