KR20110002432A - 플라즈마 처리 동안 작업편을 지지하기 위한 장치 및 방법 - Google Patents
플라즈마 처리 동안 작업편을 지지하기 위한 장치 및 방법 Download PDFInfo
- Publication number
- KR20110002432A KR20110002432A KR1020100062506A KR20100062506A KR20110002432A KR 20110002432 A KR20110002432 A KR 20110002432A KR 1020100062506 A KR1020100062506 A KR 1020100062506A KR 20100062506 A KR20100062506 A KR 20100062506A KR 20110002432 A KR20110002432 A KR 20110002432A
- Authority
- KR
- South Korea
- Prior art keywords
- workpieces
- carrier plate
- annular
- plasma
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/855—Coating only part of a support with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/496,369 US10026436B2 (en) | 2009-07-01 | 2009-07-01 | Apparatus and methods for supporting workpieces during plasma processing |
| US12/496,369 | 2009-07-01 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170172237A Division KR101925279B1 (ko) | 2009-07-01 | 2017-12-14 | 플라즈마 처리 동안 작업편을 지지하기 위한 장치 및 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20110002432A true KR20110002432A (ko) | 2011-01-07 |
Family
ID=43412054
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100062506A Ceased KR20110002432A (ko) | 2009-07-01 | 2010-06-30 | 플라즈마 처리 동안 작업편을 지지하기 위한 장치 및 방법 |
| KR1020170172237A Expired - Fee Related KR101925279B1 (ko) | 2009-07-01 | 2017-12-14 | 플라즈마 처리 동안 작업편을 지지하기 위한 장치 및 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170172237A Expired - Fee Related KR101925279B1 (ko) | 2009-07-01 | 2017-12-14 | 플라즈마 처리 동안 작업편을 지지하기 위한 장치 및 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10026436B2 (enExample) |
| JP (1) | JP5758594B2 (enExample) |
| KR (2) | KR20110002432A (enExample) |
| CN (1) | CN101944366B (enExample) |
| SG (1) | SG186675A1 (enExample) |
| TW (1) | TWI536447B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9685186B2 (en) * | 2009-02-27 | 2017-06-20 | Applied Materials, Inc. | HDD pattern implant system |
| US8556566B1 (en) * | 2011-09-30 | 2013-10-15 | WD Media, LLC | Disk stacking method and apparatus |
| KR101419515B1 (ko) * | 2012-09-24 | 2014-07-15 | 피에스케이 주식회사 | 배플 및 배플의 표면처리장치, 그리고 기판 처리 장치 및 표면 처리 방법 |
| CN105529283B (zh) * | 2014-09-29 | 2020-06-30 | 盛美半导体设备(上海)股份有限公司 | 晶圆的双面气相刻蚀装置 |
| SG11202100703SA (en) * | 2018-07-30 | 2021-02-25 | Nordson Corp | Systems for workpiece processing with plasma |
| JP2022538202A (ja) * | 2020-05-22 | 2022-09-01 | フン リ,チャン | 大気圧プラズマ発生装置を用いた円筒状及び環状の被処理物の表面処理システム及び方法 |
| KR102440727B1 (ko) * | 2020-12-17 | 2022-09-05 | 현대자동차주식회사 | 소음 및 진동 측정 장치 및 이를 이용한 소음 및 진동 측정 방법 |
| DE102021003330B3 (de) | 2021-06-28 | 2022-09-01 | Singulus Technologies Aktiengesellschaft | Substratträger |
| DE102021003326B3 (de) | 2021-06-28 | 2022-09-08 | Singulus Technologies Aktiengesellschaft | Substratträger |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3469686A (en) * | 1967-02-08 | 1969-09-30 | Monsanto Co | Retaining trays for semiconductor wafers and the like |
| US4735701A (en) * | 1984-08-21 | 1988-04-05 | Komag, Inc. | Disk carrier |
| US4634512A (en) * | 1984-08-21 | 1987-01-06 | Komag, Inc. | Disk and plug |
| US4595481A (en) * | 1984-08-21 | 1986-06-17 | Komag, Inc. | Disk carrier |
| JPS62240879A (ja) | 1986-04-14 | 1987-10-21 | Mitsubishi Electric Corp | 観測デ−タの位置決定方法 |
| JPS63287933A (ja) | 1987-05-21 | 1988-11-25 | Canon Inc | 交換レンズのレンズキヤツプ |
