KR20080060254A - 가스 처리 방법 - Google Patents

가스 처리 방법 Download PDF

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Publication number
KR20080060254A
KR20080060254A KR1020087009791A KR20087009791A KR20080060254A KR 20080060254 A KR20080060254 A KR 20080060254A KR 1020087009791 A KR1020087009791 A KR 1020087009791A KR 20087009791 A KR20087009791 A KR 20087009791A KR 20080060254 A KR20080060254 A KR 20080060254A
Authority
KR
South Korea
Prior art keywords
gas
exhaust gas
pump
purge gas
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087009791A
Other languages
English (en)
Korean (ko)
Inventor
제임스 로버트 스미스
마릴레나 라도이우
스테판 존 콜스
Original Assignee
에드워즈 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에드워즈 리미티드 filed Critical 에드워즈 리미티드
Publication of KR20080060254A publication Critical patent/KR20080060254A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/20—Halogens or halogen compounds
    • B01D2257/204—Inorganic halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/20—Halogens or halogen compounds
    • B01D2257/206—Organic halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
    • B01D2259/818—Employing electrical discharges or the generation of a plasma
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Treating Waste Gases (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
KR1020087009791A 2005-10-27 2006-09-28 가스 처리 방법 Ceased KR20080060254A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0521944.9 2005-10-27
GBGB0521944.9A GB0521944D0 (en) 2005-10-27 2005-10-27 Method of treating gas

Publications (1)

Publication Number Publication Date
KR20080060254A true KR20080060254A (ko) 2008-07-01

Family

ID=35515848

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087009791A Ceased KR20080060254A (ko) 2005-10-27 2006-09-28 가스 처리 방법

Country Status (8)

Country Link
US (1) US8480861B2 (enExample)
EP (1) EP1941073B1 (enExample)
JP (1) JP2009513330A (enExample)
KR (1) KR20080060254A (enExample)
CN (1) CN101297063B (enExample)
GB (1) GB0521944D0 (enExample)
TW (1) TW200719945A (enExample)
WO (1) WO2007048995A1 (enExample)

