KR20100063137A - Indium oxide target - Google Patents

Abstract

Disclosed is an indium oxide target comprising an oxide sintered body which contains yttrium in addition to indium oxide and tin. This indium oxide target is characterized in that the contents of tin and yttrium are within such a range that the molar ratio y of tin relative to 1 mole of indium is not less than (-2.5 x 10Ln(x)-5.8 x 10) but not more than (-1.0 x 10Ln(x)-5.0 x 10), which values are expressed by using the molar ratio x of yttrium relative to 1 mole of indium.

Description

Indium oxide type target {INDIUM OXIDE TARGET}

According to the present invention, an amorphous film is easily obtained, and the amorphous film can be easily patterned by weak acid etching, and can be easily crystallized. Furthermore, the crystallized film has a low resistance and a high transmittance. It relates to an indium oxide target that can be made.

Indium oxide-tin oxide (composite oxide of In ₂ O ₃ -SnO ₂ , hereinafter referred to as "ITO") film has high visible light transmittance and high conductivity, and thus a heat conductive film for preventing condensation of a liquid crystal display device or glass as a transparent conductive film. Although widely used for infrared reflecting films and the like, there is a problem that it is difficult to form an amorphous film.

On the other hand, as an amorphous film, an indium zinc oxide (IZO) transparent conductive film is known. However, such a film has a problem that the film becomes yellowish because its transparency is inferior to that of the ITO film.

Therefore, the present applicant has previously proposed an amorphous amorphous conductive film formed by adding silicon to an ITO film as a transparent conductive film and formed under predetermined conditions (see Patent Document 1). However, when silicon is added, there is a tendency of high resistance. There was a problem.

Patent Document 1: Japanese Patent Application Laid-Open No. 2005-135649 (claims)

In view of such circumstances, the present invention can easily obtain an amorphous film, and the amorphous film can be easily patterned by weak acid etching, can be easily crystallized, and the crystallized film has low resistance and transmittance. An object of the present invention is to provide an indium oxide target that can manufacture this high transparent conductive film.

MEANS TO SOLVE THE PROBLEM As a result of repeating | researching in order to solve the said subject, the indium oxide type transparent conductive film which added barium is an amorphous film which is low resistance and excellent transparency, can be easily patterned by weak acid etching, and also It found that it could crystallize easily, and applied for it previously (Japanese Patent Application No. 2007-095783).

However, as an additional element capable of forming such an amorphous film, Y has been found to be an indium oxide-based target capable of forming an amorphous film by forming Y as an additional element, thereby completing the present invention.

Such a first aspect of the present invention is an indium oxide-based target comprising an oxide sintered body containing indium oxide and tin and containing yttrium, wherein the content of tin and yttrium is molar ratio of tin to 1 mol of indium (y). Is greater than or equal to the value of (-2.5 × 10 ⁻² Ln (x) −5.8 × 10 ⁻² ) expressed as the molar ratio (x) of yttrium to 1 mol of indium, and (−1.0 × 10 ⁻¹ Ln (x) − It is in the indium oxide type target characterized by being in the range below the value of 5.0 * 10 <^-2> .

In this 1st aspect, when Sn and Y are contained in a predetermined range, it becomes an amorphous film at the film-forming temperature below 100 degreeC, and the film which can be crystallized can be formed by annealing at 100-300 degreeC.

According to a second aspect of the present invention, in the indium oxide target according to the first aspect, the molar ratio y of tin to 1 mol of indium is represented by the molar ratio x of yttrium to 1 mol of indium (-2.6 × It is in the indium oxide type target characterized by being in the range more than the value of 10 <^-2> Ln (x) + 5.1 * 10 <^-2> .

In this second aspect, by setting Sn and Y within a predetermined range, it is possible to form an amorphous film that does not crystallize below 200 ° C.

In the third aspect of the present invention, in the indium oxide-based target according to the first or second aspect, the molar ratio (y) of tin to 1 mol of indium is 0.23 or less, and the molar ratio (x) of yttrium to 1 mol of indium is It is in the indium oxide type target characterized by being 0.08 or less.

In this third aspect, by setting Sn and Y within a predetermined range, a film having a specific resistance of 3.0 × 10 ⁻⁴ Ω · cm or less after annealing at 250 ° C. can be formed.

