KR20090040374A - Ｌｅｄ 장치 및 액정 표시 장치의 백 패널 - Google Patents

Ｌｅｄ 장치 및 액정 표시 장치의 백 패널 Download PDF

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Publication number
KR20090040374A
KR20090040374A KR1020097004952A KR20097004952A KR20090040374A KR 20090040374 A KR20090040374 A KR 20090040374A KR 1020097004952 A KR1020097004952 A KR 1020097004952A KR 20097004952 A KR20097004952 A KR 20097004952A KR 20090040374 A KR20090040374 A KR 20090040374A
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KR
South Korea
Prior art keywords
substrate
led
led device
electrical circuit
diamond
Prior art date
Application number
KR1020097004952A
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English (en)
Korean (ko)
Inventor
신-밍 카오
유-쳉 린
조-신 쳉
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20090040374A publication Critical patent/KR20090040374A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
KR1020097004952A 2006-08-11 2007-08-10 Ｌｅｄ 장치 및 액정 표시 장치의 백 패널 KR20090040374A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83702206P 2006-08-11 2006-08-11
US60/837,022 2006-08-11

Publications (1)

Publication Number Publication Date
KR20090040374A true KR20090040374A (ko) 2009-04-23

Family

ID=38717895

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097004952A KR20090040374A (ko) 2006-08-11 2007-08-10 Ｌｅｄ 장치 및 액정 표시 장치의 백 패널

Country Status (6)

Country Link
EP (1) EP2050146A1 (zh)
JP (1) JP2010500778A (zh)
KR (1) KR20090040374A (zh)
CN (1) CN101501873A (zh)
TW (1) TW200822399A (zh)
WO (1) WO2008021268A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101237685B1 (ko) * 2011-03-29 2013-02-26 삼성전기주식회사 방열 기판 및 그 제조방법

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8440500B2 (en) * 2009-05-20 2013-05-14 Interlight Optotech Corporation Light emitting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
CN101887942A (zh) * 2010-06-07 2010-11-17 江苏鑫钻新材料科技有限公司 一种安装led的金属基板及其制造方法
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
CN102469680A (zh) * 2010-11-05 2012-05-23 寇崇善 高导热电路板及其制作方法
JP5159872B2 (ja) 2010-12-27 2013-03-13 株式会社東芝 テレビジョン受像機
JP5032651B2 (ja) 2010-12-27 2012-09-26 株式会社東芝 テレビジョン受像機、及び電子機器
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
WO2012109225A1 (en) 2011-02-07 2012-08-16 Cree, Inc. Components and methods for light emitting diode (led) lighting
CN105633234A (zh) * 2012-03-15 2016-06-01 安徽三安光电有限公司 氮化镓基半导体生长衬底及其制作方法
CN102983124B (zh) * 2012-11-14 2015-06-10 深圳大学 具有散热装置的led光源
CN103346242A (zh) * 2013-07-05 2013-10-09 苏州热驰光电科技有限公司 基于玻璃基板的led器件及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001004856A (ja) * 1999-06-24 2001-01-12 Nec Corp 光モジュール実装基板およびその製造方法
US7273598B2 (en) * 2001-01-19 2007-09-25 Chevron U.S.A. Inc. Diamondoid-containing materials for passivating layers in integrated circuit devices
US20060113546A1 (en) * 2002-10-11 2006-06-01 Chien-Min Sung Diamond composite heat spreaders having low thermal mismatch stress and associated methods
US7396735B2 (en) * 2002-12-09 2008-07-08 Kabushiki Kaisha Toyota Chuo Kenkyusyo Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same
JP4283738B2 (ja) * 2004-07-08 2009-06-24 浜松ホトニクス株式会社 半導体レーザ装置
DE102004036960A1 (de) * 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leiterplatte und Verfahren zur Herstellung einer solchen Leiterplatte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101237685B1 (ko) * 2011-03-29 2013-02-26 삼성전기주식회사 방열 기판 및 그 제조방법

Also Published As

Publication number Publication date
CN101501873A (zh) 2009-08-05
WO2008021268A1 (en) 2008-02-21
TW200822399A (en) 2008-05-16
EP2050146A1 (en) 2009-04-22
JP2010500778A (ja) 2010-01-07

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