KR20070089053A - 열경화성 수지조성물, ｂ-스테이지화된 수지필름 및 다층빌드업 기판 - Google Patents

열경화성 수지조성물, ｂ-스테이지화된 수지필름 및 다층빌드업 기판 Download PDF

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Publication number
KR20070089053A
KR20070089053A KR1020070015930A KR20070015930A KR20070089053A KR 20070089053 A KR20070089053 A KR 20070089053A KR 1020070015930 A KR1020070015930 A KR 1020070015930A KR 20070015930 A KR20070015930 A KR 20070015930A KR 20070089053 A KR20070089053 A KR 20070089053A
Authority
KR
South Korea
Prior art keywords
resin
weight
parts
modified phenol
thermosetting
Prior art date
Application number
KR1020070015930A
Other languages
English (en)
Korean (ko)
Inventor
테츠아키 스즈키
나오야 카키우치
유스케 타나하시
Original Assignee
타무라 카켄 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타무라 카켄 코포레이션 filed Critical 타무라 카켄 코포레이션
Publication of KR20070089053A publication Critical patent/KR20070089053A/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/44—Sample treatment involving radiation, e.g. heat

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020070015930A 2006-02-27 2007-02-15 열경화성 수지조성물, ｂ-스테이지화된 수지필름 및 다층빌드업 기판 KR20070089053A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00050087 2006-02-27
JP2006050087A JP2007224242A (ja) 2006-02-27 2006-02-27 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板

Publications (1)

Publication Number Publication Date
KR20070089053A true KR20070089053A (ko) 2007-08-30

Family

ID=38546338

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070015930A KR20070089053A (ko) 2006-02-27 2007-02-15 열경화성 수지조성물, ｂ-스테이지화된 수지필름 및 다층빌드업 기판

Country Status (4)

Country Link
JP (1) JP2007224242A (zh)
KR (1) KR20070089053A (zh)
CN (1) CN101029166A (zh)
TW (1) TW200738815A (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5047024B2 (ja) * 2008-03-25 2012-10-10 三菱電機株式会社 熱伝導性樹脂組成物、熱伝導性樹脂シート及びパワーモジュール
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
JP2010083966A (ja) * 2008-09-30 2010-04-15 Sekisui Chem Co Ltd 樹脂組成物、硬化体及び積層体
WO2010071107A1 (ja) * 2008-12-15 2010-06-24 宇部興産株式会社 熱硬化性変性ポリイミド樹脂組成物
KR101906687B1 (ko) 2010-03-08 2018-12-05 아지노모토 가부시키가이샤 트렌치형 회로 기판의 제조방법
WO2012105558A1 (ja) * 2011-02-01 2012-08-09 Dic株式会社 熱硬化型樹脂組成物、その硬化物およびプリント配線板用層間接着フィルム
JP2013077590A (ja) * 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd 層間絶縁用の樹脂フィルムおよびビルドアップ配線基板
CN103819870B (zh) * 2012-11-16 2016-06-15 株式会社田村制作所 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板
JP6258770B2 (ja) * 2014-04-24 2018-01-10 Ｊｆｅケミカル株式会社 電子基板およびカバーレイフィルム
KR101943698B1 (ko) * 2016-01-29 2019-01-29 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
CN106773215A (zh) * 2017-01-06 2017-05-31 京东方科技集团股份有限公司 一种彩膜基板、其制作方法、液晶显示器及显示装置
TWI773745B (zh) * 2017-04-24 2022-08-11 日商味之素股份有限公司 樹脂組成物
JP7347931B2 (ja) * 2018-12-26 2023-09-20 スリーエム イノベイティブ プロパティズ カンパニー マイクロ流体デバイス用フィルム、マイクロ流体デバイス及びその製造方法

Also Published As

Publication number Publication date
CN101029166A (zh) 2007-09-05
TW200738815A (en) 2007-10-16
JP2007224242A (ja) 2007-09-06

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