| DE68926577T2 (de) * | 1988-03-30 | 1996-10-02 | Rohm Co Ltd | Einrichtung zur Molekularstrahlepitaxie |
| JPH04173974A (ja) | 1990-11-02 | 1992-06-22 | Tdk Corp | 反応性連続スパッタ方法、磁気ディスクの製造方法および基板搬送用トレー |
| EP0577766B1 (en) * | 1991-04-04 | 1999-12-29 | Seagate Technology, Inc. | Apparatus and method for high throughput sputtering |
| US5244555A (en) * | 1991-11-27 | 1993-09-14 | Komag, Inc. | Floating pocket memory disk carrier, memory disk and method |
| DE4203456A1 (de) | 1992-02-07 | 1993-08-12 | Basf Ag | Verfahren zur kontinuierlichen herstellung von 3-cyano-3,5,5-trimethylcyclohexanon |
| JP3273979B2 (ja) | 1992-10-06 | 2002-04-15 | 株式会社アルバック | 両面同時エッチング装置 |
| JPH10324980A (ja) | 1997-05-27 | 1998-12-08 | Ulvac Japan Ltd | 両面エッチング装置用電極装置 |
| DE19847101C1 (de) * | 1998-10-13 | 2000-05-18 | Wacker Siltronic Halbleitermat | CVD-Reaktor und Verfahren zur Herstellung einer mit einer epitaktischen Schicht versehenen Halbleiterscheibe |
| JP4537566B2 (ja) * | 2000-12-07 | 2010-09-01 | 大陽日酸株式会社 | 基板回転機構を備えた成膜装置 |
| US6900881B2 (en) * | 2002-07-11 | 2005-05-31 | Molecular Imprints, Inc. | Step and repeat imprint lithography systems |
| US7942971B2 (en) * | 2003-04-04 | 2011-05-17 | Panasonic Corporation | Method of manufacturing plasma display panels |
| US6805054B1 (en) * | 2003-05-14 | 2004-10-19 | Molecular Imprints, Inc. | Method, system and holder for transferring templates during imprint lithography processes |
| US7235139B2 (en) * | 2003-10-28 | 2007-06-26 | Veeco Instruments Inc. | Wafer carrier for growing GaN wafers |
| US7547504B2 (en) * | 2004-09-21 | 2009-06-16 | Molecular Imprints, Inc. | Pattern reversal employing thick residual layers |
| WO2007043528A1 (ja) * | 2005-10-12 | 2007-04-19 | Matsushita Electric Industrial Co., Ltd. | プラズマ処理装置、プラズマ処理方法、及びトレイ |
| US20070241454A1 (en) * | 2006-04-13 | 2007-10-18 | Jun-Ming Chen | Capture ring |
| US8852349B2 (en) * | 2006-09-15 | 2014-10-07 | Applied Materials, Inc. | Wafer processing hardware for epitaxial deposition with reduced auto-doping and backside defects |
| JP2008159097A (ja) * | 2006-12-20 | 2008-07-10 | Hitachi Ltd | 基板ホルダ及び基板のエッチング方法及び磁気記録媒体の製造方法 |
| JP2009116927A (ja) | 2007-11-02 | 2009-05-28 | Hitachi High-Technologies Corp | ディスク反転機構、ディスクの表面処理方法およびディスクの表面処理装置 |
-
2009
- 2009-07-01 US US12/496,369 patent/US10026436B2/en not_active Expired - Fee Related
-
2010
- 2010-06-24 SG SG2012093902A patent/SG186675A1/en unknown
- 2010-06-30 KR KR1020100062506A patent/KR20110002432A/ko not_active Ceased
- 2010-07-01 JP JP2010151009A patent/JP5758594B2/ja not_active Expired - Fee Related
- 2010-07-01 TW TW099121708A patent/TWI536447B/zh not_active IP Right Cessation
- 2010-07-01 CN CN201010221024.1A patent/CN101944366B/zh not_active Expired - Fee Related
-
2017
- 2017-12-14 KR KR1020170172237A patent/KR101925279B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20110000882A1 (en) | 2011-01-06 |
| TW201123297A (en) | 2011-07-01 |
| CN101944366B (zh) | 2015-08-19 |
| TWI536447B (zh) | 2016-06-01 |
| JP2011014229A (ja) | 2011-01-20 |
| KR101925279B1 (ko) | 2018-12-06 |
| SG186675A1 (en) | 2013-01-30 |
| JP5758594B2 (ja) | 2015-08-05 |
| CN101944366A (zh) | 2011-01-12 |
| US10026436B2 (en) | 2018-07-17 |
| KR20170141637A (ko) | 2017-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101925279B1 (ko) | 플라즈마 처리 동안 작업편을 지지하기 위한 장치 및 방법 | |
