KR20090125085A - 다수의 모듈들 또는 서브모듈들을 갖는 집적 회로를 테스트 및 제공하기 위한 시스템 및 방법 - Google Patents

다수의 모듈들 또는 서브모듈들을 갖는 집적 회로를 테스트 및 제공하기 위한 시스템 및 방법 Download PDF

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Publication number
KR20090125085A
KR20090125085A KR1020097018643A KR20097018643A KR20090125085A KR 20090125085 A KR20090125085 A KR 20090125085A KR 1020097018643 A KR1020097018643 A KR 1020097018643A KR 20097018643 A KR20097018643 A KR 20097018643A KR 20090125085 A KR20090125085 A KR 20090125085A
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KR
South Korea
Prior art keywords
circuit
test
good
circuits
integrated circuit
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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KR1020097018643A
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English (en)
Korean (ko)
Inventor
페리 에이치. 펠리
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프리스케일 세미컨덕터, 인크.
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Application filed by 프리스케일 세미컨덕터, 인크. filed Critical 프리스케일 세미컨덕터, 인크.
Publication of KR20090125085A publication Critical patent/KR20090125085A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G01R31/307—Contactless testing using electron beams of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318513—Test of Multi-Chip-Moduls

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020097018643A 2007-03-08 2008-02-01 다수의 모듈들 또는 서브모듈들을 갖는 집적 회로를 테스트 및 제공하기 위한 시스템 및 방법 Withdrawn KR20090125085A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/683,607 US7669100B2 (en) 2007-03-08 2007-03-08 System and method for testing and providing an integrated circuit having multiple modules or submodules
US11/683,607 2007-03-08

Publications (1)

Publication Number Publication Date
KR20090125085A true KR20090125085A (ko) 2009-12-03

Family

ID=39738661

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097018643A Withdrawn KR20090125085A (ko) 2007-03-08 2008-02-01 다수의 모듈들 또는 서브모듈들을 갖는 집적 회로를 테스트 및 제공하기 위한 시스템 및 방법

Country Status (4)

Country Link
US (1) US7669100B2 (enExample)
JP (1) JP5545718B2 (enExample)
KR (1) KR20090125085A (enExample)
WO (1) WO2008109213A1 (enExample)

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US8542247B1 (en) 2009-07-17 2013-09-24 Nvidia Corporation Cull before vertex attribute fetch and vertex lighting
US8564616B1 (en) 2009-07-17 2013-10-22 Nvidia Corporation Cull before vertex attribute fetch and vertex lighting
US8976195B1 (en) 2009-10-14 2015-03-10 Nvidia Corporation Generating clip state for a batch of vertices
KR20110099556A (ko) * 2010-03-02 2011-09-08 삼성전자주식회사 반도체 패키지 테스트장치
US8296611B2 (en) * 2010-03-29 2012-10-23 Elite Semiconductor Memory Technology Inc. Test circuit for input/output array and method and storage device thereof
US9497099B2 (en) * 2013-12-16 2016-11-15 Artesyn Embedded Computing, Inc. Voting architecture for safety and mission critical systems
DE102015202049B3 (de) * 2015-02-05 2016-08-18 Infineon Technologies Ag System und Verfahren zur Fehlerdetektion von ausgeführtem Programmcode unter Verwendung komprimierter Anweisungssignaturen
US9558846B1 (en) * 2015-11-04 2017-01-31 Texas Instruments Incorporated Feedback validation of arbitrary non-volatile memory data

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JP2633539B2 (ja) * 1986-12-26 1997-07-23 株式会社東芝 論理集積回路のテストデータ作成方式
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US4918693A (en) * 1988-01-28 1990-04-17 Prime Computer, Inc. Apparatus for physically locating faulty electrical components
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JP3273440B2 (ja) * 1994-10-19 2002-04-08 マイクロン・テクノロジー・インコーポレーテッド 部分的に良好なメモリ集積回路から使用可能な部分を得るための効率的な方法
US5867505A (en) 1996-08-07 1999-02-02 Micron Technology, Inc. Method and apparatus for testing an integrated circuit including the step/means for storing an associated test identifier in association with integrated circuit identifier for each test to be performed on the integrated circuit
US5930182A (en) * 1997-08-22 1999-07-27 Micron Technology, Inc. Adjustable delay circuit for setting the speed grade of a semiconductor device
US6115763A (en) 1998-03-05 2000-09-05 International Business Machines Corporation Multi-core chip providing external core access with regular operation function interface and predetermined service operation services interface comprising core interface units and masters interface unit
JP2000137059A (ja) * 1998-11-02 2000-05-16 Mitsubishi Electric Corp 半導体テスト装置
US6452411B1 (en) 1999-03-01 2002-09-17 Formfactor, Inc. Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses
US6334198B1 (en) 1999-04-01 2001-12-25 Koninklijke Philips Electronics N.V. (Kpenv) Method and arrangement for controlling multiply-activated test access port control modules
US6385749B1 (en) 1999-04-01 2002-05-07 Koninklijke Philips Electronics N.V. (Kpenv) Method and arrangement for controlling multiple test access port control modules
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KR20010065333A (ko) 1999-12-29 2001-07-11 박종섭 메모리모듈의 병렬 테스트장치
JP4048691B2 (ja) 2000-04-27 2008-02-20 横河電機株式会社 Ｉｃ試験装置及びｉｃ試験方法
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US8924533B2 (en) * 2005-04-14 2014-12-30 Verizon Patent And Licensing Inc. Method and system for providing automated fault isolation in a managed services network

Also Published As

Publication number Publication date
US20080220545A1 (en) 2008-09-11
WO2008109213A1 (en) 2008-09-12
JP5545718B2 (ja) 2014-07-09
JP2010520486A (ja) 2010-06-10
US7669100B2 (en) 2010-02-23

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090907

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid