KR20120031224A - 인광 변환 적외선 led - Google Patents

인광 변환 적외선 led Download PDF

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Publication number
KR20120031224A
KR20120031224A KR1020127001032A KR20127001032A KR20120031224A KR 20120031224 A KR20120031224 A KR 20120031224A KR 1020127001032 A KR1020127001032 A KR 1020127001032A KR 20127001032 A KR20127001032 A KR 20127001032A KR 20120031224 A KR20120031224 A KR 20120031224A
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KR
South Korea
Prior art keywords
light
phosphor
light source
infrared
rare earth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127001032A
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English (en)
Korean (ko)
Inventor
윌리암 로스 라포포트
제임스 케인
기린 티. 카스테리노
Original Assignee
허니웰 인터내셔널 인코포레이티드
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Application filed by 허니웰 인터내셔널 인코포레이티드 filed Critical 허니웰 인터내셔널 인코포레이티드
Publication of KR20120031224A publication Critical patent/KR20120031224A/ko
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/015Manufacture or treatment of bond wires
    • H10W72/01515Forming coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Respiratory Apparatuses And Protective Means (AREA)
KR1020127001032A 2009-06-19 2010-06-15 인광 변환 적외선 led Ceased KR20120031224A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US21853109P 2009-06-19 2009-06-19
US61/218,531 2009-06-19
US12/791,021 2010-06-01
US12/791,021 US8426871B2 (en) 2009-06-19 2010-06-01 Phosphor converting IR LEDs

Publications (1)

Publication Number Publication Date
KR20120031224A true KR20120031224A (ko) 2012-03-30

Family

ID=43353489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127001032A Ceased KR20120031224A (ko) 2009-06-19 2010-06-15 인광 변환 적외선 led

Country Status (6)

Country Link
US (2) US8426871B2 (https=)
EP (1) EP2443676A4 (https=)
JP (1) JP2012531043A (https=)
KR (1) KR20120031224A (https=)
CN (1) CN102804423A (https=)
WO (1) WO2010147925A2 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396310B (zh) * 2009-10-02 2013-05-11 億光電子工業股份有限公司 發光二極體結構
EP2613077A4 (en) * 2010-08-31 2014-03-05 Toshiba Lighting & Technology LENS, LIGHTING SYSTEM, BULB LIGHT AND LIGHTING LIGHT
WO2012151593A1 (en) * 2011-05-05 2012-11-08 Rutgers, The State University Of New Jersey Multifunctional infrared-emitting composites
DE102011113963A1 (de) * 2011-09-21 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
SG2012068508A (en) * 2012-09-13 2014-04-28 Schneider Electric South East Asia Hq Pte Ltd A relay and a method for indicating a relay failure
US10299441B2 (en) 2013-01-11 2019-05-28 Signify Holding B.V. Horticulture lighting device and a method to stimulate plant growth and bio-rhythm of a plant
DE102013106573B4 (de) * 2013-06-24 2021-12-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes optoelektronisches Bauelement, Gassensor mit strahlungsemittierenden optoelektronischen Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden optoelektronischen Bauelements
DE102014107321B4 (de) * 2014-05-23 2019-06-27 Tailorlux Gmbh Infrarot LED
DE102014112681A1 (de) * 2014-09-03 2016-03-03 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Blitzlicht
CA2963171C (en) 2014-10-08 2022-01-18 GE Lighting Solutions, LLC Materials and optical components for color filtering in lighting apparatus
DE102015104237B4 (de) * 2015-03-20 2022-10-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
DE102015106757A1 (de) * 2015-04-30 2016-11-03 Osram Opto Semiconductors Gmbh Strahlungsemittierendes optoelektronisches Bauelement
CN105078411B (zh) * 2015-06-18 2017-11-24 京东方光科技有限公司 游泳穿戴设备及上肢穿戴设备
DE102015114661A1 (de) * 2015-09-02 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
CN105280774A (zh) * 2015-09-18 2016-01-27 华灿光电(苏州)有限公司 一种白光发光二极管及其制作方法
US10303246B2 (en) * 2016-01-20 2019-05-28 North Inc. Systems, devices, and methods for proximity-based eye tracking
CN109071324A (zh) * 2016-04-15 2018-12-21 株式会社小糸制作所 纳米复合材料及纳米复合材料的制造方法
CN206218163U (zh) * 2016-10-11 2017-06-06 深圳市其真实业有限公司 智能充气游泳衣
EP3542400B1 (en) * 2016-11-17 2021-06-09 Signify Holding B.V. Lighting device with uv led
WO2018143198A1 (ja) * 2017-01-31 2018-08-09 三菱ケミカル株式会社 発光装置、および蛍光体
EP3457444A1 (en) * 2017-09-19 2019-03-20 ams AG Phosphor-converted light-emitting device
CN109964324B (zh) * 2017-09-28 2021-11-12 亮锐控股有限公司 红外发射器件
CN110155276A (zh) * 2018-02-05 2019-08-23 青海新东联信息技术有限公司 一种防溺水自动救援装置
US11417806B2 (en) * 2018-07-30 2022-08-16 Lumileds Llc Dielectric mirror for broadband IR LEDs
CN109148672A (zh) * 2018-08-10 2019-01-04 国红(深圳)光电科技有限公司 一种近红外光学装置
JP6632108B1 (ja) 2018-09-28 2020-01-15 日本碍子株式会社 蛍光体素子、その製造方法および照明装置
US11262046B2 (en) * 2019-03-27 2022-03-01 Ngk Insulators, Ltd. Phosphor element, method for producing same, and lighting device
DE102019115351A1 (de) 2019-06-06 2020-12-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen
JP7323787B2 (ja) * 2019-07-31 2023-08-09 日亜化学工業株式会社 照明装置及び赤外線カメラ付き照明装置
EP3800675B1 (en) * 2019-10-01 2024-01-24 Lumileds LLC Swir pcled and phosphors emitting in the 1100 - 1700 nm range
KR20220094291A (ko) 2020-12-28 2022-07-06 삼성전자주식회사 Led 모듈 및 조명 장치
US12325815B2 (en) 2021-08-20 2025-06-10 Lumileds Llc Phosphor compositions and short wavelength infrared emitting pcLEDs emitting in the 1600-2200 nm wavelength range
US11809839B2 (en) 2022-01-18 2023-11-07 Robert Lyden Computer language and code for application development and electronic and optical communication
WO2024208701A1 (en) * 2023-04-04 2024-10-10 Ams-Osram International Gmbh Optoelectronic component, method for producing an optoelectronic component, and use of an optoelectronic component