| JP7693762B2 (ja) | 基板処理装置 | |
| US8940098B2 (en) | Method for distributing gas for a bevel etcher | |
| US6339206B1 (en) | Apparatus and method for adjusting density distribution of a plasma | |
| CN103824569B (zh) | Hdd图案布植系统 | |
| JP7752202B2 (ja) | 基板支持器、プラズマ処理装置、及び基板処理装置 | |
| CN102640216A (zh) | 处理硬盘驱动器基板的腔室 | |
| US20170018407A1 (en) | Plasma processing apparatus and plasma processing method | |
| US8956512B2 (en) | Magnetron sputtering apparatus and film forming method | |
| JP2018186179A (ja) | 基板処理装置及び基板取り外し方法 | |
| JP4757856B2 (ja) | プラズマ処理装置 | |
| KR20040025657A (ko) | 일체형 쉴드를 가진 받침대 | |
| JPS6049628A (ja) | 反応性イオン・エツチング装置 | |
| US20080087631A1 (en) | Ion gun, ion beam etching apparatus, ion beam etching facility, etching method, and method for manufacturing magnetic recording medium | |
| JP2010192488A (ja) | プラズマ処理装置 | |
| US20030047536A1 (en) | Method and apparatus for distributing gas within high density plasma process chamber to ensure uniform plasma | |
| JP2008159097A (ja) | 基板ホルダ及び基板のエッチング方法及び磁気記録媒体の製造方法 | |
| JP4628874B2 (ja) | プラズマ処理装置及び電位制御装置 | |
| JP3273979B2 (ja) | 両面同時エッチング装置 | |
| JPH07245194A (ja) | プラズマ処理方法及び装置 | |
| KR20240121860A (ko) | 플라스마 처리 장치 | |
| JPH06116761A (ja) | 両面同時エッチング装置 | |
| JP2000064044A (ja) | 枚葉式マグネトロンスパッタ装置 | |
| HK1033292B (en) | Apparatus and method for adjusting density distribution of a plasma | |
| JPH01165122A (ja) | エツチング装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20100630 |
|
| AMND | Amendment | ||
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| AMND | Amendment | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20150623 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20100630 Comment text: Patent Application |
|
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20160930 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20170530 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20160930 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| AMND | Amendment | ||
| PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20170530 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20161230 Comment text: Amendment to Specification, etc. Patent event code: PX09012R01I Patent event date: 20150623 Comment text: Amendment to Specification, etc. Patent event code: PX09012R01I Patent event date: 20100827 Comment text: Amendment to Specification, etc. |
|
| PX0601 | Decision of rejection after re-examination |
Comment text: Decision to Refuse Application Patent event code: PX06014S01D Patent event date: 20170919 Comment text: Amendment to Specification, etc. Patent event code: PX06012R01I Patent event date: 20170828 Comment text: Decision to Refuse Application Patent event code: PX06011S01I Patent event date: 20170530 Comment text: Amendment to Specification, etc. Patent event code: PX06012R01I Patent event date: 20161230 Comment text: Notification of reason for refusal Patent event code: PX06013S01I Patent event date: 20160930 Comment text: Amendment to Specification, etc. Patent event code: PX06012R01I Patent event date: 20150623 Comment text: Amendment to Specification, etc. Patent event code: PX06012R01I Patent event date: 20100827 |
|
| PA0107 | Divisional application |
Comment text: Divisional Application of Patent Patent event date: 20171214 Patent event code: PA01071R01D |