KR20100139087A - Chip peeling method, semiconductor device manufacturing method and chip peeling apparatus - Google Patents

Chip peeling method, semiconductor device manufacturing method and chip peeling apparatus Download PDF

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Publication number
KR20100139087A
KR20100139087A KR1020107023965A KR20107023965A KR20100139087A KR 20100139087 A KR20100139087 A KR 20100139087A KR 1020107023965 A KR1020107023965 A KR 1020107023965A KR 20107023965 A KR20107023965 A KR 20107023965A KR 20100139087 A KR20100139087 A KR 20100139087A
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chip
movable stage
stage
adhesive sheet
height
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KR1020107023965A
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Korean (ko)
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KR101199298B1 (en
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아키라 나카츠
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캐논 머시너리 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Abstract

The chip | tip peeling apparatus which can reduce the crack in the stress at the time of sliding, and can peel easily and take out the chip | tip to peel is provided. It is a chip peeling method which peels the chip | tip 11 from the adhesive sheet 12 which attached the chip | tip 11 to the upper surface. On the surface of the movable stage 17 protruding by the first height from the base stage 16, the adhesive sheet 12 having the chip 11 attached thereto is disposed so that the chip 11 corresponds, and the base stage 16 is adhered to the base stage 16. Negative pressure is introduced into the space portion 19 formed between the sheets 12 to lower the movable stage 17 to a position lower than the first height, and is adhered by sliding the movable stage 17 with respect to the base stage 16. The chip 11 is peeled from the sheet 12.

Description

Chip Peeling Method, Semiconductor Device Manufacturing Method, and Chip Peeling Device {CHIP PEELING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND CHIP PEELING APPARATUS}

The present invention relates to a chip peeling method, a method for manufacturing a semiconductor device using the chip peeling method, and a chip peeling device.

In the manufacturing process of a semiconductor device, it is necessary to pick up the diced semiconductor chip (henceforth a chip) from an adhesive sheet. As a conventional chip peeling apparatus, there is provided a stage for holding an adhesive sheet, a push-up stage moving forward and backward, and a needle pushed up by the push-up stage. That is, it is comprised so that the adhesive sheet of a stage may be pushed out from the back surface side by the needle pushed up by the pushing-up stand, and the chip | tip is removed from the adhesive sheet.

However, in a chip peeling apparatus using a needle, the adhesive tape may tear when the needle pushes the chip off and peels off from the adhesive sheet, and in such a case, there is a risk of damaging the back surface of the chip. In addition, the length of each needle is increased by abrasion or damage, and the chip is inclined to be pushed up, so that neighboring chips may collide with each other and be damaged.

In addition, the chip is adsorbed by the collet and taken out. However, when the chip is inclined and pushed up, the adsorption miss of the chip by the collet occurs. Missing chip adsorption of the collet will interfere with subsequent work. In addition, the chip may be damaged by pushing up the needle.

Therefore, the chip | tip peeling apparatus (patent document 1) which does not use such a needle is proposed in recent years. This chip peeling apparatus is equipped with the base stage 3 which hold | maintains the adhesive sheet 2 with which the chip 1 is attached, as shown to FIG. 6 (A). The base stage 3 is also provided with a movable stage 4 whose top surface 4a protrudes from the base stage upper surface 3a. For this reason, the clearance gap 6 is formed in the outer peripheral side of the movable stage 4 with the adhesive sheet 2. In the base stage 3, suction holes, not shown, which communicate with the gap 6 are formed.

Next, the pick-up method using the said chip peeling apparatus is demonstrated. First, the adhesive sheet 2 is sucked through the suction hole in the state in which the chip 1 is attracted (held) by the collet (adsorption collet) 7 from above. For this reason, air of the clearance gap 6 is attracted, the adhesive sheet 2 around the movable stage 4 is attracted, and the adhesive sheet 2 is peeled off in the outer peripheral side of the chip 1. In this case, a step of S0 occurs on the upper surface 4a of the movable stage 4 and the upper surface 3a of the base stage 3. That is, the upper surface 4a of the movable stage 4 is located higher by S0 in the vertical direction than the upper surface 3a of the base stage 3.

Thereafter, as shown in FIG. 6 (B), the movable stage 4 is moved in the direction of the arrow in a state where there is a step difference S0 between the upper surface 4a of the movable stage and the upper surface 3a of the base stage 3. . For this reason, the support area of the chip 1 supported by the movable stage 4 decreases, the adsorption (suction) area of the adhesive sheet 2 increases, and finally the adhesive sheet ( 2) can be completely peeled off.

Japanese Patent No. 3209736

By the way, in the case of using the said chip | tip peeling apparatus, in the initial stage of peeling, it is necessary to peel the adhesive sheet 2 of the peripheral part of the chip | tip 1 by adsorption. Since the adhesion part is strong by the stress at the time of dicing, since the periphery of the chip | tip 1 of the adhesive sheet 2 has a larger stress than the other place is needed in order to peel. For this reason, when the protrusion amount from the base stage upper surface 3a of the upper surface 4a of the movable stage 4 is enlarged, the stress which peels the adhesive sheet 2 becomes large, and the adhesive sheet 2 of the peripheral edge part of the movable stage 4 is increased. ) Can be peeled off.

When peeling the adhesive sheet 2, big bending is given to the chip 1 by the big stress which can peel a chip | tip peripheral part, ie, a high step | step, and the sliding operation | movement is performed in the state which maintained this step | step. However, a large peeling force is required at the peripheral edge of the chip 1, while at the non-circumferential edge part, a large peeling force is not required as in the peripheral edge portion, and the peeling strength is the back surface of the chip 1. Not uniform at At this time, if a sliding operation is applied while maintaining a high step, a large bending and a dynamically twisting stress are applied to another chip adjacent to the chip 1 to be peeled off. If such a stress is applied, the other chip 1 adjacent to the chip 1 to be peeled off may be largely bent and broken.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a chip peeling device that can reduce cracking in the stress at the time of sliding and can easily peel and take out chips to be peeled off.

The chip peeling method of this invention is a chip peeling method which peels the said chip from the adhesive sheet which affixed the chip on the upper surface, WHEREIN: The chip | tip is attached so that a chip may correspond to the surface of the movable stage which protruded by the 1st height from an expectation stage. After arranging the pressure sensitive adhesive sheet, a negative pressure is introduced into the space portion formed between the base stage and the pressure sensitive adhesive sheet, and then the movable stage is lowered to a position lower than the first height and higher than the movable stage to cause the movable stage. The chip is peeled from the pressure-sensitive adhesive sheet by sliding with respect to the base stage.

According to the chip peeling method of this invention, when the chip | tip which should peel at a 1st height is supported through an adhesive sheet, and a negative pressure is applied to the space part formed between the base stage and the adhesive sheet in the circumferential edge part of this movable stage, Peeling force can be provided. For this reason, an adhesive sheet is attracted in the peripheral part of a movable stage, and an adhesive sheet peels from a chip | tip. Thereafter, the step between the upper surface of the base stage and the upper surface of the movable stage is reduced by lowering the movable stage to a position lower than the first height. In this state, by moving the movable stage along the horizontal direction with respect to the base stage, the supporting area of the chip by the movable stage is reduced, the adsorption (suction) area of the adhesive sheet is increased, and the peeling range is widened. The adhesive sheet can be completely peeled off from the chip to be peeled off. For this reason, large bending and dynamic twisting stress are prevented from being applied to the adjacent chips by the low step, and the bending applied to the adjacent chips can be reduced.

The movable stage sliding position may be a position in which the movable stage is once raised to the first height and then lowered to the second position, which is the first position. Moreover, it can be set as the position which raised the movable stage to the 1st height once, and lowered to the 3rd height higher than the 2nd height which is an initial position. For this reason, the clearance gap between the upper surface of the base stage and the upper surface of the movable stage can be reliably increased before the sliding operation.