According to the present invention, by containing Sn and Y in a predetermined range, an amorphous film can be formed at a film formation temperature of less than 100 ° C, and crystallized by annealing at 100 to 300 ° C. An amorphous film is easily obtained, and the amorphous film can be easily patterned by weak acid etching, and can be easily crystallized. Furthermore, the crystallized film is an indium oxide based film for forming a transparent conductive film having low resistance and high transmittance. The effect that a target can be provided is acquired.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the relationship between the oxygen partial pressure and resistivity of the film-forming examples 1 and 2 of this invention.
Fig. 2 is a diagram showing the relationship between the oxygen partial pressure and the resistivity of the deposition example 3 of the present invention.
3 is a view showing thin film XRD patterns before and after annealing of film formation examples 1 and 2 of the present invention.
It is a figure which shows the transmission spectrum before and behind annealing of the film-forming examples 1 and 2 of this invention.
It is a figure which shows the crystallization temperature of the film-forming examples a1-a30 of this invention.

(The best mode for carrying out the invention)

The sputtering target for the transparent conductive film used for forming the indium oxide transparent conductive film of the present invention is an oxide sintered body containing indium oxide and tin and containing yttrium, and the yttrium remains its oxide or as a composite oxide, Or it may exist as a solid solution, and is not specifically limited.

Here, an indium oxide type target is a target provided with an indium oxide type sintered compact, and the ion plating target used for film formation of the transparent conductive film by ion plating other than the sputtering target used for film formation of the transparent conductive film by sputtering (pellet Also called).

The content of yttrium and tin is (-2.5 × 10 ⁻² Ln (x) −5.8 × 10 ⁻² ) in which the molar ratio y of tin to 1 mol of indium is represented by the molar ratio x of yttrium to 1 mol of indium. The range is equal to or greater than the value of and equal to or less than the value of (−1.0 × 10 ⁻¹ Ln (x) −5.0 × 10 ⁻² ). In addition, content of the additional element in the transparent conductive film formed of said indium oxide type target becomes content similar to content in the used indium oxide type target.

In the case of such an indium oxide-based target, the sputtering target has a resistance value that can be sputtered by DC magnetron sputtering, so that sputtering is possible with relatively inexpensive DC magnetron sputtering, but of course, a high frequency magnetron sputtering apparatus may be used.

By using such an indium oxide target, an indium oxide transparent conductive film having the same composition can be formed. The compositional analysis of such an indium oxide transparent conductive film may be performed by dissolving the entire amount of the single film by ICP. In the case where the film itself has a device configuration, the cross section of the corresponding portion is cut out by FIB, etc., if necessary, and an elemental analysis device (EDS, WDS, ozer analysis, etc.) attached to SEM or TEM is used. It is also possible to specify.

Since such an indium oxide target of the present invention contains Sn and Y in a predetermined range, the film can be formed in an amorphous form by performing at a temperature lower than 100 ° C. In addition, such an amorphous film has an advantage of being able to be etched with a weakly acidic etchant. Here, in this specification, an etching is included in a patterning process and is for obtaining a predetermined pattern.

Moreover, although the resistivity of the obtained transparent conductive film changes with kinds and content of an additional element, resistivity is 1.0 * 10 <^-4> -1.0 * 10 <^{-3> (} ohm) * cm.

Moreover, the crystallization temperature of the film formed into a film changes with content of the addition element contained, and it rises as content increases, but it can crystallize by annealing on the temperature conditions of 100 degreeC-300 degreeC. Since such a temperature range is used in a conventional semiconductor manufacturing process, it may be crystallized in such a process. Moreover, it is preferable to crystallize at 100 degreeC-300 degreeC among this temperature range, It is more preferable to crystallize at 150 degreeC-250 degreeC, It is most preferable to crystallize at 200 degreeC-250 degreeC.

Here, annealing means heating to a desired temperature for a predetermined time in air, atmosphere, vacuum, or the like. The fixed time is generally about a few minutes to several hours, but a short time is preferable if the effects are industrially the same.

As described above, the transmittance on the short wavelength side of the transparent conductive film after crystallization by annealing is improved, for example, the average transmittance at a wavelength of 400 to 500 nm is 85% or more. This also eliminates the problem that a film like IZO becomes a yellowish color. In general, the higher the transmittance on the short wavelength side, the better.

On the other hand, the crystallized transparent conductive film has improved etching resistance and cannot be etched with a weakly acidic etchant which can be etched in an amorphous film. This improves the corrosion resistance in the later step and the environmental resistance of the device itself.

As described above, in the present invention, since the crystallization temperature of the film to be formed can be adjusted by changing the content of the additive element, after the film formation, the heat treatment at a temperature higher than the crystallization temperature may be avoided, and the amorphous state may be maintained, and patterning after film formation is performed. After that, the crystallization may be performed by heat treatment at a temperature equal to or higher than the temperature to crystallize to change the etching resistance characteristics.

Here, the content of Sn and Y is represented by the molar ratio y of tin to 1 mol of indium and the molar ratio x of yttrium to 1 mol of indium (-2.6 x 10 ^-2 Ln (x) + 5.1 x 10 ^{In the} range of ^-2 ) or more, the formed amorphous film is capable of forming a transparent conductive film that crystallizes at an annealing temperature of 200 ° C or higher without crystallization at an annealing temperature of less than 200 ° C. In consideration, it becomes more preferable.

Moreover, when the molar ratio y of tin to 1 mol of indium is 0.23 or less, and the molar ratio x of yttrium to 1 mol of indium is 0.08 or less, the specific resistance after annealing treatment at 250 ° C. is 3.0 × 10 ⁻⁴ Ω. In cm or less, it becomes especially possible to form a film of low resistance, and is more preferable.

Next, the manufacturing method of the indium oxide type target which concerns on this invention is demonstrated, This is only illustrated and the manufacturing method is not specifically limited.

First, as a starting raw material constituting the sputtering target of the present invention, an oxide of a member element is generally used. These materials, compounds, complex oxides and the like may be used as raw materials. In the case of using a single element or a compound, a process such as making an oxide in advance is performed.

The method of mixing and molding these raw material powders at a desired blending ratio is not particularly limited, and conventionally known various wet methods or dry methods can be used.

As a dry method, the cold press method, the hot press method, etc. are mentioned. In the cold press method, a mixed powder is filled into a molding die, a molded article is produced, and fired. In the hot press method, the mixed powder is fired and sintered in a molding die.

As the wet method, for example, it is preferable to use a filtration molding method (see Japanese Patent Application Laid-Open No. H11-286002). This filtration molding method is a filtration molding mold which consists of a non-aqueous material for depressurizing and draining water from a ceramic raw material slurry to obtain a molded body. The filtration molding method is placed on a molding lower mold having at least one drain hole and on the lower mold for molding. It consists of a filter having a water permeability and a molding mold sandwiched from the upper surface side through a sealing material for sealing the filter, and assembled to disassemble the molding lower mold, the molding mold, the sealing member, and the filter, respectively. Using a filtration type mold which drains water in the slurry under reduced pressure only from the filter face side, a slurry composed of mixed powder, ion-exchanged water and an organic additive is prepared, and the slurry is poured into the filtration type mold. The molded product was produced by depressurizing and draining moisture in the slurry only from the filter face side, and firing after drying and degreasing the obtained ceramic molded product. do.

The baking temperature of the thing molded by the cold press method or the wet method is 1300-1650 degreeC, More preferably, it is 1500-1650 degreeC, The atmosphere is an atmospheric atmosphere, an oxygen atmosphere, a non-oxidizing atmosphere, or a vacuum atmosphere. On the other hand, in the hot press method, it is preferable to sinter at 1200 degreeC, The atmosphere is a non-oxidizing atmosphere, a vacuum atmosphere, etc. In addition, after baking in each method, the target for the machining for shaping | molding and processing to predetermined dimension is made into the target.

(Example)

EMBODIMENT OF THE INVENTION Hereinafter, although this invention is demonstrated based on the Example which used the sputtering target as an example, it is not limited to this.

(Sputtering Target Manufacturing Example 1) (Y-ITO)

(Y added ITO, Y = 0.02-Sn = 0.10)

An In ₂ O ₃ powder having a purity of> 99.99%, a SnO ₂ powder, and a Y ₂ (CO ₃ ) ₃ .3H ₂ O powder having a purity> 99.99% were prepared.

First, a total amount of 200 g was prepared at a ratio of 40.2 wt% of In ₂ O ₃ powder and 59.8 wt% of Y ₂ (CO ₃ ) ₃ H ₂ O powder, ball mill mixed in a dry state, and 3 at 1200 ° C. in air. by the time the plastic, to give a YInO ₃ powder.

Subsequently, about 1.0 kg of the total amount was prepared at a ratio of 3.6 wt% of the YInO ₃ powder, 85.6 wt% of the In ₂ O ₃ powder, and 10.8 wt% of the SnO ₂ powder (the composition of each metal atom was In = 88.0at.%, Sn = 10.0 at.%, Y = 2.0 at.%), And this was ball mill mixed. Then, PVA aqueous solution was added as a binder, it mixed, dried, and cold-pressed, and the molded object was obtained. The molded product was degreased at an elevated temperature of 60 ° C./h for 10 hours at 600 ° C. in the air, and then calcined at 1550 ° C. for 8 hours in an oxygen atmosphere to obtain a sintered body. Specifically, the firing conditions are elevated to 200 ° C./h from room temperature to 800 ° C., heated to 400 ° C./h from 800 ° C. to 1550 ° C., and maintained for 8 hours, and then 100 ° C./h from 1550 ° C. to room temperature. This is a condition called cooling. Then, this sintered compact was processed and the target was obtained. The density at this time was 7.02 g / cm ³ .

In the same manner, sputtering targets of Y = 0.05-Sn = 0.10 and Y = 0.25-Sn = 0.12 were prepared.

In addition, the sputtering target of the composition shown in Table 1 was produced similarly.

(Deposition Examples 1 to 3)

Film-forming examples 1-3 were implemented as follows.

The target of the film-forming examples 1-3 was made into the thing of the composition of Y = 0.02-Sn = 0.10, the composition of Y = 0.05-Sn = 0.10, and the composition of Y = 0.25-Sn = 0.12 of the target of the manufacture example 1, respectively. Each film deposition example was mounted on a 4-inch DC magnetron sputter device, while the substrate temperature was varied between room temperature (approximately 20 ° C.) and the oxygen partial pressure between 0 and 3.0 sccm (corresponding to 0 to 1.1 × 10 ⁻² Pa). A transparent conductive film was obtained.

The sputter | spatter conditions were as follows, and the film | membrane of thickness 1200Å was obtained.

Target dimension: φ = 4in. t = 6mm

Sputter Method: DC Magnetron Sputter

Exhaust System: Rotary Pump + Cryopump

Reach Vacuum Degree: 5.3 × 10 ^-6 [Pa]

Ar pressure: 4.0 × 10 ^-1 [Pa]

Oxygen pressure: 0 to 1.1 x 10 ^-2 [Pa]

Water pressure: 5.0 × 10 ^-6 [Pa]

Substrate Temperature: Room Temperature

Sputter Power: 130W (Power Density 1.6W / cm ² )

Substrate used: Corning # 1737 (glass for liquid crystal display) t = 0.8mm

The resistivity of the film formed at each oxygen partial pressure and the resistivity after annealing each film at 250 ° C were measured. The results are shown in FIGS. 1 and 2.

As a result, it was found that the optimum oxygen partial pressure exists in either case.

In either case, it was found that the optimum oxygen partial pressure of the room temperature film formation and the oxygen partial pressure at the time of the lowest resistivity film formation after 250 ° C annealing were different. Table 2 shows the optimum oxygen partial pressure of room temperature film formation and the oxygen partial pressure at the lowest resistivity film formation after annealing at 250 ° C. Therefore, in the film forming examples 1 to 3, it was found that the film having the lowest resistance was obtained by annealing at 250 ° C. after forming at the oxygen partial pressure at the lowest resistivity after 250 ° C. annealing.

In Table 2 below, the change in the optimum oxygen partial pressure was indicated by ○, and the change in the optimum oxygen partial pressure was not represented as x.

(Test Example 1)

In the film forming examples 1 to 3, the transparent conductive films produced at the optimum oxygen partial pressure at room temperature film formation were cut out to a size of 13 mm each, and these samples were annealed at 250 ° C for 1 hour in the air. The thin film XRD patterns before and after annealing of the film forming examples 1 and 2 are shown in FIG. 3. In addition, regarding the film forming examples 1 to 3, in the crystalline state at the time of room temperature film formation and after 250 ° C. annealing, amorphous was a and the crystal was c, and these are shown in Table 2.

As a result, in the case of film-forming examples 1 and 2 of room temperature film-forming, it was confirmed that it is an amorphous film at the time of film-forming, but crystallizes by annealing for 1 hour at 250 degreeC. On the other hand, in the film-forming example 3 with much addition amount, it was confirmed that even if it is amorphous at the time of film-forming, it does not crystallize in 250 degreeC annealing, and also does not crystallize in annealing at 300 degreeC.

(Test Example 2)

The resistivity (rho) (ohm * cm) at the time of optimal oxygen partial pressure film-forming at the time of room temperature film-forming of each transparent conductive film formed into a film by each film-forming example was measured. Moreover, the resistivity measured about the sample after the annealing of Test Example 1 was also measured. These results are shown in Table 2.

As a result, in the case of film-forming examples 1 and 2, it turned out that resistivity is 3.0 * 10 <^{-4> (} ohm) * cm or less.

However, in the film formation example 3, it turned out that resistivity becomes somewhat high resistance at 7.4x10 <^{-4> (} ohm) * cm.

(Test Example 3)

In the film-forming examples 1-3, the transparent conductive film manufactured by the optimum oxygen partial pressure in room temperature film-forming was cut out to the magnitude | size of 13 mm each, and the transmission spectrum was measured. Moreover, the transmission spectrum was measured similarly about the film | membrane after annealing of the test example 1. These results are shown in FIG. Moreover, the average transmittance | permeability after annealing of each film-forming example 1-3 is shown in Table 2.

From these results, it turned out that the absorption spectrum shifts to the low wavelength side by annealing at 250 degreeC for 1 hour in the transmission spectrum before film-forming and annealing, and color tone improves.

(Test Example 4)

In the film forming examples 1 to 3, the transparent conductive films produced at the optimum oxygen partial pressure in the room temperature film formation were each cut out to a size of 10 x 50 mm, and used as an etching solution, ITO-05N (oxalic acid system, manufactured by Kanto-Kagaku Co., Ltd.) (oxalic acid). It confirmed about the possibility of an etching at the temperature of 30 degreeC using density | concentration 50g / L). Moreover, the sample after the annealing of the test example 1 was confirmed similarly. These results are shown in Table 2 by making etching possible "(circle)" and etching impossible as "x."

As a result, since film-forming examples 1-3 were all amorphous films, it turned out that the etching of weak acidity is possible.

(Deposition Examples a1 to a30)

Using the target of the composition shown in Table 1 manufactured as mentioned above, this was mounted in the 4-inch DC magnetron sputter apparatus, respectively, board | substrate temperature between room temperature (about 20 degreeC), and oxygen partial pressure between 0-3.0sccm. While changing (corresponding to 0-1.1 * 10 <^-2> Pa), the transparent conductive film of each composition was obtained.

The sputter | spatter conditions were as follows, and the film | membrane of thickness 1200Å was obtained.

Target dimension: φ = 4in. t = 6mm

Sputter Method: DC Magnetron Sputter

Exhaust System: Rotary Pump + Cryopump

Reach Vacuum Degree: 5.3 × 10 ^-5 [Pa]

Ar pressure: 4.0 × 10 ^-1 [Pa]

Oxygen pressure: 0 to 1.1 x 10 ^-2 [Pa]

Water pressure: 5.0 × 10 ^-5 [Pa]

Substrate Temperature: Room Temperature

Sputter Power: 130W (Power Density 1.6W / cm ² )

Substrate used: Corning # 1737 (glass for liquid crystal display) t = 0.8mm

Here, although there existed many samples from which the optimum oxygen partial pressure of room temperature film-forming and the oxygen partial pressure at the time of lowest resistivity after film-forming annealing differed, the optimum oxygen partial pressure did not change with a composition.

In Table 3 below, the change in the optimum oxygen partial pressure was indicated by ○, and the change in the optimum oxygen partial pressure was not represented as x.

