KR20080056287A - 도프된 실리콘 질화물 필름의 저온 증착 방법 및 장치 - Google Patents

도프된 실리콘 질화물 필름의 저온 증착 방법 및 장치 Download PDF

Info

Publication number
KR20080056287A
KR20080056287A KR1020087010904A KR20087010904A KR20080056287A KR 20080056287 A KR20080056287 A KR 20080056287A KR 1020087010904 A KR1020087010904 A KR 1020087010904A KR 20087010904 A KR20087010904 A KR 20087010904A KR 20080056287 A KR20080056287 A KR 20080056287A
Authority
KR
South Korea
Prior art keywords
nitrogen
substrate
silicon
depositing
layer containing
Prior art date
Application number
KR1020087010904A
Other languages
English (en)
Korean (ko)
Inventor
알. 수르야나라야난 아이어
자콥 더블유. 스미쓰
신 엠. 슈터
캉잔 창
앤드류 엠. 람
케빈 엘. 천닝햄
파니 라마찬드란
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20080056287A publication Critical patent/KR20080056287A/ko

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • C23C16/345Silicon nitride
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/4557Heated nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
KR1020087010904A 2005-10-06 2006-08-29 도프된 실리콘 질화물 필름의 저온 증착 방법 및 장치 KR20080056287A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/245,373 US20070082507A1 (en) 2005-10-06 2005-10-06 Method and apparatus for the low temperature deposition of doped silicon nitride films
US11/245,373 2005-10-06

Publications (1)

Publication Number Publication Date
KR20080056287A true KR20080056287A (ko) 2008-06-20

Family

ID=37911511

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087010904A KR20080056287A (ko) 2005-10-06 2006-08-29 도프된 실리콘 질화물 필름의 저온 증착 방법 및 장치

Country Status (6)

Country Link
US (1) US20070082507A1 (zh)
JP (1) JP2009512188A (zh)
KR (1) KR20080056287A (zh)
CN (1) CN101283115A (zh)
TW (1) TW200721271A (zh)
WO (1) WO2007044145A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200073452A (ko) 2018-12-14 2020-06-24 주성엔지니어링(주) 저온 실리콘 절연막 증착 방법

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7602009B2 (en) * 2005-06-16 2009-10-13 Micron Technology, Inc. Erasable non-volatile memory device using hole trapping in high-K dielectrics
WO2007131343A1 (en) * 2006-05-15 2007-11-22 Arise Technologies Corporation Low-temperature doping processes for silicon wafer devices
US7629273B2 (en) * 2006-09-19 2009-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method for modulating stresses of a contact etch stop layer
US7993700B2 (en) * 2007-03-01 2011-08-09 Applied Materials, Inc. Silicon nitride passivation for a solar cell
US7910446B2 (en) * 2007-07-16 2011-03-22 Applied Materials, Inc. Integrated scheme for forming inter-poly dielectrics for non-volatile memory devices
US20090159958A1 (en) * 2007-12-20 2009-06-25 Spansion Llc Electronic device including a silicon nitride layer and a process of forming the same
EP2341531A4 (en) * 2008-09-26 2012-05-16 Rohm Co Ltd SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
JP5665289B2 (ja) 2008-10-29 2015-02-04 株式会社日立国際電気 半導体装置の製造方法、基板処理方法および基板処理装置
SG10201401671SA (en) * 2009-04-21 2014-07-30 Applied Materials Inc Cvd apparatus for improved film thickness non-uniformity and particle performance
GB2471128A (en) * 2009-06-18 2010-12-22 Rec Solar As Surface passivation of silicon wafers
CN102383106B (zh) * 2010-09-03 2013-12-25 甘志银 快速清除残余反应气体的金属有机物化学气相沉积反应腔体
US10504719B2 (en) 2012-04-25 2019-12-10 Applied Materials, Inc. Cooled reflective adapter plate for a deposition chamber
JP6041527B2 (ja) * 2012-05-16 2016-12-07 キヤノン株式会社 液体吐出ヘッド
JP2014184513A (ja) 2013-03-22 2014-10-02 Toshiba Corp 電気部品およびその製造方法
CN103278124B (zh) * 2013-05-10 2016-03-02 京东方科技集团股份有限公司 薄膜厚度的测试方法和装置
WO2015023435A1 (en) * 2013-08-12 2015-02-19 Applied Materials, Inc. Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors
JP6123688B2 (ja) * 2014-01-29 2017-05-10 東京エレクトロン株式会社 成膜装置
US11017997B2 (en) * 2017-01-13 2021-05-25 Applied Materials, Inc. Methods and apparatus for low temperature silicon nitride films
JP6270191B1 (ja) * 2017-05-17 2018-01-31 日本新工芯技株式会社 保護材用リング
JPWO2019087445A1 (ja) * 2017-10-31 2020-04-09 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置、およびプログラム
JP2021536130A (ja) * 2018-09-05 2021-12-23 アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated 基板処理チャンバ用ガス注入システム
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
US20220084845A1 (en) * 2020-09-17 2022-03-17 Applied Materials, Inc. High conductance process kit
CN113950742A (zh) * 2021-08-30 2022-01-18 长江存储科技有限责任公司 三维nand存储器器件及其形成方法
CN115928203A (zh) * 2022-12-27 2023-04-07 西安奕斯伟材料科技有限公司 外延晶圆生产设备、外延晶圆生产方法和装置

