KR20080018137A - 마이크로 및 나노 구조체의 제조방법 - Google Patents

마이크로 및 나노 구조체의 제조방법 Download PDF

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Publication number
KR20080018137A
KR20080018137A KR1020070084370A KR20070084370A KR20080018137A KR 20080018137 A KR20080018137 A KR 20080018137A KR 1020070084370 A KR1020070084370 A KR 1020070084370A KR 20070084370 A KR20070084370 A KR 20070084370A KR 20080018137 A KR20080018137 A KR 20080018137A
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South Korea
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layer
etching process
etching
optical
particles
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Ceased
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KR1020070084370A
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English (en)
Korean (ko)
Inventor
벤종 왕
수 진 추아
Original Assignee
에이전시 포 사이언스, 테크놀로지 앤드 리서치
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Publication of KR20080018137A publication Critical patent/KR20080018137A/ko
Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00365Production of microlenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0012Arrays characterised by the manufacturing method
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0037Arrays characterized by the distribution or form of lenses
    • G02B3/0056Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/888Shaping or removal of materials, e.g. etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24149Honeycomb-like
    • Y10T428/24165Hexagonally shaped cavities
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909Free metal or mineral containing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Biophysics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Led Devices (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Drying Of Semiconductors (AREA)
KR1020070084370A 2006-08-22 2007-08-22 마이크로 및 나노 구조체의 제조방법 Ceased KR20080018137A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200605650-1 2006-08-22
SG200605650-1A SG140481A1 (en) 2006-08-22 2006-08-22 A method for fabricating micro and nano structures

Publications (1)

Publication Number Publication Date
KR20080018137A true KR20080018137A (ko) 2008-02-27

Family

ID=39112385

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070084370A Ceased KR20080018137A (ko) 2006-08-22 2007-08-22 마이크로 및 나노 구조체의 제조방법

Country Status (4)

Country Link
US (2) US7833425B2 (https=)
JP (1) JP2008091880A (https=)
KR (1) KR20080018137A (https=)
SG (1) SG140481A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101340845B1 (ko) * 2011-01-13 2013-12-13 한국기계연구원 기능성 표면의 제조방법

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG140481A1 (en) * 2006-08-22 2008-03-28 Agency Science Tech & Res A method for fabricating micro and nano structures
CN102124582B (zh) * 2008-06-26 2013-11-06 3M创新有限公司 半导体光转换构造
CN102124581B (zh) * 2008-06-26 2013-09-25 3M创新有限公司 光转换构造
CN102124577A (zh) * 2008-06-26 2011-07-13 3M创新有限公司 制造光提取器的方法
US20110101402A1 (en) * 2008-06-26 2011-05-05 Jun-Ying Zhang Semiconductor light converting construction
CN102754217B (zh) * 2009-11-17 2016-07-06 3M创新有限公司 吸光基材的织构化表面
JP5298035B2 (ja) * 2010-01-14 2013-09-25 パナソニック株式会社 基板の加工方法
CN102259832A (zh) 2010-05-27 2011-11-30 清华大学 三维纳米结构阵列的制备方法
CN102259831A (zh) * 2010-05-27 2011-11-30 清华大学 三维纳米结构阵列
CN101859856B (zh) * 2010-06-04 2016-06-15 清华大学 发光二极管
TWI449658B (zh) * 2010-06-07 2014-08-21 Hon Hai Prec Ind Co Ltd 三維奈米結構陣列之製備方法
KR101795020B1 (ko) 2010-07-30 2017-11-07 엘지이노텍 주식회사 표면적 향상 나노 임프린트용 스탬프 및 그 제조 방법
CN102097518B (zh) * 2010-12-15 2012-12-19 清华大学 太阳能电池及其制备方法
JP5862354B2 (ja) * 2011-04-15 2016-02-16 三菱化学株式会社 窒化物系発光ダイオード素子とその製造方法
EP2922103B1 (en) * 2012-08-21 2017-04-05 Oji Holdings Corporation Substrate for semiconductor light emitting elements and semiconductor light emitting element
US8852974B2 (en) 2012-12-06 2014-10-07 Epistar Corporation Semiconductor light-emitting device and method for manufacturing the same
CN103107251A (zh) * 2013-02-27 2013-05-15 中国科学院半导体研究所 一种具有六棱锥形p型氮化镓的发光二极管制备方法
JP6256220B2 (ja) * 2013-06-17 2018-01-10 王子ホールディングス株式会社 半導体発光素子用基板、半導体発光素子、半導体発光素子用基板の製造方法、および、半導体発光素子の製造方法
TWI548113B (zh) 2014-03-11 2016-09-01 國立臺灣大學 半導體發光元件及其製造方法
US10067270B2 (en) * 2014-08-29 2018-09-04 National Institute For Materials Science Electromagnetic wave absorbing/radiating material, method of manufacturing same, and infrared source
CN107293625B (zh) * 2017-06-19 2019-02-22 南京大学 AlGaN异质结纳米柱阵列发光器件及其制备方法
JP6841198B2 (ja) * 2017-09-28 2021-03-10 豊田合成株式会社 発光素子の製造方法
US11037794B2 (en) * 2018-09-26 2021-06-15 The Regents Of The University Of California Methods for multiple-patterning nanosphere lithography for fabrication of periodic three-dimensional hierarchical nanostructures

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136460A (ja) * 1991-06-19 1993-06-01 Matsushita Electric Ind Co Ltd マイクロレンズ形成方法
JPH10320772A (ja) * 1997-05-22 1998-12-04 Hitachi Ltd 高密度磁気記録媒体作製法およびこれによる高密度磁気記録媒体
JP5019664B2 (ja) * 1998-07-28 2012-09-05 アイメック 高効率で光を発するデバイスおよびそのようなデバイスの製造方法
US6504180B1 (en) 1998-07-28 2003-01-07 Imec Vzw And Vrije Universiteit Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom
US6350388B1 (en) 1999-08-19 2002-02-26 Micron Technology, Inc. Method for patterning high density field emitter tips
DE19943406C2 (de) 1999-09-10 2001-07-19 Osram Opto Semiconductors Gmbh Lichtemissionsdiode mit Oberflächenstrukturierung
JP3802424B2 (ja) 2002-01-15 2006-07-26 株式会社東芝 半導体発光素子及びその製造方法
JP3782357B2 (ja) * 2002-01-18 2006-06-07 株式会社東芝 半導体発光素子の製造方法
EP1579511B1 (de) * 2002-12-30 2012-03-28 OSRAM Opto Semiconductors GmbH Verfahren zum aufrauhen einer oberfläche eines optoelektronischen halbleiterkörpers.
US7419912B2 (en) * 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
JP2006261659A (ja) * 2005-02-18 2006-09-28 Sumitomo Chemical Co Ltd 半導体発光素子の製造方法
SG140481A1 (en) 2006-08-22 2008-03-28 Agency Science Tech & Res A method for fabricating micro and nano structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101340845B1 (ko) * 2011-01-13 2013-12-13 한국기계연구원 기능성 표면의 제조방법

Also Published As

Publication number Publication date
JP2008091880A (ja) 2008-04-17
US20110095324A1 (en) 2011-04-28
US8211321B2 (en) 2012-07-03
US20080047929A1 (en) 2008-02-28
US7833425B2 (en) 2010-11-16
SG140481A1 (en) 2008-03-28

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