KR20100126284A - 히트싱크 형성 방법 - Google Patents

히트싱크 형성 방법 Download PDF

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Publication number
KR20100126284A
KR20100126284A KR1020107016985A KR20107016985A KR20100126284A KR 20100126284 A KR20100126284 A KR 20100126284A KR 1020107016985 A KR1020107016985 A KR 1020107016985A KR 20107016985 A KR20107016985 A KR 20107016985A KR 20100126284 A KR20100126284 A KR 20100126284A
Authority
KR
South Korea
Prior art keywords
heat sink
metal material
tpg
formation method
sink formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107016985A
Other languages
English (en)
Korean (ko)
Inventor
데이비드 에스 슬래튼
데이비드 엘 맥도날드
Original Assignee
지이 인텔리전트 플랫폼스 임베디드 시스템즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지이 인텔리전트 플랫폼스 임베디드 시스템즈 인코포레이티드 filed Critical 지이 인텔리전트 플랫폼스 임베디드 시스템즈 인코포레이티드
Publication of KR20100126284A publication Critical patent/KR20100126284A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020107016985A 2007-12-31 2008-12-08 히트싱크 형성 방법 Ceased KR20100126284A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/967,298 2007-12-31
US11/967,298 US20090165302A1 (en) 2007-12-31 2007-12-31 Method of forming a heatsink

Publications (1)

Publication Number Publication Date
KR20100126284A true KR20100126284A (ko) 2010-12-01

Family

ID=40419402

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107016985A Ceased KR20100126284A (ko) 2007-12-31 2008-12-08 히트싱크 형성 방법

Country Status (6)

Country Link
US (1) US20090165302A1 (https=)
EP (1) EP2238816A1 (https=)
JP (1) JP5469089B2 (https=)
KR (1) KR20100126284A (https=)
CN (1) CN101953240B (https=)
WO (1) WO2009088603A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8347502B2 (en) * 2007-12-28 2013-01-08 Ge Intelligent Platforms, Inc. Heat sink and method of forming a heatsink using a wedge-lock system
US8957316B2 (en) * 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
JP5704994B2 (ja) * 2011-03-31 2015-04-22 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 半導体接合装置
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
EP3410478A1 (en) * 2017-05-29 2018-12-05 Mitsubishi Electric R & D Centre Europe B.V. Power module and method for manufacturing the power module
JP7133020B2 (ja) * 2017-12-29 2022-09-07 エアバス ディフェンス アンド スペース，エス．エー． 高コンダクタンス熱リンク

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996023397A1 (en) * 1995-01-25 1996-08-01 Northern Telecom Limited Printed circuit board and heat sink arrangement
DE69834934T2 (de) * 1997-09-19 2007-02-01 General Electric Co. Flexibele wärmeübertragungsvorrichtung und verfahren
JP4051402B2 (ja) * 1997-09-19 2008-02-27 モーメンティブ・パフォーマンス・マテリアルズ・インク 可撓性を有する伝熱装置およびその製造方法
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
JP2003060141A (ja) * 2001-08-20 2003-02-28 Otsuka Denki Kk 超伝熱部材およびそれを用いた冷却装置
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
JP2003188323A (ja) * 2001-12-19 2003-07-04 Sony Corp グラファイトシート及びその製造方法
US6907917B2 (en) * 2003-01-10 2005-06-21 International Business Machines Corporation Graphite-based heat sinks and method and apparatus for the manufacture thereof
JP2005210035A (ja) * 2004-01-26 2005-08-04 Otsuka Denki Kk グラファイト複合材
US7303005B2 (en) * 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias
US7889502B1 (en) * 2005-11-04 2011-02-15 Graftech International Holdings Inc. Heat spreading circuit assembly

Also Published As

Publication number Publication date
EP2238816A1 (en) 2010-10-13
JP5469089B2 (ja) 2014-04-09
CN101953240B (zh) 2014-01-29
US20090165302A1 (en) 2009-07-02
CN101953240A (zh) 2011-01-19
JP2011508449A (ja) 2011-03-10
WO2009088603A1 (en) 2009-07-16

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