Family Cites Families (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4496609A (en) * 1969-10-15 1985-01-29 Applied Materials, Inc. Chemical vapor deposition coating process employing radiant heat and a susceptor
US6379466B1 (en) * 1992-01-17 2002-04-30 Applied Materials, Inc. Temperature controlled gas distribution plate
US5300322A (en) * 1992-03-10 1994-04-05 Martin Marietta Energy Systems, Inc. Molybdenum enhanced low-temperature deposition of crystalline silicon nitride
US5607009A (en) * 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
JP3265042B2 (ja) * 1993-03-18 2002-03-11 東京エレクトロン株式会社 成膜方法
US5800686A (en) * 1993-04-05 1998-09-01 Applied Materials, Inc. Chemical vapor deposition chamber with substrate edge protection
US5511799A (en) * 1993-06-07 1996-04-30 Applied Materials, Inc. Sealing device useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential
US5676205A (en) * 1993-10-29 1997-10-14 Applied Materials, Inc. Quasi-infinite heat source/sink
US5894887A (en) * 1995-11-30 1999-04-20 Applied Materials, Inc. Ceramic dome temperature control using heat pipe structure and method
US5720818A (en) * 1996-04-26 1998-02-24 Applied Materials, Inc. Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
US5772773A (en) * 1996-05-20 1998-06-30 Applied Materials, Inc. Co-axial motorized wafer lift
US6342277B1 (en) * 1996-08-16 2002-01-29 Licensee For Microelectronics: Asm America, Inc. Sequential chemical vapor deposition
US5916365A (en) * 1996-08-16 1999-06-29 Sherman; Arthur Sequential chemical vapor deposition
US5977519A (en) * 1997-02-28 1999-11-02 Applied Komatsu Technology, Inc. Heating element with a diamond sealing material
US6090442A (en) * 1997-04-14 2000-07-18 University Technology Corporation Method of growing films on substrates at room temperatures using catalyzed binary reaction sequence chemistry
TW524873B (en) * 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
US5968276A (en) * 1997-07-11 1999-10-19 Applied Materials, Inc. Heat exchange passage connection
US6287965B1 (en) * 1997-07-28 2001-09-11 Samsung Electronics Co, Ltd. Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor
KR100385946B1 (ko) * 1999-12-08 2003-06-02 삼성전자주식회사 원자층 증착법을 이용한 금속층 형성방법 및 그 금속층을장벽금속층, 커패시터의 상부전극, 또는 하부전극으로구비한 반도체 소자
KR100261017B1 (ko) * 1997-08-19 2000-08-01 윤종용 반도체 장치의 금속 배선층을 형성하는 방법
US6079356A (en) * 1997-12-02 2000-06-27 Applied Materials, Inc. Reactor optimized for chemical vapor deposition of titanium
US6018616A (en) * 1998-02-23 2000-01-25 Applied Materials, Inc. Thermal cycling module and process using radiant heat
US6202656B1 (en) * 1998-03-03 2001-03-20 Applied Materials, Inc. Uniform heat trace and secondary containment for delivery lines for processing system
JP4214585B2 (ja) * 1998-04-24 2009-01-28 富士ゼロックス株式会社 半導体デバイス、半導体デバイスの製造方法及び製造装置
KR100275738B1 (ko) * 1998-08-07 2000-12-15 윤종용 원자층 증착법을 이용한 박막 제조방법
US6572814B2 (en) * 1998-09-08 2003-06-03 Applied Materials Inc. Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
KR100327328B1 (ko) * 1998-10-13 2002-05-09 윤종용 부분적으로다른두께를갖는커패시터의유전막형성방버뵤
US6454860B2 (en) * 1998-10-27 2002-09-24 Applied Materials, Inc. Deposition reactor having vaporizing, mixing and cleaning capabilities
US6569482B2 (en) * 1998-10-30 2003-05-27 Excel Corporation Method for surface treating animal tissue
US6462371B1 (en) * 1998-11-24 2002-10-08 Micron Technology Inc. Films doped with carbon for use in integrated circuit technology
US6200893B1 (en) * 1999-03-11 2001-03-13 Genus, Inc Radical-assisted sequential CVD
US6305314B1 (en) * 1999-03-11 2001-10-23 Genvs, Inc. Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition
US6153261A (en) * 1999-05-28 2000-11-28 Applied Materials, Inc. Dielectric film deposition employing a bistertiarybutylaminesilane precursor