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757147A (en) * 1971-05-18 1973-09-04 Cambridge Thermionic Corp Stepping motor
US3757174A (en) 1972-07-31 1973-09-04 Sharp Kk Light emitting four layer semiconductor
JPS512393A (https=) 1974-06-24 1976-01-09 Hitachi Ltd
US4176418A (en) * 1977-11-14 1979-12-04 Scott Lawrence S Apparatus for automatic inflation of diver flotation means
DE3379525D1 (en) 1982-12-27 1989-05-03 Mitsubishi Monsanto Chem Epitaxial wafer for use in the production of an infrared led
JP2770708B2 (ja) * 1992-06-30 1998-07-02 日亜化学工業株式会社 赤色ないし赤外発光蛍光体及びこれを用いた液晶ライトバルブcrt
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US5831268A (en) 1996-11-25 1998-11-03 Morita; Yoshimitsu Sensing device for reflective clear material using infrared LED
US5865529A (en) 1997-03-10 1999-02-02 Yan; Ellis Light emitting diode lamp having a spherical radiating pattern
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5962971A (en) 1997-08-29 1999-10-05 Chen; Hsing LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights
US6252254B1 (en) 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
US6366018B1 (en) 1998-10-21 2002-04-02 Sarnoff Corporation Apparatus for performing wavelength-conversion using phosphors with light emitting diodes
TW433551U (en) 1999-10-26 2001-05-01 You Shang Hua Improvement of cup base for light emitting diode chip
US6513949B1 (en) 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
TW498561B (en) 2000-05-04 2002-08-11 Mu-Jin You Light emitting diode, manufacturing method and metal substrate for the same
JP2001352101A (ja) 2000-06-06 2001-12-21 Nichia Chem Ind Ltd 発光装置
US6682331B1 (en) * 2002-09-20 2004-01-27 Agilent Technologies, Inc. Molding apparatus for molding light emitting diode lamps
US6744077B2 (en) * 2002-09-27 2004-06-01 Lumileds Lighting U.S., Llc Selective filtering of wavelength-converted semiconductor light emitting devices
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
WO2005103562A2 (en) 2004-04-23 2005-11-03 Light Prescriptions Innovators, Llc Optical manifold for light-emitting diodes
US20060038198A1 (en) 2004-08-23 2006-02-23 Chua Janet B Y Device and method for producing output light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material
EP1798270A1 (en) 2004-09-22 2007-06-20 Japan Science and Technology Agency Water-soluble fluorescent material and method for producing same
JP4649641B2 (ja) * 2004-11-26 2011-03-16 株式会社フジクラ アルファサイアロン蛍光体とその製造方法、アルファサイアロン蛍光体原料粉末及び発光ダイオードランプ
JP2006152958A (ja) 2004-11-30 2006-06-15 Shimadzu Corp ターボ分子ポンプ
EP1913646A1 (de) 2005-08-11 2008-04-23 Merck Patent GmbH Photonisches material mit regelmässig angeordneten kavitäten
SE532215C2 (sv) * 2005-11-18 2009-11-17 Consensum As Skyddsmetod och säkerhetsanordning vid SCUBA-dykning
TWM294622U (en) 2006-01-12 2006-07-21 Genius Electronic Optical Co Ltd Collimating lens of the LED lamp
JP2008124168A (ja) 2006-11-10 2008-05-29 Matsushita Electric Ind Co Ltd 半導体発光装置
US8297061B2 (en) * 2007-08-02 2012-10-30 Cree, Inc. Optoelectronic device with upconverting luminophoric medium
JP2009065145A (ja) * 2007-08-10 2009-03-26 Mitsubishi Chemicals Corp 半導体発光装置、バックライトおよびカラー画像表示装置
KR101055769B1 (ko) * 2007-08-28 2011-08-11 서울반도체 주식회사 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치
US7663095B2 (en) * 2007-09-20 2010-02-16 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Photodetector with embedded infrared filter
US20100052922A1 (en) * 2008-05-28 2010-03-04 Alexander Roger Deas Rebreather oxygen risk alarm
JP2010097829A (ja) * 2008-10-16 2010-04-30 Stanley Electric Co Ltd 照明装置および車両用灯具

Also Published As

Publication number Publication date
CN102804423A (zh) 2012-11-28
WO2010147925A2 (en) 2010-12-23
EP2443676A4 (en) 2014-10-15
US20120274471A1 (en) 2012-11-01
US20100320480A1 (en) 2010-12-23
WO2010147925A3 (en) 2011-03-17
JP2012531043A (ja) 2012-12-06
US8426871B2 (en) 2013-04-23
EP2443676A2 (en) 2012-04-25

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