KR20090037277A - 크로스 포인트 메모리 어레이 - Google Patents
크로스 포인트 메모리 어레이 Download PDFInfo
- Publication number
- KR20090037277A KR20090037277A KR1020080020588A KR20080020588A KR20090037277A KR 20090037277 A KR20090037277 A KR 20090037277A KR 1020080020588 A KR1020080020588 A KR 1020080020588A KR 20080020588 A KR20080020588 A KR 20080020588A KR 20090037277 A KR20090037277 A KR 20090037277A
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- conductive layer
- oxide
- electrode line
- memory
- Prior art date
Links
- 230000015654 memory Effects 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 claims description 27
- 229910000510 noble metal Inorganic materials 0.000 claims description 21
- 239000010970 precious metal Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052741 iridium Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910013716 LiNi Inorganic materials 0.000 claims description 3
- 229910010380 TiNi Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 2
- 239000010410 layer Substances 0.000 description 135
- 239000000463 material Substances 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002356 single layer Substances 0.000 description 3
- 229910000314 transition metal oxide Inorganic materials 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910002845 Pt–Ni Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/155,511 US20090095985A1 (en) | 2007-10-10 | 2008-06-05 | Multi-layer electrode, cross point memory array and method of manufacturing the same |
CN2008101297804A CN101409303B (zh) | 2007-10-10 | 2008-08-18 | 多层电极、交叉点存储器阵列 |
JP2008220184A JP2009094483A (ja) | 2007-10-10 | 2008-08-28 | クロスポイントメモリアレイ |
EP08163599A EP2048713A3 (en) | 2007-10-10 | 2008-09-03 | Multi-layer electrode, cross point memory array and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070102146 | 2007-10-10 | ||
KR1020070102146 | 2007-10-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090037277A true KR20090037277A (ko) | 2009-04-15 |
Family
ID=40572200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080020588A KR20090037277A (ko) | 2007-10-10 | 2008-03-05 | 크로스 포인트 메모리 어레이 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20090037277A (zh) |
CN (1) | CN101409303B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011096940A1 (en) * | 2010-02-08 | 2011-08-11 | Hewlett-Packard Development Company, L.P. | Memory resistor having multi-layer electrodes |
KR20130077514A (ko) * | 2011-12-29 | 2013-07-09 | 에스케이하이닉스 주식회사 | 가변 저항 메모리 장치 |
KR101340570B1 (ko) * | 2011-12-23 | 2013-12-11 | 광주과학기술원 | 비휘발성 저항 스위칭 메모리 소자 및 이의 제조방법 |
KR101423930B1 (ko) * | 2012-04-17 | 2014-07-28 | 광주과학기술원 | 문턱 스위칭과 메모리 스위칭 특성을 동시에 갖는 저항 변화 메모리 소자, 이의 제조방법, 및 이를 포함하는 저항 변화 메모리 소자 어레이 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102484128B (zh) * | 2009-09-04 | 2016-08-03 | 惠普发展公司,有限责任合伙企业 | 具有用电压相关电阻器形成的本征二极管的可开关结 |
US20110084248A1 (en) * | 2009-10-13 | 2011-04-14 | Nanya Technology Corporation | Cross point memory array devices |
KR20110054088A (ko) * | 2009-11-17 | 2011-05-25 | 삼성전자주식회사 | 비휘발성 메모리 소자 |
CN102779941B (zh) * | 2012-08-22 | 2015-02-18 | 中国科学院上海微系统与信息技术研究所 | 低功耗相变存储单元及其制备方法 |
TWI568042B (zh) * | 2015-08-03 | 2017-01-21 | 華邦電子股份有限公司 | 電阻式隨機存取記憶體 |
US20170133588A1 (en) * | 2015-11-06 | 2017-05-11 | HGST Netherlands B.V. | Resistive ram cell with focused electric field |
KR102410947B1 (ko) * | 2015-11-20 | 2022-06-22 | 에스케이하이닉스 주식회사 | 문턱 스위칭 장치 및 이를 포함하는 전자 장치 |
US11916127B2 (en) * | 2021-06-16 | 2024-02-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-layer electrode to improve performance of ferroelectric memory device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070132049A1 (en) * | 2005-12-12 | 2007-06-14 | Stipe Barry C | Unipolar resistance random access memory (RRAM) device and vertically stacked architecture |
-
2008
- 2008-03-05 KR KR1020080020588A patent/KR20090037277A/ko not_active Application Discontinuation
- 2008-08-18 CN CN2008101297804A patent/CN101409303B/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011096940A1 (en) * | 2010-02-08 | 2011-08-11 | Hewlett-Packard Development Company, L.P. | Memory resistor having multi-layer electrodes |
US8737113B2 (en) | 2010-02-08 | 2014-05-27 | Hewlett-Packard Development Company, L.P. | Memory resistor having multi-layer electrodes |
KR101340570B1 (ko) * | 2011-12-23 | 2013-12-11 | 광주과학기술원 | 비휘발성 저항 스위칭 메모리 소자 및 이의 제조방법 |
KR20130077514A (ko) * | 2011-12-29 | 2013-07-09 | 에스케이하이닉스 주식회사 | 가변 저항 메모리 장치 |
KR101423930B1 (ko) * | 2012-04-17 | 2014-07-28 | 광주과학기술원 | 문턱 스위칭과 메모리 스위칭 특성을 동시에 갖는 저항 변화 메모리 소자, 이의 제조방법, 및 이를 포함하는 저항 변화 메모리 소자 어레이 |
Also Published As
Publication number | Publication date |
---|---|
CN101409303A (zh) | 2009-04-15 |
CN101409303B (zh) | 2013-01-30 |
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E601 | Decision to refuse application |