US6245192B1 (en) * 1999-06-30 2001-06-12 Lam Research Corporation Gas distribution apparatus for semiconductor processing
US6586343B1 (en) * 1999-07-09 2003-07-01 Applied Materials, Inc. Method and apparatus for directing constituents through a processing chamber
US6351013B1 (en) * 1999-07-13 2002-02-26 Advanced Micro Devices, Inc. Low-K sub spacer pocket formation for gate capacitance reduction
US6391785B1 (en) * 1999-08-24 2002-05-21 Interuniversitair Microelektronica Centrum (Imec) Method for bottomless deposition of barrier layers in integrated circuit metallization schemes
US6511539B1 (en) * 1999-09-08 2003-01-28 Asm America, Inc. Apparatus and method for growth of a thin film
US6548414B2 (en) * 1999-09-14 2003-04-15 Infineon Technologies Ag Method of plasma etching thin films of difficult to dry etch materials
KR100390822B1 (ko) * 1999-12-28 2003-07-10 주식회사 하이닉스반도체 이미지센서에서의 암전류 감소 방법
JP3819660B2 (ja) * 2000-02-15 2006-09-13 株式会社日立国際電気 半導体装置の製造方法および半導体製造装置
US6261408B1 (en) * 2000-02-16 2001-07-17 Applied Materials, Inc. Method and apparatus for semiconductor processing chamber pressure control
US6350320B1 (en) * 2000-02-22 2002-02-26 Applied Materials, Inc. Heater for processing chamber
US6518626B1 (en) * 2000-02-22 2003-02-11 Micron Technology, Inc. Method of forming low dielectric silicon oxynitride spacer films highly selective of etchants
DE60125338T2 (de) * 2000-03-07 2007-07-05 Asm International N.V. Gradierte dünne schichten
US6660664B1 (en) * 2000-03-31 2003-12-09 International Business Machines Corp. Structure and method for formation of a blocked silicide resistor
KR100363088B1 (ko) * 2000-04-20 2002-12-02 삼성전자 주식회사 원자층 증착방법을 이용한 장벽 금속막의 제조방법
US6630413B2 (en) * 2000-04-28 2003-10-07 Asm Japan K.K. CVD syntheses of silicon nitride materials
US6271054B1 (en) * 2000-06-02 2001-08-07 International Business Machines Corporation Method for reducing dark current effects in a charge couple device
US6582522B2 (en) * 2000-07-21 2003-06-24 Applied Materials, Inc. Emissivity-change-free pumping plate kit in a single wafer chamber
JP2002129334A (ja) * 2000-10-26 2002-05-09 Applied Materials Inc 気相堆積装置のクリーニング方法及び気相堆積装置
KR100385947B1 (ko) * 2000-12-06 2003-06-02 삼성전자주식회사 원자층 증착 방법에 의한 박막 형성 방법
US6825447B2 (en) * 2000-12-29 2004-11-30 Applied Materials, Inc. Apparatus and method for uniform substrate heating and contaminate collection
US6878206B2 (en) * 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6709721B2 (en) * 2001-03-28 2004-03-23 Applied Materials Inc. Purge heater design and process development for the improvement of low k film properties
US6528430B2 (en) * 2001-05-01 2003-03-04 Samsung Electronics Co., Ltd. Method of forming silicon containing thin films by atomic layer deposition utilizing Si2C16 and NH3
US6537928B1 (en) * 2002-02-19 2003-03-25 Asm Japan K.K. Apparatus and method for forming low dielectric constant film
JP2002343790A (ja) * 2001-05-21 2002-11-29 Nec Corp 金属化合物薄膜の気相堆積方法及び半導体装置の製造方法
US6566246B1 (en) * 2001-05-21 2003-05-20 Novellus Systems, Inc. Deposition of conformal copper seed layers by control of barrier layer morphology
US6391803B1 (en) * 2001-06-20 2002-05-21 Samsung Electronics Co., Ltd. Method of forming silicon containing thin films by atomic layer deposition utilizing trisdimethylaminosilane
US20030045098A1 (en) * 2001-08-31 2003-03-06 Applied Materials, Inc. Method and apparatus for processing a wafer
US6960537B2 (en) * 2001-10-02 2005-11-01 Asm America, Inc. Incorporation of nitrogen into high k dielectric film
US20030072884A1 (en) * 2001-10-15 2003-04-17 Applied Materials, Inc. Method of titanium and titanium nitride layer deposition
