CN102804423A - 磷光体转换ir led - Google Patents

磷光体转换ir led Download PDF

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Publication number
CN102804423A
CN102804423A CN2010800365462A CN201080036546A CN102804423A CN 102804423 A CN102804423 A CN 102804423A CN 2010800365462 A CN2010800365462 A CN 2010800365462A CN 201080036546 A CN201080036546 A CN 201080036546A CN 102804423 A CN102804423 A CN 102804423A
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CN
China
Prior art keywords
light
phosphor
light source
rare earth
semiconductor chip
Prior art date
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Pending
Application number
CN2010800365462A
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English (en)
Chinese (zh)
Inventor
W.R.帕波波特
J.凯恩
K.T.卡斯特利诺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
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Honeywell International Inc
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Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of CN102804423A publication Critical patent/CN102804423A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Respiratory Apparatuses And Protective Means (AREA)
CN2010800365462A 2009-06-19 2010-06-15 磷光体转换ir led Pending CN102804423A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21853109P 2009-06-19 2009-06-19
US61/218531 2009-06-19
US12/791021 2010-06-01
US12/791,021 US8426871B2 (en) 2009-06-19 2010-06-01 Phosphor converting IR LEDs
PCT/US2010/038587 WO2010147925A2 (en) 2009-06-19 2010-06-15 Phosphor converting ir leds

Publications (1)

Publication Number Publication Date
CN102804423A true CN102804423A (zh) 2012-11-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800365462A Pending CN102804423A (zh) 2009-06-19 2010-06-15 磷光体转换ir led

Country Status (6)

Country Link
US (2) US8426871B2 (https=)
EP (1) EP2443676A4 (https=)
JP (1) JP2012531043A (https=)
KR (1) KR20120031224A (https=)
CN (1) CN102804423A (https=)
WO (1) WO2010147925A2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105280774A (zh) * 2015-09-18 2016-01-27 华灿光电(苏州）有限公司 一种白光发光二极管及其制作方法
CN106661447A (zh) * 2014-05-23 2017-05-10 泰勒鲁克斯股份有限公司 红外线led
CN109148672A (zh) * 2018-08-10 2019-01-04 国红（深圳）光电科技有限公司 一种近红外光学装置
CN109952651A (zh) * 2016-11-17 2019-06-28 昕诺飞控股有限公司 具有uv led的照明装置
TWI778134B (zh) * 2017-09-28 2022-09-21 荷蘭商露明控股公司 紅外線發射裝置

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SG2012068508A (en) * 2012-09-13 2014-04-28 Schneider Electric South East Asia Hq Pte Ltd A relay and a method for indicating a relay failure
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DE102014112681A1 (de) * 2014-09-03 2016-03-03 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Blitzlicht
CA2963171C (en) 2014-10-08 2022-01-18 GE Lighting Solutions, LLC Materials and optical components for color filtering in lighting apparatus
DE102015104237B4 (de) * 2015-03-20 2022-10-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
DE102015106757A1 (de) * 2015-04-30 2016-11-03 Osram Opto Semiconductors Gmbh Strahlungsemittierendes optoelektronisches Bauelement
CN105078411B (zh) * 2015-06-18 2017-11-24 京东方光科技有限公司 游泳穿戴设备及上肢穿戴设备
DE102015114661A1 (de) * 2015-09-02 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
US10303246B2 (en) * 2016-01-20 2019-05-28 North Inc. Systems, devices, and methods for proximity-based eye tracking
CN109071324A (zh) * 2016-04-15 2018-12-21 株式会社小糸制作所 纳米复合材料及纳米复合材料的制造方法
CN206218163U (zh) * 2016-10-11 2017-06-06 深圳市其真实业有限公司 智能充气游泳衣
WO2018143198A1 (ja) * 2017-01-31 2018-08-09 三菱ケミカル株式会社 発光装置、および蛍光体
EP3457444A1 (en) * 2017-09-19 2019-03-20 ams AG Phosphor-converted light-emitting device
CN110155276A (zh) * 2018-02-05 2019-08-23 青海新东联信息技术有限公司 一种防溺水自动救援装置
US11417806B2 (en) * 2018-07-30 2022-08-16 Lumileds Llc Dielectric mirror for broadband IR LEDs
JP6632108B1 (ja) 2018-09-28 2020-01-15 日本碍子株式会社 蛍光体素子、その製造方法および照明装置
US11262046B2 (en) * 2019-03-27 2022-03-01 Ngk Insulators, Ltd. Phosphor element, method for producing same, and lighting device
DE102019115351A1 (de) 2019-06-06 2020-12-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen
JP7323787B2 (ja) * 2019-07-31 2023-08-09 日亜化学工業株式会社 照明装置及び赤外線カメラ付き照明装置
EP3800675B1 (en) * 2019-10-01 2024-01-24 Lumileds LLC Swir pcled and phosphors emitting in the 1100 - 1700 nm range
KR20220094291A (ko) 2020-12-28 2022-07-06 삼성전자주식회사 Led 모듈 및 조명 장치
US12325815B2 (en) 2021-08-20 2025-06-10 Lumileds Llc Phosphor compositions and short wavelength infrared emitting pcLEDs emitting in the 1600-2200 nm wavelength range
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WO2024208701A1 (en) * 2023-04-04 2024-10-10 Ams-Osram International Gmbh Optoelectronic component, method for producing an optoelectronic component, and use of an optoelectronic component

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106661447A (zh) * 2014-05-23 2017-05-10 泰勒鲁克斯股份有限公司 红外线led
CN105280774A (zh) * 2015-09-18 2016-01-27 华灿光电(苏州）有限公司 一种白光发光二极管及其制作方法
CN109952651A (zh) * 2016-11-17 2019-06-28 昕诺飞控股有限公司 具有uv led的照明装置
CN109952651B (zh) * 2016-11-17 2023-10-10 昕诺飞控股有限公司 具有uv led的照明装置
TWI778134B (zh) * 2017-09-28 2022-09-21 荷蘭商露明控股公司 紅外線發射裝置
CN109148672A (zh) * 2018-08-10 2019-01-04 国红（深圳）光电科技有限公司 一种近红外光学装置

Also Published As

Publication number Publication date
WO2010147925A2 (en) 2010-12-23
EP2443676A4 (en) 2014-10-15
US20120274471A1 (en) 2012-11-01
KR20120031224A (ko) 2012-03-30
US20100320480A1 (en) 2010-12-23
WO2010147925A3 (en) 2011-03-17
JP2012531043A (ja) 2012-12-06
US8426871B2 (en) 2013-04-23
EP2443676A2 (en) 2012-04-25

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Application publication date: 20121128