After completion of the lowering step of the movable stage, a horizontal sliding process of the movable stage can be performed. That is, the rise and fall of the movable stage and the sliding in the horizontal direction can be made independent. For this reason, a raise and fall operation and a sliding operation can be performed with high precision.

The manufacturing method of the semiconductor device of this invention manufactures a semiconductor device using the chip peeling method of the said invention.

The chip peeling apparatus of this invention is a chip peeling apparatus which peels the said chip | tip from the adhesive sheet which affixed the chip | tip to the upper surface, Comprising: The chip | tip corresponds to the expectation stage and the surface which protruded by the 1st height from the expectation stage. A movable stage for arranging the adhesive sheet to which the chip is attached, negative pressure supply means for introducing negative pressure into the space portion between the base stage and the pressure sensitive adhesive sheet from the negative pressure passage disposed on the base stage, and the negative pressure in the space portion. And a vertical movement means for lowering the movable stage to a height lower than the first height in a state where a negative pressure is supplied from a supply means, and sliding means for sliding the movable stage with respect to the base stage.

(Effects of the Invention)

In this invention, since the curvature provided to the adjacent chip | tip can be made small by a low step | step, the crack in the stress at the time of sliding can be reduced, and the chip | tip which needs to peel can be peeled off easily and can be taken out.

Once the movable stage is raised, the step difference between the upper surface of the base stage and the upper surface of the movable stage can be reliably formed before the adsorption, so that the peripheral edge portion can be stably peeled off. In addition, during the sliding, the step difference between the upper surface of the base stage and the upper surface of the movable stage is reduced, so that large bending can be prevented from being applied to adjacent chips, thereby further preventing chip breakage.

1A is a simplified plan view showing an initial state of a chip peeling method of an embodiment of the present invention.
1 (B) is a simplified plan view showing a peeling state of a chip peeling method of an embodiment of the present invention.
1 (C) is a simplified plan view showing a state after peeling of the chip peeling method of the embodiment of the present invention.
FIG. 2 (A) is a simplified cross-sectional view showing the chip peeling apparatus of the first embodiment of the present invention and showing the pickup initial state using this apparatus.
Fig. 2B is a simplified cross-sectional view showing the chip detachment apparatus according to the first embodiment of the present invention and showing the lowered state of the movable stage of the apparatus.
FIG. 2 (C) is a simplified cross-sectional view showing the chip detachment apparatus of the first embodiment of the present invention and showing the sliding state of the movable stage of the apparatus.
Fig. 2 (D) is a simplified cross-sectional view showing the chip peeling device of the first embodiment of the present invention and showing a state after sliding of the movable stage of the device.
Fig. 2E is a simplified cross-sectional view showing the chip peeling apparatus of the first embodiment of the present invention, showing the elevated state of the collet.
Fig. 2 (F) shows a chip peeling device of a first embodiment of the present invention and is a simplified cross-sectional view of the standby state of this device.
3 is a simplified plan view showing a chip attached to an adhesive sheet.
Fig. 4A is a simplified cross-sectional view showing the chip detachment apparatus according to the second embodiment of the present invention, showing the elevated state of the movable stage of the apparatus.
Fig. 4B is a simplified cross-sectional view showing the chip detachment apparatus according to the second embodiment of the present invention, showing the rise after the movable stage of the apparatus.
4 (C) is a simplified cross-sectional view showing the chip peeling device according to the second embodiment of the present invention and showing the lowered state of the movable stage of the device.
Fig. 4D is a simplified cross-sectional view showing the chip detachment apparatus according to the second embodiment of the present invention and showing the sliding state of the movable stage of the apparatus.
Fig. 4E is a simplified cross-sectional view showing the chip detachment apparatus according to the second embodiment of the present invention and showing a state after sliding of the movable stage of the apparatus.
Fig. 4F is a simplified cross-sectional view showing the chip detachment apparatus according to the second embodiment of the present invention, showing the elevated state of the collet.
4 (G) shows a chip peeling device according to a second embodiment of the present invention, and is a simplified cross-sectional view of the standby state of the device.
5: (A) is a simplified cross section which shows the chip | tip peeling apparatus of 3rd Embodiment of this invention, and shows the raise state of the movable stage of this apparatus.
Fig. 5B is a simplified cross-sectional view showing the chip detachment apparatus according to the third embodiment of the present invention and showing the rise after the movable stage of the apparatus.
Fig. 5C is a simplified cross-sectional view showing the chip peeling device according to the third embodiment of the present invention and showing the lowered state of the movable stage of the device.
5: (D) is the simplified sectional drawing which shows the chip | tip peeling apparatus of 3rd Embodiment of this invention, and shows the sliding state of the movable stage of this apparatus.
Fig. 5E is a simplified cross-sectional view showing the chip detachment apparatus according to the third embodiment of the present invention and showing a state after sliding of the movable stage of the apparatus.
Fig. 5F is a simplified cross-sectional view showing the chip detachment apparatus according to the third embodiment of the present invention, showing the elevated state of the collet.
Fig. 5 (G) shows a chip peeling device of a third embodiment of the present invention and is a simplified cross-sectional view of the standby state of this device.
6A is a simplified cross-sectional view showing an initial state of a peeling process using a conventional chip peeling apparatus.
6B is a simplified cross-sectional view showing a peeling state of a peeling process using a conventional chip peeling apparatus.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on FIG.

The chip peeling apparatus of this invention is shown to FIG. 2 (A)-FIG. 2 (F). This chip peeling apparatus is a device which peels and extracts several rectangular thin semiconductor chips (henceforth simply a chip | tip) 11 adhering on the adhesive sheet 12 one by one from the said adhesive sheet 12 one by one.

The chip 11 is made of a wafer W (see FIG. 3) as a raw material, and is cut into a rectangular shape to form a final product. For this reason, the chip 11 has a square, rectangular shape, etc. That is, as shown in FIG. 3, the wafer W is generally circular, divided into chips 11 by dicing, and the chips 11 are attached to the adhesive sheet 12. Moreover, the frame 13 which consists of a ring body is affixed on the outer peripheral side of the adhesive sheet 12. As shown in FIG. That is, this frame 13 and the adhesive sheet 12 are integrated. And the chip | tip 11 is taken out by this chip peeling apparatus in the state in which the frame 13 and the adhesive sheet 12 were integrated.

As shown in FIG.2 (A)-FIG.2 (F), the chip | tip peeling apparatus is the holding | maintenance means 15 which hold | maintains the chip | tip 11 which should be peeled from upper direction, and the base stage by which the adhesive sheet 12 is mounted ( 16, the space part 19 formed between the movable stage 17 which supports the chip | tip 11 via the adhesive sheet 12, and the adhesive sheet 12 in the outer peripheral side of this movable stage 17. Negative pressure supply means for sucking air in the air; and driving means (not shown) for moving the movable stage 17. In the present invention, the driving means includes vertical moving means for raising and lowering the movable stage 17 and sliding means for sliding the movable stage 17. That is, the actuator which raises and lowers the movable stage 17, and the actuator which slides in the horizontal direction are provided separately, and the raising and lowering of the movable stage 17 and the sliding of a horizontal direction can be performed independently. For this reason, a raise and fall operation and a sliding operation can be performed with high precision.

The holding means 15 is comprised by the adsorption member (collet) 21 which has the head 20 which adsorb | sucks the chip | tip 11. As shown in FIG. The head 20 has a suction hole formed at its lower end surface 20a, and the chip 11 is vacuum sucked through the suction hole so that the chip 11 is sucked at the lower surface 20a of the head 20. . For this reason, when this vacuum suction (vacuum treatment) is released, the chip 11 is separated from the head 20. And this adsorption member 21 is connected to the arm of a robot, for example, and it is perpendicular direction (arrow C of FIG. 2 (E), arrow D direction of FIG. 2 (A)), horizontal direction (FIG. 2 (D)). Arrow B direction] and the direction which combined them are attained.

