KR20070061418A - Heat treatment unit - Google Patents

Abstract

A heat treatment apparatus is provided to restrain the damage of a large sized substrate and to reduce the size of the apparatus by using a transfer path enclosed with a casing and first/second sheet type heaters. A heat treatment apparatus includes a transfer path for transferring a substrate to one way, a casing, and first and second sheet type heaters. The casing(6) is used for enclosing the transfer path. The first and second sheet type heaters(71a to 71r, 72a to 72r) are arranged along the transfer path in the casing. The first and second sheet type heaters are installed adjacent to both sides of the substrate. The transfer path is composed of a plurality of rotator members spaced apart from each other. The first and second sheet type heaters are installed at portions between the rotator members.

Description

Heat Treatment Unit {HEAT TREATMENT UNIT}

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a resist coating / development processing system equipped with a heat treatment apparatus according to the present invention for forming a resist film on a glass substrate for FPD and developing the resist film after exposure treatment.

2 is a cross-sectional view in the planar direction of the heat treatment apparatus.

3 is a cross-sectional view in the lateral direction of the heat treatment apparatus.

4 is a schematic plan view of the first and second planar heaters constituting the heat treatment apparatus.

5 is a conceptual diagram showing a control system of the first and second surface heaters.

It is a figure for demonstrating the heat processing of the board | substrate in a heat processing apparatus.

7 is a conceptual diagram illustrating another example of the control system of the first and second surface heaters.

** Description of reference numerals indicating major parts **

28, 31 ... Heating unit (heating unit)

5. Rotor conveyance mechanism

6 ... Casing

50 ... rotor member

52 ... outer periphery

63 ... inner wall

64 ... outer walls

65 ...

71 (71a to 71r). First surface heater

72 (72a to 72r). Second surface heater

G ...

This invention relates to the heat processing apparatus which heat-processes board | substrates, such as a glass substrate for flat panel displays (FPD).

In the manufacture of FPDs, photolithography techniques are used to form circuit patterns on glass substrates for FPDs. The formation of the circuit pattern by photolithography is performed in the order of applying a resist liquid on a glass substrate to form a resist film, exposing the resist film so as to correspond to the circuit pattern, and developing it.

In the photolithography technique, since a resist film is generally dried after formation of a resist film and after image development processing, heat processing is performed with respect to a glass substrate. In this heat treatment, a heating plate for placing a casing capable of accommodating the glass substrate and a glass substrate provided in the casing, and a heating substrate for heating and protruding from the heating plate and lifting and immersing on the heating plate, held and conveyed by the conveying arm, is heated. The heat processing apparatus provided with the lift pin which receives a phase is used (for example, refer patent document 1, 2, 3).

By the way, in recent years, the FPD has been aimed at increasing the size of a large glass substrate with a side length of 2 m or more. On the other hand, in the above-mentioned conventional heat processing apparatus, since the heating means of a glass substrate is a heating plate which mounts a glass substrate, when a glass substrate becomes large, it becomes difficult to evenly heat the whole board | substrate, and it bends to a glass substrate by heat processing. This may occur. In addition, since handleability worsens with enlargement of a glass substrate, in this heat processing apparatus, when a glass substrate becomes large, it is damaged by the impact at the time of a transfer between a conveyance arm and a lifting pin, or between a lifting pin and a heating plate. There is also a fear.

On the other hand, in the heat treatment apparatus, in order to avoid the remarkable enlarging of the apparatus itself accompanying the enlargement of a board | substrate, it is desirable to reduce the space around the board | substrate in a casing very small, and to miniaturize a casing.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2002-231792

[Patent Document 2] Japanese Patent Application Laid-Open No. 2001-196299

[Patent Document 3] Japanese Patent Application Laid-Open No. 11-204428

SUMMARY OF THE INVENTION The present invention has been made in view of the related circumstances, and it is possible to suppress the occurrence of inconvenience such as bending or damage of the substrate even when the substrate is large, and at the same time, it is possible to reduce the size of the casing containing the substrate. It is for the purpose of providing.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention is a heat processing apparatus which heat-processes a board | substrate, The conveyance path which conveys a board | substrate in one direction, the casing provided to surround the said conveyance path, and the said conveyance path in the said casing along the said conveyance path It is provided with the 1st and 2nd surface heater respectively provided in the both sides of the board | substrate so that the board | substrate may approach to the board | substrate conveyed, The heat processing apparatus characterized by the above-mentioned.