In addition, the transparent conductive films prepared at the optimum oxygen partial pressure at the time of film formation of each composition were cut out to a size of 13 mm each, and these samples were annealed at 250 ° C. for 1 hour in the air, and at 250 ° C. at room temperature film formation. As for the later crystal state, amorphos was a and the crystal was c, and these are shown in Table 3.

Moreover, the crystallization temperature of each composition was measured and shown in Table 3. Crystallization temperature is the temperature which crystallizes after film-forming at 100 degreeC, and it was less than 100 degreeC that it does not become amorphous in 100 degreeC film-forming.

Moreover, the resistivity (rho) ((ohm * cm)) of the sample annealed and crystallized after the optimum oxygen partial pressure film-forming at the time of room temperature film-forming of each transparent conductive film formed into a film was measured. These results are shown in Table 3.

In addition, the transparent conductive films produced at the optimum oxygen partial pressure in the room temperature film formation were each cut out to a size of 13 mm in width, and the transmission spectrum was measured for the film after annealing. Table 3 shows the average transmittances after annealing.

In addition, the transparent conductive films prepared at the optimum oxygen partial pressure in the room temperature film formation, and after annealing and crystallization were cut out to a size of 10 x 50 mm, respectively, and used as an etching solution, ITO-05N (oxalic acid system, manufactured by Kanto-Kagaku Co., Ltd.) (oxalic acid). It confirmed about the possibility of an etching at the temperature of 30 degreeC using density | concentration 50g / L). These results are shown in Table 3 by making etching possible "(circle)" and etching impossible as "x."

These results are shown in FIG. In the figure, the sample which can be formed as an amorphous film at the film-forming temperature of less than 100 degreeC, and can be crystallized at 100-300 degreeC is shown by (circle).

As a result, the content of yttrium and tin is (-2.5 × 10 ^-2 Ln (x) -5.8 × 10, wherein the molar ratio y of tin to 1 mol of indium is represented by the molar ratio x of yttrium to 1 mol of indium. ^If the value is greater than or equal to ^-2 and less than or equal to (-1.0 × 10 ⁻¹ Ln (x) −5.0 × 10 ⁻² ), the film is formed in an amorphous state by performing at a temperature lower than 100 ° C. It was found that after the film formation, the film to be crystallized can be formed by annealing at 100 ° C to 300 ° C.

In addition, the content of Sn and Y is represented by the molar ratio y of tin to 1 mol of indium and the molar ratio x of yttrium to 1 mol of indium (-2.6 x 10 ^-2 Ln (x) + 5.1 x 10 ^{In the} range of ^-2 ) or more, when the film of amorphous film formed is not crystallized at an annealing temperature of less than 200 ° C, a transparent conductive film that is crystallized at annealing temperature of 200 ° C or more can be formed. It turned out that it becomes more preferable.

Moreover, when the molar ratio y of tin to 1 mol of indium is 0.23 or less, and the molar ratio x of yttrium to 1 mol of indium becomes 0.08 or less, the specific resistance after annealing treatment at 250 ° C. is 3.0 × 10 ⁻⁴ Ω · cm In particular, it was found that a low-resistance film can be formed, which is more preferable.

Claims (3)

An indium oxide-based target comprising an oxide sintered body containing indium oxide and tin and also containing yttrium, wherein the molar ratio y of tin and yttrium to 1 mol of indium is a molar ratio of yttrium to 1 mol of indium. It is equal to or greater than the value of (-2.5 × 10 ^-2 Ln (x) -5.8 × 10 ^-2 ) represented by (x) and less than the value of (-1.0 × 10 ^-1 Ln (x) -5.0 × 10 ^-2 ). Indium oxide-based target, characterized in that in the range of. The molar ratio y of tin to 1 mole of indium is represented by the molar ratio x of yttrium to 1 mole of indium (-2.6 x 10 ^-2 Ln (x) + 5.1 x 10 ^-2 ). An indium oxide target based on the value of. The indium oxide target according to claim 1 or 2, wherein the molar ratio y of tin to 1 mole of indium is 0.23 or less, and the molar ratio x of yttrium to 1 mole of indium is 0.08 or less.

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