KR20110057263A - 캐리어 기판 및 복수 개의 복사 방출 반도체 소자를 포함한 광전 모듈 및 그 제조 방법 - Google Patents

캐리어 기판 및 복수 개의 복사 방출 반도체 소자를 포함한 광전 모듈 및 그 제조 방법 Download PDF

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Publication number
KR20110057263A
KR20110057263A KR1020117009227A KR20117009227A KR20110057263A KR 20110057263 A KR20110057263 A KR 20110057263A KR 1020117009227 A KR1020117009227 A KR 1020117009227A KR 20117009227 A KR20117009227 A KR 20117009227A KR 20110057263 A KR20110057263 A KR 20110057263A
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Prior art keywords
emitting semiconductor
radiation emitting
radiation
contact surface
carrier substrate
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KR1020117009227A
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English (en)
Korean (ko)
Inventor
버트 브라우너
조르그 에리츠 소르그
칼 와이드너
월터 웨그레이터
올리버 우츠
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오스람 옵토 세미컨덕터스 게엠베하
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Publication of KR20110057263A publication Critical patent/KR20110057263A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6523—Cross-sectional shapes for connecting to pads at different heights at the same side of the package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
KR1020117009227A 2008-09-26 2009-08-25 캐리어 기판 및 복수 개의 복사 방출 반도체 소자를 포함한 광전 모듈 및 그 제조 방법 Ceased KR20110057263A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008049188.8 2008-09-26
DE102008049188A DE102008049188A1 (de) 2008-09-26 2008-09-26 Optoelektronisches Modul mit einem Trägersubstrat und einer Mehrzahl von strahlungsemittierenden Halbleiterbauelementen und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
KR20110057263A true KR20110057263A (ko) 2011-05-31

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KR1020117009227A Ceased KR20110057263A (ko) 2008-09-26 2009-08-25 캐리어 기판 및 복수 개의 복사 방출 반도체 소자를 포함한 광전 모듈 및 그 제조 방법

Country Status (8)

Country Link
US (2) US8461604B2 (enExample)
EP (1) EP2297780B1 (enExample)
JP (1) JP2012503866A (enExample)
KR (1) KR20110057263A (enExample)
CN (1) CN102165588B (enExample)
DE (1) DE102008049188A1 (enExample)
TW (1) TWI438888B (enExample)
WO (1) WO2010034278A1 (enExample)

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US9195358B1 (en) * 2014-04-16 2015-11-24 Eastman Kodak Company Z-fold multi-element substrate structure
DE102016208431A1 (de) * 2016-05-17 2017-11-23 Osram Opto Semiconductors Gmbh Anordnung mit einem elektrischen Bauteil
DE102018120637A1 (de) * 2018-08-23 2020-02-27 Osram Opto Semiconductors Gmbh Leiterplatte und verfahren zur herstellung einer leiterplatte mit mindestens einem in die leiterplatte integrierten optoelektronischen bauelement
DE102019100794A1 (de) 2018-12-20 2020-06-25 Osram Opto Semiconductors Gmbh Laservorrichtung und verfahren zur herstellung einer laservorrichtung
DE102019114315B4 (de) * 2019-05-28 2025-04-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anordnung und verfahren zur herstellung einer anordnung
KR102788934B1 (ko) * 2019-12-06 2025-03-31 삼성디스플레이 주식회사 발광 소자의 정렬 방법, 이를 이용한 표시 장치의 제조 방법 및 표시 장치

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Also Published As

Publication number Publication date
EP2297780A1 (de) 2011-03-23
US20140030829A1 (en) 2014-01-30
EP2297780B1 (de) 2019-06-12
WO2010034278A1 (de) 2010-04-01
CN102165588B (zh) 2013-09-25
US20110309377A1 (en) 2011-12-22
TWI438888B (zh) 2014-05-21
US8461604B2 (en) 2013-06-11
CN102165588A (zh) 2011-08-24
TW201019458A (en) 2010-05-16
JP2012503866A (ja) 2012-02-09
DE102008049188A1 (de) 2010-04-01

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