In this invention, the said conveyance path carries out rotor conveyance by the rotation of the rotor member provided in multiple space | interval at one direction, and the said 1st surface heater is respectively installed between the rotor member comrades, and is conveyed direction. It is preferable to be arranged in plurality. In this case, the second planar heaters are arranged in plural in the conveying direction so as to correspond to the arrangement pitch of the first planar heaters so that the plurality of first and second planar heaters are divided into individual or conveying directions. It is preferable that temperature control is possible for every group. In this case, the plurality of first and second planar heaters are temperature-controlled for each group divided into individual or conveying directions so that the heater group formed from the plurality of first and second planar heaters is It is preferable to form a temperature profile, and it is preferable that the first and second planar heaters are each capable of temperature control in a plurality of divided regions in the width direction of the conveying path, and the second planar heater is It is preferable that it is attached to one wall part of the casing, and the one wall part of the casing functions as a door for opening and closing the inside of the casing. Moreover, in these cases, it is preferable that the said rotor member consists of a material with low thermal conductivity at least on the outer peripheral surface.

In the present invention described above, the wall portion of the casing has a double wall structure having an inner wall and an outer wall provided with empty spaces so that the space between the inner wall and the outer wall functions as an air insulating layer for insulating the inside and outside of the casing. .

Moreover, in the above this invention, it is preferable that the space | intervals of the conveyance path | route of the board | substrate which conveys the said conveyance path, and the said 1st and 2nd surface heater are 5-30 mm, respectively.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described concretely with reference to an accompanying drawing.

1 shows the formation of a resist film on a glass substrate for FPD (hereinafter, simply referred to as a "substrate") equipped with a heat treatment apparatus according to one embodiment of the present invention, and the development of the resist film after exposure treatment. A schematic plan view of a resist coating and developing treatment system.

The resist coating and developing processing system 100 performs a series of processes including resist coating and developing on the cassette station 1 and the substrate G on which the cassette C for accommodating the plurality of substrates G is placed. The interface station 4 which delivers the board | substrate G is provided between the processing station 2 and the exposure apparatus 9 which performs exposure processing to the board | substrate G, The cassette station 1 and the interface station are provided. (4) is arrange | positioned at both sides of the processing station 2, respectively. In addition, in FIG. 1, the longitudinal direction of the resist coating and developing processing system 100 is made into the Y direction the direction orthogonal to the X direction on a X direction plane.

The cassette station 1 is provided with the conveying apparatus 11 which carries in / out of the board | substrate G between the mounting base 12 and the processing station 2 which can arrange the cassette C in parallel in a Y direction, and The cassette C is conveyed between the mounting table 12 and the outside. The conveying arm 11a provided in the conveying apparatus 11 is movable along the guide 10 extending in the Y direction, and can be moved up and down, back and forth, and horizontally rotated, and the cassette C and the processing station 2 Carrying in and out of the board | substrate G is performed in between.

The processing station 2 has conveying lines A and b of two parallel rows of substrates G extending in the X direction between the cassette station 1 and the interface station 4. The conveying line A is configured to convey the substrate G from the cassette station 1 side to the interface station 4 side by so-called flat flow conveying such as rotor conveyance or belt conveyance, and the conveying line B is It is comprised so that board | substrate G may be conveyed toward the cassette station 1 side from the interface station 4 side by what is called flat flow conveyance, such as an electron conveyance and a belt conveyance.

On the conveying line A, from the cassette station 1 side to the interface station 4 side, excimer UV irradiation unit (e-UV, 21), scrub cleaning unit (SCR, 22), play heat unit (PH, 23) ADH Unit (AD, 24), Cooling Unit (COL, 25), Resist Coating Unit (CT, 26), Decompression Drying Unit (DP, 27), Heat Treatment Unit (HT, 28), Cooling Unit ( COL, 29) are arranged in sequence.

The excimer UV irradiation unit (e-UV) 21 performs the removal treatment of the organic matter contained in the substrate G, and the scrub cleaning unit SCR 22 performs the scrub cleaning treatment and the drying treatment of the substrate G. do. The play heat units PH and 23 perform the heat treatment of the substrate G, the ad unit units AD 24 perform the hydrophobization treatment of the substrate G, and the cooling unit COL 25 performs the substrate G. Cool). The resist coating units CT and 26 supply a resist liquid on the substrate G to form a resist film, and the vacuum drying unit DP and 27 evaporate volatile components contained in the resist film on the substrate G under reduced pressure. The resist film is dried. Subsequently, the heat treatment units HT and 28 described above heat-treat the substrate G, and the cooling units COL and 29 cool the substrate G in the same manner as the cooling units COL 25.

