KR20110009793A - 기판 처리 장치 - Google Patents
기판 처리 장치 Download PDFInfo
- Publication number
- KR20110009793A KR20110009793A KR1020090067173A KR20090067173A KR20110009793A KR 20110009793 A KR20110009793 A KR 20110009793A KR 1020090067173 A KR1020090067173 A KR 1020090067173A KR 20090067173 A KR20090067173 A KR 20090067173A KR 20110009793 A KR20110009793 A KR 20110009793A
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- KR
- South Korea
- Prior art keywords
- substrate
- substrate processing
- arms
- processing apparatus
- transfer device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
- 프레임,일단이 상기 프레임에 결합된 이동수단에 연결되고 타단이 자유단으로 제공되어 외부에 배치된 로딩 장치에 의하여 기판을 전달받아 이동시키는 반송 장치,상기 반송 장치로부터 상기 기판을 전달받아 승, 하강 방향으로 이동시키는 제1 승, 하강 장치,상기 반송 장치와 다른 층에 설치되며 상기 제1 승, 하강 장치로부터 상기 기판을 전달받아 이동시키는 제1 이송 장치,상기 제1 이송 장치로부터 상기 기판을 공급받아 처리하는 기판 처리 유닛,상기 기판 처리 유닛에서 처리된 상기 기판을 전달받아 이송시키는 제2 이송 장치, 그리고상기 제2 이송 장치로부터 전달받은 상기 기판을 승, 하강시켜 상기 반송 장치에 전달하는 제2 승, 하강 장치를 포함하는 기판 처리 장치.
- 청구항 1에 있어서,상기 이동 수단은 리니어 모듈로 이루어지는 기판 처리 장치.
- 청구항 1에 있어서,상기 반송 장치는상기 이동 수단에는 이동부재가 제공되고,상기 이동부재에 결합되는 연결부재,상기 연결부재에 결합되며 상기 기판이 올려지는 암들,을 포함하는 기판 처리 장치.
- 청구항 3에 있어서,상기 연결부재에는상기 암들의 반대측에 배치되는 밸런스 웨이트가 제공되는 기판 처리 장치.
- 청구항 3에 있어서,상기 암들은상기 기판들이 자세를 유지할 수 있도록 스토퍼가 제공되는 기판 처리 장치.
- 청구항 3에 있어서,상기 반송장치는상기 암들을 회전시키는 회전수단을 더 포함하는 기판 처리 장치.
- 청구항 6에 있어서,상기 회전수단은상기 이동부재에 결합되는 지지부재,상기 지지부재에 결합되며 상기 기판이 올려지는 암들,상기 지지부재에 설치되어 상기 암들을 회전시키는 구동 수단을 포함하는 기판 처리 장치.
- 청구항 7에 있어서,상기 구동수단은상기 지지부재에 설치되는 모터,상기 지지부재에 배치되며 상기 모터에 의하여 상기 암들을 회전시키는 기어 어셈블리를 포함하는 기판 처리 장치.
- 청구항 3에 있어서,상기 암들은상기 기판을 일정한 높이로 올려진 상태로 지지하는 지지핀들이 제공되는 기판 처리 장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090067173A KR101105416B1 (ko) | 2009-07-23 | 2009-07-23 | 기판 처리 장치 |
TW099115090A TWI413204B (zh) | 2009-07-23 | 2010-05-12 | 基板處理裝置 |
CN2010101805936A CN101964318B (zh) | 2009-07-23 | 2010-05-14 | 基板处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090067173A KR101105416B1 (ko) | 2009-07-23 | 2009-07-23 | 기판 처리 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110009793A true KR20110009793A (ko) | 2011-01-31 |
KR101105416B1 KR101105416B1 (ko) | 2012-01-17 |
Family
ID=43517153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090067173A KR101105416B1 (ko) | 2009-07-23 | 2009-07-23 | 기판 처리 장치 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101105416B1 (ko) |
CN (1) | CN101964318B (ko) |
TW (1) | TWI413204B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113071900A (zh) * | 2020-01-03 | 2021-07-06 | 显示器生产服务株式会社 | 基板传送装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102402060B (zh) * | 2011-11-18 | 2015-04-15 | 深圳市华星光电技术有限公司 | 平板显示装置、立体显示装置以及等离子显示装置 |
US8872995B2 (en) | 2011-11-18 | 2014-10-28 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Flat panel display device, stereoscopic display device, and plasma display device |
CN105319219B (zh) * | 2014-07-23 | 2019-05-14 | 塞米西斯科株式会社 | 不良检查系统及其方法 |
CN105331369B (zh) * | 2015-11-12 | 2018-06-12 | 石家庄诚志永华显示材料有限公司 | 含有2,4-二氟苯基团化合物的液晶介质及应用 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3711189B2 (ja) * | 1997-05-23 | 2005-10-26 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
JPH1154588A (ja) * | 1997-07-30 | 1999-02-26 | Tokyo Electron Ltd | 基板搬送装置およびそれを用いた基板処理装置 |
JP4770041B2 (ja) * | 2001-03-26 | 2011-09-07 | 東レ株式会社 | 基板搬送用ハンドおよびカラーフィルター製造装置 |
KR100500170B1 (ko) * | 2003-06-25 | 2005-07-07 | 주식회사 디엠에스 | 기판의 수평 및 상하 이송장치 |
KR100555619B1 (ko) * | 2003-10-06 | 2006-03-03 | 주식회사 디엠에스 | 2단 승하강 기판이송장치 및 이 기판이송장치가 적용된기판처리장치 |
JP2006128188A (ja) * | 2004-10-26 | 2006-05-18 | Nikon Corp | 基板搬送装置、基板搬送方法および露光装置 |
JP4313284B2 (ja) * | 2004-11-15 | 2009-08-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100949502B1 (ko) * | 2005-06-20 | 2010-03-24 | 엘지디스플레이 주식회사 | 액정표시장치 제조 공정용 기판 반송장치 |
KR100674882B1 (ko) * | 2005-10-24 | 2007-01-29 | 주식회사 디엠에스 | 기판 이송용 트랜스퍼 |
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2009
- 2009-07-23 KR KR1020090067173A patent/KR101105416B1/ko active IP Right Grant
-
2010
- 2010-05-12 TW TW099115090A patent/TWI413204B/zh active
- 2010-05-14 CN CN2010101805936A patent/CN101964318B/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113071900A (zh) * | 2020-01-03 | 2021-07-06 | 显示器生产服务株式会社 | 基板传送装置 |
CN113071900B (zh) * | 2020-01-03 | 2022-08-26 | 显示器生产服务株式会社 | 基板传送装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101105416B1 (ko) | 2012-01-17 |
TW201104782A (en) | 2011-02-01 |
TWI413204B (zh) | 2013-10-21 |
CN101964318B (zh) | 2012-10-24 |
CN101964318A (zh) | 2011-02-02 |
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