US6916398B2 (en) * 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6743681B2 (en) * 2001-11-09 2004-06-01 Micron Technology, Inc. Methods of Fabricating Gate and Storage Dielectric Stacks having Silicon-Rich-Nitride
US6551893B1 (en) * 2001-11-27 2003-04-22 Micron Technology, Inc. Atomic layer deposition of capacitor dielectric
US6773507B2 (en) * 2001-12-06 2004-08-10 Applied Materials, Inc. Apparatus and method for fast-cycle atomic layer deposition
US7081271B2 (en) * 2001-12-07 2006-07-25 Applied Materials, Inc. Cyclical deposition of refractory metal silicon nitride
US6559074B1 (en) * 2001-12-12 2003-05-06 Applied Materials, Inc. Method of forming a silicon nitride layer on a substrate
US6696332B2 (en) * 2001-12-26 2004-02-24 Texas Instruments Incorporated Bilayer deposition to avoid unwanted interfacial reactions during high K gate dielectric processing
US6790755B2 (en) * 2001-12-27 2004-09-14 Advanced Micro Devices, Inc. Preparation of stack high-K gate dielectrics with nitrided layer
US20030124818A1 (en) * 2001-12-28 2003-07-03 Applied Materials, Inc. Method and apparatus for forming silicon containing films
US6827815B2 (en) * 2002-01-15 2004-12-07 Applied Materials, Inc. Showerhead assembly for a processing chamber
US6620670B2 (en) * 2002-01-18 2003-09-16 Applied Materials, Inc. Process conditions and precursors for atomic layer deposition (ALD) of AL2O3
US6730175B2 (en) * 2002-01-22 2004-05-04 Applied Materials, Inc. Ceramic substrate support
WO2003065424A2 (en) * 2002-01-25 2003-08-07 Applied Materials, Inc. Apparatus for cyclical deposition of thin films
US6911391B2 (en) * 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6777352B2 (en) * 2002-02-11 2004-08-17 Applied Materials, Inc. Variable flow deposition apparatus and method in semiconductor substrate processing
JP3937892B2 (ja) * 2002-04-01 2007-06-27 日本電気株式会社 薄膜形成方法および半導体装置の製造方法
US6720027B2 (en) * 2002-04-08 2004-04-13 Applied Materials, Inc. Cyclical deposition of a variable content titanium silicon nitride layer
US6846516B2 (en) * 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6869838B2 (en) * 2002-04-09 2005-03-22 Applied Materials, Inc. Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
US6613637B1 (en) * 2002-05-31 2003-09-02 Lsi Logic Corporation Composite spacer scheme with low overlapped parasitic capacitance
US20040033677A1 (en) * 2002-08-14 2004-02-19 Reza Arghavani Method and apparatus to prevent lateral oxidation in a transistor utilizing an ultra thin oxygen-diffusion barrier
US20040052969A1 (en) * 2002-09-16 2004-03-18 Applied Materials, Inc. Methods for operating a chemical vapor deposition chamber using a heated gas distribution plate
US6946033B2 (en) * 2002-09-16 2005-09-20 Applied Materials Inc. Heated gas distribution plate for a processing chamber
JP4265409B2 (ja) * 2003-02-13 2009-05-20 三菱マテリアル株式会社 Si−Si結合を有する有機Si含有化合物を用いたSi含有薄膜の形成方法
US7031600B2 (en) * 2003-04-07 2006-04-18 Applied Materials, Inc. Method and apparatus for silicon oxide deposition on large area substrates
US20050109276A1 (en) * 2003-11-25 2005-05-26 Applied Materials, Inc. Thermal chemical vapor deposition of silicon nitride using BTBAS bis(tertiary-butylamino silane) in a single wafer chamber
US20050287747A1 (en) * 2004-06-29 2005-12-29 International Business Machines Corporation Doped nitride film, doped oxide film and other doped films
DE102004047631B4 (de) * 2004-09-30 2010-02-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Ausbilden einer Halbleiterstruktur in Form eines Feldeffekttransistors mit einem verspannten Kanalgebiet und Halbleiterstruktur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200073452A (ko) 2018-12-14 2020-06-24 주성엔지니어링(주) 저온 실리콘 절연막 증착 방법