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KR20080104372A (ko) * 2006-03-16 2008-12-02 어플라이드 머티어리얼스, 인코포레이티드 전자 장치 제조 시스템의 압력 제어 방법 및 장치
FR2932059A1 (fr) * 2008-05-28 2009-12-04 Air Liquide Systeme de traitement par plasma d'un fluide ou melange de fluides
KR20110028396A (ko) * 2008-07-11 2011-03-17 어플라이드 머티어리얼스, 인코포레이티드 전자 수단 제조 공정 배출물을 저감시키기 위한 방법 및 기구
JP2011163150A (ja) * 2010-02-05 2011-08-25 Toyota Industries Corp 水素ガスの排気方法及び真空ポンプ装置
JP5837351B2 (ja) * 2010-08-05 2015-12-24 株式会社荏原製作所 排気系システム
KR101230513B1 (ko) * 2010-12-27 2013-02-06 (주)엘오티베큠 배기 유체 처리 장치
JP5877702B2 (ja) * 2011-12-14 2016-03-08 株式会社ニューフレアテクノロジー 成膜装置および成膜方法
GB2501735B (en) * 2012-05-02 2015-07-22 Edwards Ltd Method and apparatus for warming up a vacuum pump arrangement
KR20140107758A (ko) 2013-02-28 2014-09-05 삼성전자주식회사 반응 부산물 처리기 및 반응 부산물의 처리방법과 반응 부산물 처리기를 구비하는 반도체 소자 제조설비
CN105209156B (zh) 2013-03-14 2017-05-10 Mks仪器股份有限公司 环形等离子体减少设备和方法
JP6153754B2 (ja) * 2013-03-28 2017-06-28 株式会社荏原製作所 除害機能付真空ポンプ
JP6151945B2 (ja) * 2013-03-28 2017-06-21 株式会社荏原製作所 除害機能付真空ポンプ
GB2513300B (en) * 2013-04-04 2017-10-11 Edwards Ltd Vacuum pumping and abatement system
JP6368458B2 (ja) * 2013-05-24 2018-08-01 株式会社荏原製作所 除害機能付真空ポンプ
JP6166102B2 (ja) * 2013-05-30 2017-07-19 株式会社荏原製作所 除害機能付真空ポンプ
GB2515017B (en) * 2013-06-10 2017-09-20 Edwards Ltd Process gas abatement
US20150211114A1 (en) * 2014-01-30 2015-07-30 Applied Materials, Inc. Bottom pump and purge and bottom ozone clean hardware to reduce fall-on particle defects
JP5808454B1 (ja) 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
KR20230051311A (ko) 2014-09-12 2023-04-17 어플라이드 머티어리얼스, 인코포레이티드 반도체 프로세싱 장비 유출물의 처리를 위한 제어기
CN104480468A (zh) * 2014-12-31 2015-04-01 深圳市华星光电技术有限公司 干式蚀刻机及用于捕集气体中磁性颗粒的捕集装置
GB2535703B (en) * 2015-02-23 2019-09-18 Edwards Ltd Gas supply apparatus
JP6749090B2 (ja) * 2015-11-12 2020-09-02 東京エレクトロン株式会社 ハロゲン系ガスを用いる処理装置における処理方法
US20190282948A1 (en) * 2016-01-27 2019-09-19 Imad Mahawili Semiconductor processing system
JP7472114B2 (ja) * 2018-09-28 2024-04-22 ラム リサーチ コーポレーション 堆積副生成物の蓄積からの真空ポンプの保護
WO2020172179A1 (en) * 2019-02-22 2020-08-27 Applied Materials, Inc. Reduction of br2 and cl2 in semiconductor processes
CN109821657B (zh) * 2019-03-12 2024-03-22 华南理工大学 燃煤电厂电除尘器绝缘子室的吹扫装置
US11786858B2 (en) 2019-06-06 2023-10-17 Edwards Vacuum Llc Liquid filter apparatus for gas/solid separation for semiconductor processes
WO2021053972A1 (ja) * 2019-09-19 2021-03-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法、プログラム、記録媒体および排ガス処理システム
GB2588906A (en) * 2019-11-13 2021-05-19 Edwards Ltd Gas purged valve
JP7361640B2 (ja) * 2020-03-09 2023-10-16 エドワーズ株式会社 真空ポンプ
US20210402351A1 (en) * 2020-06-26 2021-12-30 Zimmer, Inc. Vacuum generation process for deposition of biomedical implant materials
US11931682B2 (en) 2020-09-22 2024-03-19 Edwards Vacuum Llc Waste gas abatement technology for semiconductor processing

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US5453125A (en) * 1994-02-17 1995-09-26 Krogh; Ole D. ECR plasma source for gas abatement
IE80909B1 (en) * 1996-06-14 1999-06-16 Air Liquide An improved process and system for separation and recovery of perfluorocompound gases
US6153260A (en) * 1997-04-11 2000-11-28 Applied Materials, Inc. Method for heating exhaust gas in a substrate reactor
JP3050195B2 (ja) * 1997-12-09 2000-06-12 日本電気株式会社 Ｃｖｄ装置の排気ガス処理方法及び装置
US6689252B1 (en) * 1999-07-28 2004-02-10 Applied Materials, Inc. Abatement of hazardous gases in effluent
US6468490B1 (en) * 2000-06-29 2002-10-22 Applied Materials, Inc. Abatement of fluorine gas from effluent
US6423284B1 (en) * 1999-10-18 2002-07-23 Advanced Technology Materials, Inc. Fluorine abatement using steam injection in oxidation treatment of semiconductor manufacturing effluent gases
JP2001252527A (ja) 2000-03-13 2001-09-18 Seiko Epson Corp Ｐｆｃの処理方法および処理装置
US6592817B1 (en) * 2000-03-31 2003-07-15 Applied Materials, Inc. Monitoring an effluent from a chamber
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JP2004223365A (ja) 2003-01-21 2004-08-12 Rohm Co Ltd ガス処理装置
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JP2006332339A (ja) * 2005-05-26 2006-12-07 Sharp Corp 真空装置及び除害システム

Also Published As

Publication number Publication date
GB0521944D0 (en) 2005-12-07
WO2007048995A1 (en) 2007-05-03
US20100071548A1 (en) 2010-03-25
CN101297063A (zh) 2008-10-29
JP2009513330A (ja) 2009-04-02
EP1941073A1 (en) 2008-07-09
EP1941073B1 (en) 2013-04-17
TW200719945A (en) 2007-06-01
CN101297063B (zh) 2012-07-04
US8480861B2 (en) 2013-07-09

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