A recess 22 is formed on the upper surface of the base stage 16, and the movable stage 17 is disposed in the recess 22. The movable stage 17 is a rectangular flat body fitted into the recessed part 22. As shown in FIG. 1A, the width dimension W of the movable stage 17 is set smaller than the length (width dimension) W1 of one side of the square chip 11. In this case, one long side 17a of the movable stage 17 corresponds to the first side 23a of the chip 11 to be peeled off, and the other long side 17b of the movable stage 17 should be peeled off. Corresponding to the second side 23b (the side facing the first side 23a) of (11), the front end side short side 17c of the movable stage 17 is the third side 23c of the chip 11. It corresponds to [sides perpendicular to the first side 23a and the second side 23b]. In addition, in this embodiment, a "protrusion side" means the part which protrudes large in FIG. 1 (A).

In the said recessed part 22, as shown to FIG. 1 (A)-FIG. 1 (C), the intermediate part of the 1st side 23a, the intermediate part of the 2nd side 23b, and the 3rd side 23c Negative pressure passages (suction holes 30a, 30b, 30c) are formed in correspondence with the middle portion. Each suction hole 30 protrudes outward from the chip 11, as can be seen from a plan view.

And as shown to FIG. 2 (A), by arrange | positioning the adhesive sheet 12 with the chip 11 on the base stage 16, the outer peripheral side of the movable stage 17, specifically, at least the movable stage ( In the front side of the front end side short side 17c of 17), the space part 19 is formed between the adhesive sheets 12. As shown in FIG.

A vacuum pump (not shown) is connected to the suction holes 30a, 30b, and 30c as the negative pressure passage, and the negative pressure supply means is constituted by these suction holes 30a, 30b, and 30c. That is, the air in the space 19 is sucked through the suction hole 30a or the like by driving the vacuum pump.

The movable stage 17 is moved along the horizontal direction while the front end side short side 17c of the movable stage 17 is parallel with the 3rd side 23c of the chip 11 via sliding means. Moreover, as a drive means, various mechanisms, such as a reciprocating mechanism and a cylinder mechanism, which consist of a bolt shaft member and the nut member screwed to it, can be used.

Next, the pick-up method using the said chip peeling apparatus is demonstrated. First, as shown in FIG. 3, in the state in which the frame 13 and the adhesive sheet 12 are integrated, as shown in FIG. 1 (A), one side (in this case, the fourth side 23d)] Selects a chip 11 that does not correspond to the other chip 11, places the base stage 16 of the chip peeling apparatus below the chip 11, and as shown in FIG. 2A, It supports to the movable stage 17 through the adhesive sheet 12. As shown in FIG.

In this case, at least a part of the circumferential edge of the chip 11 is projected from the movable stage 17 in a state where the chip 11 is supported by the movable stage 17. In this projecting state, the upper surface of the movable stage 17 is raised by S in the vertical direction from the upper surface of the base stage 16. This height is called the first height of the movable stage 17. For this reason, the step of dimension S is formed between the upper surface of the movable stage 17, and the upper surface of the base stage 16. As shown in FIG. As a result, the chip 11 is supported above the upper surface of the base stage 16.

On at least the front side of the movable stage 17, as shown to FIG. 2 (A), the space part 19 is formed below the adhesive sheet 12. As shown in FIG. In this state, the collet 21 of the retaining means 15 is lowered as shown by the arrow D to bring the head 20 into contact with the upper surface of the chip 11, and the chip 11 is sucked under vacuum through the suction hole. The chip | tip 11 is made to adsorb | suck to the lower surface 20a of (20).

As described above, the space 19 communicates with the suction holes 30a, 30b, and 30c. Thus, by driving the negative pressure supply means, the air in the space 19 is sucked through the suction holes 30a, 30b, and 30c to apply negative pressure. For this reason, a part of adhesive sheet 12 of a chip | tip periphery edge part is attracted and peels the adhesive sheet 12 from the chip | tip 11. As shown in FIG.

In this way, after the negative pressure is applied to the pressure sensitive adhesive sheet, the movable stage 17 is lowered by the vertical movement means, as indicated by the arrow E in FIG. 2 (B). For this reason, the upper surface of the movable stage 17 is in a state raised from the upper surface of the base stage 16 by the height S1. This height is called the second height of the movable stage 17. For this reason, the level | step difference whose dimension is S1 is formed between the upper surface of the movable stage 17, and the upper surface of the base stage 16 (S> S1).

Thereafter, as shown in Figs. 1B, 1C, and 2C, the movable stage 17 is moved in the horizontal direction by the sliding means in the direction opposite to the protruding side as shown by the arrow F. Figs. (Sliding). For this reason, the support area of the chip | tip 11 by the movable stage 17 reduces, and the adsorption (suction) area below the adhesive sheet 12 increases. At this time, since the chip 11 is held (adsorbed) to the collet 21, the adhesive sheet 12 is peeled off from the chip 11 sequentially. For this reason, as shown in FIG.2 (D), when the adsorption area is larger than the chip area or the same as the chip area, the adhesive sheet 12 can be completely peeled from the chip 11 to be peeled off.

In this case, the dimension S1 of the step formed between the top surface of the base stage 16 and the top surface of the movable stage 17 is the top surface of the base stage 16 and the movable stage 17 at the time of peeling the chip peripheral edge. It is smaller than the dimension (S) of the step formed between the upper surfaces of). For this reason, when peeling a chip | tip peripheral part, since the step | step difference between the upper surface of the base stage 16 and the upper surface of the movable stage 17 is large, a big peeling force can be provided. On the other hand, when peeling off the chip | tip periphery part, since the step | step difference between the upper surface of the base stage 16 and the upper surface of the movable stage 17 is small, a small peeling force can be provided.

And after peeling, as shown to FIG. 2 (E), the chip | tip 11 can be taken out from the adhesive sheet 12 by raising the collet 21 like arrow C and moving away from the base stage 16. As shown to FIG. .

After peeling the chip | tip 11 from the adhesive sheet 12 in this way, a semiconductor device is manufactured by bonding the chip | tip 11 to the predetermined position of board | substrates (not shown), such as a lead frame. Here, a semiconductor device refers to the general apparatus which can function by utilizing a semiconductor characteristic, and an electro-optical device, a semiconductor circuit, and an electronic device are all semiconductor devices. The wafer may be in a wafer state in which a circuit is formed, or may be an individual semiconductor chip cut out from the wafer, a wafer may be divided into a plurality, a package may be packaged in a wafer state, or a package may be divided in a plurality of wafers. Packages packaged in a wafer state may be cut out into individual semiconductor elements.

After peeling the chip | tip 11 from the adhesive sheet 12, even if the movable stage 17 is raised, it returns to the height position of 2 (A). As shown in FIG. 2 (F), the movable stage 17 is returned to the standby state as shown by the arrow G, and then the chip 11 to be peeled off is disposed to be supported by the movable stage 17.

After that, when this chip peeling apparatus is made to correspond to the chip | tip 11 sequentially, all the chips 11 on the adhesive sheet 12 can be peeled off from the adhesive sheet 12, and can be taken out.

In the present invention, since the curvature applied to the adjacent chips 11 can be reduced due to the low step, the crack in the stress at the time of sliding can be reduced, and the chips 11 to be peeled off are easily peeled off and taken out. can do.

