KR20120049826A - 위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체 - Google Patents

위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체 Download PDF

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Publication number
KR20120049826A
KR20120049826A KR1020110115802A KR20110115802A KR20120049826A KR 20120049826 A KR20120049826 A KR 20120049826A KR 1020110115802 A KR1020110115802 A KR 1020110115802A KR 20110115802 A KR20110115802 A KR 20110115802A KR 20120049826 A KR20120049826 A KR 20120049826A
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KR
South Korea
Prior art keywords
image
inspection
recipe
measurement
magnification
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Withdrawn
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KR1020110115802A
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English (en)
Korean (ko)
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요지 가또
Original Assignee
올림푸스 가부시키가이샤
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Publication of KR20120049826A publication Critical patent/KR20120049826A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/022—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020110115802A 2010-11-09 2011-11-08 위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체 Withdrawn KR20120049826A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010250948A JP5653724B2 (ja) 2010-11-09 2010-11-09 位置合わせ装置、位置合わせ方法および位置合わせプログラム
JPJP-P-2010-250948 2010-11-09

Publications (1)

Publication Number Publication Date
KR20120049826A true KR20120049826A (ko) 2012-05-17

Family

ID=46267519

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110115802A Withdrawn KR20120049826A (ko) 2010-11-09 2011-11-08 위치 정렬 장치, 위치 정렬 방법 및 위치 정렬 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체

Country Status (4)

Country Link
JP (1) JP5653724B2 (https=)
KR (1) KR20120049826A (https=)
CN (1) CN102565082A (https=)
TW (1) TW201229500A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9852500B2 (en) * 2015-07-15 2017-12-26 GM Global Technology Operations LLC Guided inspection of an installed component using a handheld inspection device
EP3581931B1 (en) * 2017-02-08 2020-12-23 Fujifilm Corporation Immunological testing device
CN113125434B (zh) * 2019-12-31 2024-11-19 深圳迈瑞生物医疗电子股份有限公司 图像分析系统和控制拍摄样本图像的方法
CN112919106A (zh) * 2021-01-29 2021-06-08 中山市美鼎机械制造有限公司 一种线路板光学智能检测设备
JP7701216B2 (ja) * 2021-08-27 2025-07-01 株式会社Ｓｃｒｅｅｎホールディングス 描画システム、描画方法およびプログラム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634233B2 (ja) * 1987-05-26 1994-05-02 株式会社安川電機 階層化構造的テンプレ−ト・マッチング方法
JP3246616B2 (ja) * 1992-10-01 2002-01-15 株式会社ニコン 位置合わせ方法
JP2001201338A (ja) * 2000-01-20 2001-07-27 Jeol Ltd 座標リンク機構
JP3993817B2 (ja) * 2002-12-11 2007-10-17 株式会社日立製作所 欠陥組成分析方法及び装置
JP4847685B2 (ja) * 2004-04-16 2011-12-28 株式会社日立ハイテクノロジーズ パターンサーチ方法
JP5059297B2 (ja) * 2005-05-09 2012-10-24 株式会社日立ハイテクノロジーズ 電子線式観察装置
JP2008152555A (ja) * 2006-12-18 2008-07-03 Olympus Corp 画像認識方法及び画像認識装置
JP2008311668A (ja) * 2008-07-07 2008-12-25 Hitachi High-Technologies Corp 基板又は半導体ウエーハに形成されたパターンの，重ね合わせ誤差検査装置及び重ね合わせ誤差検査方法
JP2010107412A (ja) * 2008-10-31 2010-05-13 Toshiba Corp 欠陥観察装置、欠陥観察方法
JP5315076B2 (ja) * 2009-02-06 2013-10-16 株式会社日立ハイテクノロジーズ 電子線の影響を考慮した半導体検査方法及び装置

Also Published As

Publication number Publication date
JP5653724B2 (ja) 2015-01-14
CN102565082A (zh) 2012-07-11
JP2012103072A (ja) 2012-05-31
TW201229500A (en) 2012-07-16

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