On the conveyance line B, the developing unit DEV, 30, the heat treatment unit HT, 31, and the cooling unit COL, 32 are sequentially arranged from the interface station 4 side to the cassette station 1 side. . Moreover, between the cooling unit COL 32 and the cassette station 1, the inspection apparatus IP 35 which examines the board | substrate G by which a series of processes including application | coating of resist and image development was performed is provided.

The developing unit DEV 30 performs application of the developer onto the substrate G, rinsing the substrate G, and drying of the substrate G in this order. The heat treatment units HT and 31 perform the heat treatment of the substrate G in the same manner as the heat treatment units HT and 28, and the cooling units COL and 32 are the same as the cooling units COL and 25. Cool the substrate G.

The interface station 4 receives the rotary stage RS, 44, which is a receiving part of the substrate G, and the transfer line A, on which the buffer cassette capable of accommodating the substrate G is disposed, and the substrate G conveyed the rotary. The conveying arm 43 which conveys to stage RS, 44 is provided. The conveyance arm 43 is capable of vertical movement, forward and backward movement and horizontal rotation, and is provided adjacent to the exposure apparatus 9 and the conveyance arm 43 and the developing unit DEV, 30 provided adjacent to the conveyance arm 43. The external device block 90 having the peripheral exposure device EE and the titler TITLER is also accessible.

The resist coating and developing processing apparatus 100 is configured to be connected to and controlled by a process controller 101 provided with a CPU. In the process controller 101, a process manager visualizes and displays the operation status of each part or each unit, or a keyboard for performing command input operations for managing each part or each unit of the resist coating and developing processing apparatus 100. Control program and processing condition data for realizing various processes such as heating process and cooling process performed by the user interface 102 and the resist coating / development processing apparatus 100 made of a display or the like to be controlled by the process controller 101. The storage unit 103 in which the recipe on which the back is recorded is stored is connected.

Then, a resist coating / development processing apparatus under the control of the process controller 101 by calling an arbitrary recipe from the storage unit 103 and executing it in the process controller 101 by an instruction or the like from the user interface 102 as necessary. The desired processing is carried out at 100. In addition, recipes, such as a control program and processing condition data, can use the computer-readable storage medium, for example, the state stored in a cD-ROM, a hard disk, a flexible disk flash memory, etc. It is also possible to transmit online at any time via a line.

In the resist coating and developing apparatus 100 configured as described above, first, the substrate G in the cassette C placed on the mounting table 12 of the cassette station 1 is the transfer arm 11a of the transfer apparatus 11. Is conveyed to the upstream end part of the conveyance line A of the processing station 2, and conveys the conveyance line A phase, and is contained in the board | substrate G by the excimer UV irradiation unit (e-UV, 21). The organic matter removal process is performed. The board | substrate G in which the removal process of the organic substance in the excimer UV irradiation unit (e-UV, 21) was complete | finished is conveyed on the conveyance line (A), and the scrub cleaning process with the scrub cleaning unit (SCR, 22), and Drying treatment is performed.

The board | substrate G in which the scrub cleaning process and the drying process in the scrub cleaning unit SCR 22 were complete | finished is conveyed on the conveyance line A phase, heat-processed by the play heat unit PH, 23, and dewatered. do. The board | substrate G by which the heat processing in the play heat unit PH and 23 was complete | finished is conveyed on the conveyance line A, and hydrophobization process is performed by the adhesion unit AD and 24. As shown in FIG. The board | substrate G in which the hydrophobization process in the adhance unit AD AD 24 was complete | finished is conveyed on the conveyance line A phase, and is cooled by the cooling unit COL 25.

The substrate G cooled by the cooling unit COL 25 is conveyed on the conveying line A and a resist film is formed by the resist coating unit CT 26. The formation of the resist film in the resist coating units CT and 26 is performed by supplying the resist liquid onto the substrate G while the substrate G is conveyed on the conveying line A.

The substrate G on which the resist film is formed by the resist coating units CT and 26 is conveyed on the conveying line A and exposed to the reduced pressure environment by the vacuum drying unit DP and 27, and the resist film is dried.