Next, FIGS. 4A to 4G show the second embodiment, and in this case, the upper surface of the movable stage 17 is raised by the height S1 from the upper surface of the base stage 16. This height is called the second height of the movable stage 17. For this reason, the step of height S1 is formed between the upper surface of the movable stage 17 and the upper surface of the base stage 16. Then, the base stage 16 is positioned below the chip 11, and the movable stage 17 is raised as shown in Fig. 4A. This height is called the first height of the movable stage 17. For this reason, a step of height S larger than S1 is formed between the upper surface of the movable stage 17 and the upper surface of the base stage 16. And it supports by the movable stage 17 of the movable block body 32 through the adhesive sheet 12. As shown in FIG.

And after acting negative pressure on an adhesive sheet, as shown by the arrow E of FIG. 4 (C), the movable stage 17 is lowered to an original position (2nd height). For this reason, the upper surface of the movable stage 17 is raised by the height S1 from the upper surface of the base stage 16, and the step size between the upper surface of the movable stage 17 and the upper surface of the base stage 16 is S1.

Thereafter, the adhesive sheet 12 is separated from the chip 11 to be peeled off by moving (sliding) the movable stage 17 in the horizontal direction opposite to the protruding side as shown by the arrow F in the same manner as in the first embodiment. ) Can be completely peeled off.

Thus, also in the chip | tip peeling apparatus of 2nd Embodiment, the effect similar to the said 1st Embodiment is exhibited. In particular, since the movable stage 17 is once raised, the step difference between the upper surface of the base stage 16 and the upper surface of the movable stage 17 can be reliably formed before the adsorption, and the peripheral edge portion can be stably peeled off. In addition, the step between the upper surface of the base stage 16 and the upper surface of the movable stage 17 becomes smaller during sliding, thereby preventing the bending of the chip 11 further by preventing a large bend from being applied to the adjacent chip 11. You can prevent it. In addition, in the chip peeling apparatus shown to FIG. 4 (A)-FIG. 4 (G), about the structure similar to the chip peeling apparatus shown in FIGS. 1-3, the same code | symbol as FIG. 1-FIG. 3 is attached | subjected, and the description is abbreviate | omitted. do.

Next, FIGS. 5A to 5G show a third embodiment, and in this case, the upper surface of the movable stage 17 is raised by the height S1 from the upper surface of the base stage 16. This height is called the second height of the movable stage 17. For this reason, the step of height S1 is formed between the upper surface of the movable stage 17 and the upper surface of the base stage 16. Then, the base stage 16 is positioned below the chip 11, and the movable stage 17 is raised as shown in Fig. 5A. This height is called the first height of the movable stage 17. For this reason, a step of height S larger than S1 is formed between the upper surface of the movable stage 17 and the upper surface of the base stage 16. And it supports by the movable stage 17 via the adhesive sheet 12. As shown in FIG.

After the negative pressure is applied to the pressure-sensitive adhesive sheet, as shown by arrow E in FIG. 5C, the movable stage 17 is lowered to an intermediate height position higher than the original position. This height is referred to as the third height of the movable stage 17. For this reason, the upper surface of the movable stage 17 is raised by the height S2 from the upper surface of the base stage 16, and the step size between the upper surface of the movable stage 17 and the upper surface of the base stage 16 is S2.

Thereafter, the adhesive sheet 12 is separated from the chip 11 to be peeled off by moving (sliding) the movable stage 17 in the horizontal direction opposite to the protruding side as shown by the arrow F in the same manner as in the first embodiment. ) Can be completely peeled off.