Also Published As

Publication number Publication date
WO2007044145A2 (en) 2007-04-19
JP2009512188A (ja) 2009-03-19
US20070082507A1 (en) 2007-04-12
CN101283115A (zh) 2008-10-08
WO2007044145A3 (en) 2007-07-12
TW200721271A (en) 2007-06-01

Similar Documents

Publication Publication Date Title
KR20080056287A (ko) 도프된 실리콘 질화물 필름의 저온 증착 방법 및 장치
KR101164688B1 (ko) 게이트 스택 측벽 스페이서들을 제조하기 위한 방법
KR101327923B1 (ko) 보론 니트라이드 및 보론 니트라이드-유도된 물질 증착 방법
US7498270B2 (en) Method of forming a silicon oxynitride film with tensile stress
US7294581B2 (en) Method for fabricating silicon nitride spacer structures
KR100313091B1 (ko) 반도체장치의 TaON 게이트절연막 형성방법
US7473655B2 (en) Method for silicon based dielectric chemical vapor deposition
KR101216203B1 (ko) 질화규소의 열화학기상증착
TWI373824B (en) Method of fabricating a silicon nitride stack
US20130260564A1 (en) Insensitive dry removal process for semiconductor integration
US20080145536A1 (en) METHOD AND APPARATUS FOR LOW TEMPERATURE AND LOW K SiBN DEPOSITION
US6177305B1 (en) Fabrication of metal-insulator-metal capacitive structures
US20030020111A1 (en) Economic and low thermal budget spacer nitride process
US7514316B2 (en) Semiconductor device and method of manufacturing the same
KR20030041088A (ko) 유전체 박막 제조 방법 및 시스템
US20060234434A1 (en) PECVD nitride film
US10593543B2 (en) Method of depositing doped amorphous silicon films with enhanced defect control, reduced substrate sensitivity to in-film defects and bubble-free film growth
US7189659B2 (en) Method for fabricating a semiconductor device
KR101008490B1 (ko) 저온 화학기상증착에 의한 산화막 증착 방법
KR100562316B1 (ko) 반도체 소자의 금속전 유전체막 제조 방법

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
E902 Notification of reason for refusal
AMND Amendment
E90F Notification of reason for final refusal
AMND Amendment
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
B701 Decision to grant
NORF Unpaid initial registration fee