The substrate G subjected to the drying treatment of the resist film by the vacuum drying unit DP, 27 is conveyed on the conveying line A, and is subjected to heat treatment by the heat treatment unit HT, 28, and included in the resist film. Is removed. The heat processing of the board | substrate G is performed, conveying the conveyance line A phase by the rotor conveyance mechanism 5 mentioned later. The board | substrate G in which the heat processing in the heat processing units HT and 28 was complete | finished is conveyed on the conveyance line A, and is cooled by the cooling unit COL and 29. As shown in FIG.

After the board | substrate G cooled by the cooling unit COL and 29 is conveyed on the conveyance line A to a downstream end part, the rotary stage RS, 44 by the conveyance arm 43 of the interface station 4 is carried out. Is returned. Next, the substrate G is conveyed to the peripheral exposure apparatus EE of the external device block 90 by the transfer arm 43, and the exposure for removing the outer peripheral portion (unnecessary portion) of the resist film by the peripheral exposure apparatus EE. Processing is carried out. Subsequently, the board | substrate G is conveyed to the exposure apparatus 9 by the conveyance arm 43, and the exposure process of a predetermined pattern is performed to a resist film. In addition, the board | substrate G may be conveyed to the exposure apparatus 9 after being temporarily accommodated in the buffer cassette on rotary stage RS, 44. FIG. The substrate G on which the exposure process is completed is conveyed to the titler TITLER of the external device block 90 by the transfer arm 43, and predetermined information is recorded by the titler TITLER.

The board | substrate G in which predetermined | prescribed information was recorded by the titler TITLER is conveyed on the conveyance line B, and a coating process, a rinse process, and a drying process of a developing solution are performed in order by the developing unit DEV 30. For example, the coating treatment, the rinsing treatment and the drying treatment of the developing solution include, for example, the developing solution being activated on the substrate G while the substrate G is conveyed on the conveying line B. The developer is inclined at an angle and the rinse liquid is supplied onto the substrate G in this state so that the developer is washed, and then the dry gas is sprayed onto the substrate G while the substrate G is returned to the horizontal position and conveyed again. In order.

The substrate G on which the coating, rinsing, and drying processing of the developing solution in the developing unit DEV 30 has been completed is conveyed on the conveying line B, and heated by the heat treating unit HT 31. The solvent and water contained in the resist film are removed. The heat processing of the board | substrate G is performed, conveying the conveyance line B phase by the rotor conveyance mechanism 5 mentioned later. An i-ray UV irradiation unit for decolorizing the developer may be provided between the developing unit DEV 30 and the heat treatment unit HT 31. The board | substrate G by which the heat processing in heat processing unit HT, 31 was complete | finished is conveyed on the conveyance line B, and is cooled by the cooling unit COL 32.

The substrate G cooled by the cooling unit COL 32 is conveyed on the conveying line B and inspected by the inspection unit IP 35. The board | substrate G which passed the test | inspection is accommodated in the predetermined | prescribed cassette C mounted on the mounting table 12 by the conveyance arm 11a of the conveying apparatus 11 installed in the cassette station 1.

Next, the heat treatment units HT and 28 will be described in detail. The heat treatment units HT and 31 also have the same structure as the heat treatment units HT and 28.

FIG. 2 is a sectional view in a planar direction showing the heat treatment units HT 28 (heating apparatus), and FIG. 3 is a sectional view in the lateral direction thereof.

The heat treatment units HT and 28 are provided with a casing 6 and a casing 6 arranged to enclose or receive the rotor conveyance mechanism 5 and the rotor conveyance mechanism 5 for conveying the substrate G in one direction in the X-direction. The heating mechanism 7 which heats the board | substrate G currently conveyed by the rotor conveyance mechanism 5 by the rotor is provided.

The rotor conveyance mechanism 5 has a plurality of substantially cylindrical rotatable rotor members 50 extending in the Y direction at intervals in the X direction. Each of the rotor members 50 is directly or indirectly connected to a drive source such as a motor (not shown) by the rotating shaft 51 and rotates by driving of the drive source, whereby the substrate G causes the plurality of rotor members 50 to be rotated. ) Phase is conveyed toward one direction side of X direction. Moreover, the rotor member 50 has the shape which contact | abuts over the full width (Y direction) of the board | substrate G, respectively, and the outer peripheral surface part (it is hard to transfer the heat of the board | substrate G heated by the heating mechanism 7). 52 is formed of a material having a low thermal conductivity such as resin, and the rotating shaft 51 is formed of a material having a high strength and a relatively low thermal conductivity such as aluminum, stainless steel, or ceramic. As for the rotor conveyance mechanism 5, the conveyance path or conveyance surface comprises a part of conveyance line A (conveyance line B in heat processing units HT and 31).

The casing 6 is formed in a thin box shape to accommodate the substrate G in a substantially horizontal state, and each of the conveying lines A and the heating processing units HT 31 in the side wall portions facing in the X direction is formed. The board | substrate G on the conveyance line B has the slit-shaped delivery opening 61 and the delivery opening 62 which extend in the Y direction which can pass. The rotor member 50 of the rotor conveyance mechanism 5 receives the support rotatably to the bearing 600 provided in the side wall part in which the rotating shaft 51 opposes the Y direction of the casing 6, and the casing 6 is carried out. It is arranged inside.

Wall part of casing 6 Here, the upper wall part, the bottom wall part, and the side wall part facing in the Y direction have a double wall structure having an inner wall 63 and an outer wall 64 which are provided with a space therebetween, and the inner wall 63 and the outer wall ( The space 65 between 64 functions as an air insulation layer which insulates the inside and outside of the casing 6. Moreover, the heat insulating material 66 for heat-insulating inside and outside the casing 6 is provided also in the inner side surface of the outer wall 64. As shown in FIG.

The heating mechanism 7 comprises first and second surface heaters 71, 71a to 71r, 72, which are provided in the casing 6 along the conveyance path of the substrate G by the rotor conveyance mechanism 5. 72a-72r, and the 1st and 2nd surface heaters 71 and 72 are conveyed by the rotor conveyance mechanism 5 so that the 1st and 2nd surface heaters 71 and 72 may approach the board | substrate conveyed by the rotor conveyance mechanism 5, respectively. It is provided in the back surface (lower surface) side and the surface (upper surface) side of the board | substrate G to become. As a result, the casing 6 can be thinned.

The first planar heaters 71 are formed in a single-sheet shape extending in the Y direction, respectively provided between the rotor members 50, and arranged in a plurality in the X direction (71a to 71r in turn from the X-direction upstream side). have. As a result, new thinning of the casing 6 is achieved. The first planar heater 71 is mounted on and supported by, for example, a side wall portion facing the Y direction of the casing 6. The 2nd planar heater 72 is formed in the unitary shape extending in a Y direction, and is plurality (72a-in order from an X-direction upstream side) so that it may correspond to the arrangement pitch of the 1st planar heater 71. FIG. 72r)) are arranged. The second surface heater 72 is attached to the upper wall portion of the casing 6 and is supported. By the space | interval of the conveyance path of the board | substrate G conveyed by the 1st surface heater 71 and the rotor conveyance mechanism 5, and by the 2nd surface heater 72 and the rotor conveyance mechanism 5, The spacing of the conveyance path | route of the board | substrate G conveyed is the same.

In the present embodiment, the first and the second planar heaters 71 and 72 for heating the substrate G are arranged in the X direction at the same pitch so as to align the first planar heaters 71 (or The casing 6 can be configured to be divided into multiple directions in the X direction at positions (for example, p positions in FIG. 3) between the second planar heaters 72. Thereby, even if the board | substrate G enlarges, the conveyance of the heat processing apparatus 28 itself is easy.

In the present embodiment, a plurality of second planar heaters 72 for heating the substrate G are arranged in the X direction, so as to position (for example, between the second planar heaters 72). 3, the upper wall part of the casing 6 can be comprised so that opening and closing is possible in the shape of a double door (refer to the virtual line of FIG. 3). Thereby, maintenance of the rotor conveyance mechanism 5 and the heating mechanism 7 in the casing 6 can be performed easily.

As shown in Fig. 4, the first and second planar heaters 71 and 72 are respectively shown in Fig. 4 (Fig. 4 shows the first and second planar heaters 71 and 72 of the heat treatment apparatus 28. Figs. Outline plane), a plurality of mica heaters 73 (73; 73a, 73b, 73c, 73d) and a plurality of mica heaters 73 formed by arranging a heating element in the mica plate and the plurality of mica heaters 73 are mounted in the Y direction. It has the single heat exchanger 74 of the shape of single.

The plurality of first and second planar heaters 71a to 71r and 72a to 72r are shown in FIG. 5 (FIG. 5 shows a control system of the first and second planar heaters 71 and 72). Conceptual diagram), the first and second surface heaters 71a to 71g of the X-direction upstream group divided by the X-direction, (the mica heater 73 of (72a to 72g)) and the X-direction downstream group The mica heaters 73 of the first and second planar heaters 71h to 71r and 72h to 72r are connected to different heater power sources 105a and 105b, respectively. First and second planar heaters 71a to 71g and 72a to 72g of the X-direction upstream group and First and second planar heaters 71h to 71r and 72h of the X-direction downstream group 72r), respectively, are provided with a temperature sensor (not shown), and the heater power supplies 105a and 105b are each controlled by the heater controller (control unit 104) which has received a detection signal from the temperature sensor and a command from the process controller 101, respectively. do. That is, the area S consisting of the first and second surface heaters 71a to 71g and 72a to 72g of the X-direction upstream group and the first and second surface heaters of the X-direction downstream group The region T composed of 71h to 71r and 72h to 72r is configured to be temperature controlled separately by the heater controller 104. In addition, the area S and the area T may be connected to the same power supply, and the configuration may be configured so as to switch the output of the area S and the output of the area T in this power supply.

For example, the exhaust port 67 is provided in the upper wall part and the bottom wall part of the X direction both ends of the casing 6, and the exhaust device 68 is connected to the exhaust port 67, for example. Then, the exhaust device 68 is operated so that the exhaust device 68 is exhausted through the exhaust port 67. The exhaust port 67 and the exhaust device 68 constitute an exhaust mechanism for exhausting the inside of the casing 6. For example, a plurality of exhaust ports 67 may be formed in the Y direction, or may be formed in an elongated hole shape extending in the Y direction. By installing the exhaust mechanisms at both ends of the casing 6 in the X-direction, air curtains are formed at the inlet 61 and the outlet 62 so that external dust and the like are discharged from the inlet 61 and the outlet 62. Intrusion into the casing 6 is suppressed. In addition, the exhaust port 67 may be formed in the side wall part, and in this case, a plurality of long holes extending in the X direction or in the X direction may be formed.

On the other hand, for example, the upper wall portion and the bottom wall portion of the central portion in the X-direction of the casing 6 are provided with an intake port 69 as an intake mechanism for intake air in the casing. The intake port 69 may be formed in multiple numbers in the Y direction, for example, and may be formed in the elongate hole shape extended in a Y direction. In contrast to the exhaust port 67, by providing the inlet port 69 in the X-direction central portion of the casing 6, since the retention of the environment in the casing 6 can be reliably prevented, the heat generated by the heating mechanism 7 Can be effectively diffused into the casing 6 and the adhesion of the sublimation contained in the resist film generated during the heat treatment into the casing 6 can be prevented. In addition, the inlet port 69 may be formed in the side wall portion, and in this case, it may be formed in the shape of a plurality of holes in the X direction or an elongated hole shape extending in the X direction. An intake device (not shown) may be connected to the intake port 69 so that the heated air is introduced into the casing 6 by the operation of the intake device.

Next, the heat processing of the board | substrate G in the heat processing units HT and 28 comprised as mentioned above is demonstrated.

In the heat treatment unit HT, 28, the substrate G conveyed by the conveyance mechanism of the pressure reduction drying unit DP, 27 side (in the heat treatment unit HT, 31, the developing unit DEV, 30 side) is When passing through the inlet 61, the first and second surface heaters, which are received by the rotor conveyance mechanism 5 and conveyed by the rotor conveyance mechanism 5, are temperature controlled by the heater controller 104. It is heated in the casing 6 by 71 and 72. Therefore, since conveyance and heating of a board | substrate are performed in parallel, processing time can be shortened. Since the board | substrate G is heated from both sides by the 1st and 2nd surface heaters 71 and 72, it is suppressed that curvature generate | occur | produces. When the board | substrate G conveyed by the rotor conveyance mechanism 5 passes through the discharge opening 62, the cooling unit COL and 29 side (cooling unit COL and 32 in the heating processing units HT and 31). It is received by the conveyance mechanism of a side, and is conveyed by this flat flow conveyance mechanism. Therefore, since the conveyance of the board | substrate G at the time of heat processing and before and after heat processing is only the so-called flat flow type by the rotor conveyance mechanism 5 etc., the board | substrate G can be conveyed safely.