Thus, also in the chip | tip peeling apparatus of 3rd Embodiment, the effect similar to the said 1st Embodiment is exhibited. In particular, since the movable stage 17 is once raised, the step difference between the upper surface of the base stage 16 and the upper surface of the movable stage 17 can be reliably formed before the adsorption, and the peripheral edge portion can be stably peeled off. In addition, during the sliding, large bending can be prevented from being applied to adjacent chips, thereby further preventing chip breakage. In addition, in the chip peeling apparatus shown to FIG. 5 (A)-FIG. 5 (G), about the structure similar to the chip peeling apparatus shown in FIGS. 1-3, the same code | symbol is attached | subjected to FIG. do.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, A various deformation | transformation is possible, For example, as the suction hole 30 formed in the base stage 16, it is size, number, and shape. Etc. can be arbitrarily set within the air suction allowable range of the space 19. For this reason, one suction hole 30 may be sufficient. The chip 11 to be peeled off is not limited to a square, but may have a rectangular shape having a short side and a long side, or a rectangular shape having a very long side compared to the short side. Although the thickness of the adhesive sheet 12 also differs according to the suction force or the like, any material that can be curved and deformed so as to be peeled from the chip 11 when the air in the space portion 19 is sucked by the negative pressure supply means may be used.

The thickness of the movable stage 17 can also be arbitrarily set according to the range which can be peeled from the chip 11 when the air in the space 19 is sucked by the negative pressure supply means. In addition, it is not limited to 90 degrees as an angle of the edge part of the movable stage 17, It may be a little sharp or obtuse angle.

It is also arbitrary as the number of chips 11 adhering on the adhesive sheet 12, and in this invention, all the chips 11 on the adhesive sheet 12 can be peeled off one by one, without being influenced by the number.

(Industrial availability)

A plurality of chips are formed by attaching the cut wafer or the sheet material before the final product to the adhesive sheet, and cutting in this state with a dicing saw or the like. And a chip is peeled one by one from an adhesive sheet and can be taken out. The extracted chip is supplied to a predetermined land of the lead frame.

11: chip 12: adhesive sheet
16: expectation stage 17: movable stage

Claims (6)

In the chip peeling method of peeling the said chip from the adhesive sheet which affixed the chip on the upper surface:
After arrange | positioning the adhesive sheet which adhered this chip so that a chip might correspond to the surface of the movable stage which protruded by the 1st height from the base stage,
Negative pressure is introduced into the space portion formed between the base stage and the pressure-sensitive adhesive sheet,
Then lowering the movable stage to a position lower than the first height and higher than the movable stage,
The chip peeling method characterized by peeling the said chip | tip from the said adhesive sheet by sliding the said movable stage with respect to the said base stage. The method of claim 1,
And the sliding position of the movable stage is a position where the movable stage is raised to the first height once and then lowered to the second height, which is the first position. The method of claim 1,
And the sliding position of the movable stage is a position in which the movable stage is raised to the first height once and then lowered to a third height higher than the first height, the second position. The method according to any one of claims 1 to 3,
And a horizontal sliding step of the movable stage after completion of the lowering step of the movable stage. The semiconductor device is manufactured using the chip peeling method in any one of Claims 1-4. The manufacturing method of the semiconductor device characterized by the above-mentioned. In the chip peeling apparatus which peels the said chip from the adhesive sheet which adhered the chip to the upper surface:
An expected stage of expectation;
A movable stage for arranging an adhesive sheet to which the chip is attached such that the chip corresponds to a surface protruding by the first height from the base stage;
Negative pressure supply means for introducing negative pressure into the space portion between the base and the pressure-sensitive adhesive sheet from the negative pressure passage disposed in the base stage;
Vertical movement means for lowering the movable stage to a height lower than the first height in a state in which a negative pressure is supplied from the negative pressure supply means to the space part; And
And a sliding means for sliding the movable stage relative to the base stage.
KR1020107023965A 2008-11-04 2008-11-04 Chip peeling method, semiconductor device manufacturing method and chip peeling apparatus KR101199298B1 (en)

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JP3209736B2 (en) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 Pellet pickup device
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment
JP4627649B2 (en) * 2004-09-27 2011-02-09 芝浦メカトロニクス株式会社 Semiconductor chip pickup device, pickup method and mounting device
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KR101397356B1 (en) * 2012-09-28 2014-05-19 세메스 주식회사 Apparatus for supplying fluorescent film

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