In the heat treatment, the first and second planar heaters 71a to 71g and 72a to 72g of the X-direction upstream side group and the first and second planar heaters 71h to the X-direction downstream side group. Since 71r and 72h-72r are respectively connected to the other heater power supply 105a, 105b, the 1st and 2nd surface heaters 71a-71g and 72a-72g of an X-direction upstream group The area | region S which consists of and the area | region T which consists of the 1st and 2nd surface heaters 71h-71r and 72h-72r of the X-direction downstream group can be set to another temperature. In the case where the substrate G is heated to a predetermined temperature, for example, about 130 ° C, the region T is set at a temperature roughly the same or slightly higher than the predetermined temperature, for example, about 140 to 150 ° C, When the area S is set to a temperature higher than the temperature of the area T, for example, about 170 to 180 ° C., as shown in Fig. 6 (Fig. 6 shows the substrate G in the heat treatment unit HT, 28). To explain the heat treatment of the substrate) and the substrate G conveyed by the rotor conveyance mechanism 5 is heated in the region S (see FIG. 6 (a)), and the temperature is rapidly increased to a predetermined temperature vicinity. After raising, heating can be performed in the region T (see FIG. 6 (b)) to maintain the temperature at a predetermined temperature, and the heat treatment time can be shortened.

Moreover, since the arrangement pitch of the 1st planar heater 71 and the arrangement pitch of the 2nd planar heater 72 are the same, the 1st and 2nd planar heaters 71 and 72 corresponding to the up-and-down By setting the temperature to the same heating temperature, it is possible to reliably prevent the occurrence of the warpage of the substrate G.

Next, another example of the control system of the first and second surface heaters 71 and 72 will be described. 7 is a conceptual diagram showing another example of the control system of the first and second surface heaters 71 and 72.

The plurality of first and second planar heaters 71a to 71r and 72a to 72r are configured to be temperature-controlled for each group divided in the X direction, and each group is controlled by the mica heater 73. The temperature control may be configured for each region divided into a plurality of directions, for example, the mica heaters 73a, which are provided at both sides in the Y-direction of the first and second surface heaters 71a to 71c and 72a to 72c. Region H having 73d) and region I having first and second planar heaters 71a to 71c and mica heaters 73b and 73c at the central portion in the Y direction of 72a to 72c. And the region J having the second planar heaters 71d to 71g and the mica heaters 73a and 73d on both sides of the Y-direction of the 72d to 72g, and the first and second planar heaters 71d. 71g), K having mica heaters 73b and 73c in the Y-direction central portion of (72d to 72g), and Y-direction both of the first and second surface heaters 71h to 71o and 72h to 72o. L having negative mica heaters 73a and 73d, and first and second surface shapes Of the mica heaters 73b and 73c in the center of the Y-direction at the centers 71h to 71o and 72h to 72o, and the first and second surface heaters 71p to 71r and 72p to 72r. N having mica heaters 73a and 73d in both sides of the Y direction, and mica heaters 73b and 73c in the center of the Y direction of the first and second surface heaters 71p to 71r and 72p to 72r. The area o may be connected to different heater power supplies 105c to j, and the heater power supplies 105c to j may be controlled by the heater controller 104 which has received the detection signal of the temperature sensor and the command from the process controller 101, respectively. This configuration makes it possible to more closely control the heater group composed of the plurality of first and second planar heaters 71a to 71r and 72a to 72r, and to connect the regions H to O to the same power source. It may be configured so as to change the output of the regions H to O in this power supply, to be used in combination with the control system shown in FIG. 5, and the regions H to K and the regions L to O are the same. It may be connected to a power supply, and may be configured to change the outputs of the areas H to K and the areas L to O in these power supplies, respectively.

In this case, in consideration of the heat loss caused by the side wall portion of the casing 6, the exhaust mechanism, or the like, in the region S, the temperature of the regions I, J is set higher than that of the region K, and the region I, The temperature of the region H is set higher than that of (J), and the temperature of the regions O and L is set higher than that of the region M in the region T, and the regions O and ( By setting the temperature of the region N higher than L), the heat treatment time can be shortened and the entire surface of the substrate G in the casing 6 is equalized in the region S and the region T. It can be heated to a temperature and it becomes possible to improve the quality of heat processing.

In general, when the heater is provided at a certain distance from the object to be heated, the heating efficiency is lowered instead of easily heating the heated object evenly. However, in the present embodiment, a plurality of first and second surface heaters are provided. Since temperature control is possible for every area | region where the heater group which consists of 71a-71r, 72a-72r is divided, the 1st and 2nd surface heater 71, 72 is conveyed by the rotor conveyance mechanism 5, Even if it is provided so that the board | substrate G may approach, it becomes possible to heat the whole board | substrate G evenly. In order that the board | substrate G conveyed by the rotor conveyance mechanism 5 does not contact 1st and 2nd surface heaters 71 and 72, Furthermore, 1st and 2nd surface heaters 71 and 72 In order not to reduce the heating efficiency of the s), the conveyance path of the substrate G conveyed by the rotor conveyance mechanism 5 and the interval between the first planar heater 71 and the second planar heater 72 are respectively. It is preferable to set it as 5-30 mm.

The first and second planar heaters 71a to 71r and 72a to 72r may be connected to different heater power sources, respectively, and configured to be individually temperature controlled by the heater controller 104. The mica heaters 73a to 73d of the planar heaters 71a to 71r and 72a to 72r may be connected to different heater power sources so as to be individually controlled by the heater controller 104.

In the present embodiment, the plurality of first and second surface heaters 71a to 71r and 72a to 72r are temperature controlled for each group divided into individual or X directions, and thus, the plurality of first and second surface shapes. The heater group which consists of heaters 71a-71r and 72a-72r can form the predetermined temperature profile according to a use. In addition, the 2nd surface heater 72 of the upper wall part in the main heating part 7b does not need to be provided if the bending of a board | substrate is suppressed by the preheating part 7a.

According to the present invention, like a glass substrate for FPD, the substrate is particularly suitable for a large size, but can be widely applied not only to glass substrate but also to heat treatment of other substrates such as semiconductor wafers.

According to the present invention, since the conveyance path for conveying the substrate in one direction is provided and the first and second surface heaters for heating the substrate are provided along the conveyance path, it is possible to prevent a large impact due to conveyance on the substrate. The first and second planar heaters are respectively provided on both sides of the substrate so that the heat treatment can be applied and the casing is provided so as to surround the conveying path and the conveying path is close to the substrate being conveyed in the casing. While making it possible to evenly heat the front and rear surfaces of the substrate, the space on both sides of the substrate in the casing can be kept small. Therefore, even when the substrate is large, it is possible to suppress the occurrence of inconvenience such as breakage or warpage of the substrate, and at the same time, it is possible to reduce the thickness of the casing that accommodates the substrate, that is, reduce the size.

Claims (9)

As a heat processing apparatus which heat-processes a board | substrate, A conveying path for conveying the substrate in one direction, A casing installed to surround the conveying path; And a first and second planar heater respectively provided on both sides of the substrate so as to approach the substrate to be transported in the casing along the conveyance path. The method according to claim 1, The said conveyance path carries out rotor conveyance of a board | substrate by rotation of the rotor member provided in multiple at intervals in one direction, The said 1st surface heater is respectively provided between the said rotor member comrades, and is arranged in multiple numbers in a conveyance direction, The heat processing apparatus characterized by the above-mentioned. The method according to claim 3, The second planar heater is arranged in plural in the conveying direction so as to correspond to the arrangement pitch of the first planar heater, And the plurality of first and second surface heaters are capable of temperature control for each group divided into individual or conveying directions. The method according to claim 3, The plurality of first and second planar heaters are temperature-controlled for each group divided into individual or conveying directions, and the heater group including the plurality of first and second planar heaters has a predetermined temperature profile. The heat treatment apparatus characterized by the above-mentioned. The method according to claim 3 or 4, The said 1st and 2nd surface heater is each heat-processing apparatus characterized by the temperature control for every area | region divided | segmented into the width direction of the said conveyance path. The method according to claim 3 or 4, The second surface heater is mounted on one wall of the casing, And said one wall portion of said casing functions as a door for opening and closing the inside of said casing. The method according to any one of claims 2 to 4, And said rotor member is made of a material having a low thermal conductivity at least on its outer circumferential surface. The method according to any one of claims 1 to 4, At least a part of the wall portion of the casing has a double wall structure having an inner wall and an outer wall provided with spaces therebetween, and the space between the inner wall and the outer wall functions as an air insulating layer for insulating the inside and outside of the casing. Processing unit. The method according to any one of claims 1 to 4, The distance between the conveyance path | route of the board | substrate which conveys the said conveyance path, and the said 1st and 2nd surface heater is 5-30 mm, respectively, The heat processing apparatus characterized by the above-mentioned.

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