JP2011121775A - Substrate processing device, substrate processing method, and recording medium recording program for executing the substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing device performing processing to a substrate to be processed, capable of performing substrate processing evenly to the whole surface of the substrate, and to provide a substrate processing method in the substrate processing device. <P>SOLUTION: The substrate processing device includes: a placing stage 150 with a stage surface 152 arranged in the middle of a conveying passage 34 for placing the substrate G to be processed on the stage surface 152; and first and second rotors 160, 170 arranged turnably along an axis 156 extending in a direction crossing the conveying passage 34 below the stage surface 152, formed into a shape in which a part of the rotor with a radius protrudable above the stage surface 152 is cut off along the axis 156, and having first and second chord parts 164, 174 forming a surface substantially in parallel with the stage surface 152 when located respectively at first and second rotation angle positions. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for processing a substrate, a substrate processing method in the substrate processing apparatus, and a recording medium on which a program for executing the substrate processing method is recorded.

  In the manufacture of a liquid crystal display (LCD), a substrate processing apparatus is used to apply a resist (treatment liquid) on a substrate to be processed (hereinafter also referred to as “substrate”) such as a glass substrate, and to heat the applied substrate. A photolithography process is performed to form a resist pattern by processing, exposing, and developing. In the photolithography process, after applying a resist or the like (hereinafter sometimes referred to as a “treatment liquid”), if a heat treatment for evaporating the residual solvent in the resist, ie, pre-baking, is performed immediately, the solvent will not evaporate. There is a problem that unevenness occurs in the film thickness of the coating film that is uniform and dried. This is because, for example, in a heat treatment unit that performs heat treatment, evaporation of the solvent becomes uneven in the substrate surface due to thermal influence from lift pins, support pins, vacuum grooves, or the like that come into contact with the substrate.

  Therefore, after applying the resist, prior to pre-baking, the remaining solvent in the resist on the substrate is volatilized to some extent in a reduced pressure atmosphere to form a hard layer (a kind of altered layer) on the surface of the resist coating film. A vacuum drying process is performed. By performing a vacuum drying process that solidifies only the surface layer part while keeping the inside or bulk part of the resist coating film in a liquid state, the flow of the bulk resist is suppressed during pre-baking to reduce the occurrence of dry spots, and the film thickness Prevents unevenness from occurring. This increases the resist resolution during exposure.

  A substrate processing apparatus that performs such a reduced-pressure drying process includes a reduced-pressure drying unit that includes a chamber for holding the substrate under reduced pressure (see, for example, Patent Document 1). The vacuum drying unit chamber has a tray or shallow container-type lower chamber having an open top surface, and a lid-shaped upper chamber configured to be tightly fitted or fitted to the upper surface of the lower chamber. A stage is disposed in the lower chamber. A substrate coated with a resist is placed horizontally on this stage, the chamber is closed, and the chamber is evacuated to a reduced pressure state.

  Some chambers of the vacuum drying unit have a large number of lift pins that are discretely arranged to support the substrate substantially horizontally at the tip of the pin to raise and lower it (see, for example, Patent Document 2). When carrying out the vacuum drying process, the tip of the lift pin is made higher than the roller conveyance path to support the substrate, and when carrying the substrate in and out, the pin tip of the lift pin is made lower than the roller conveyance path to Rolling is possible.

JP 2000-181079 A JP 2008-124366 A

  In the substrate processing apparatus as described above, the substrate to be processed stops in a state where the supporting member that supports the substrate to be processed is in contact with the substrate to be processed in a point-like manner in the vacuum drying unit. Therefore, there is a problem that unevenness is likely to occur in the film thickness of the coating film formed by drying under reduced pressure.

  For example, when the substrate to be processed is transported by a transport roller in a vacuum drying unit and stopped on the transport roller and subjected to a vacuum drying process, the coating film formed by the vacuum drying process is spotted. In some cases, the traces of the conveyance rollers that have come into contact with the film may remain as unevenness in film thickness. In addition, when the substrate to be processed that has been coated is supported by lift pins protruding above the transfer rollers in the vacuum drying unit and vacuum-dried, the lift pin marks are left on the coating film formed by the vacuum drying. It may remain as unevenness in film thickness. Furthermore, even in each unit other than the vacuum drying unit and the transport path, when the substrate is stopped, the entire surface of the substrate cannot be uniformly supported. Therefore, there is a problem that the substrate temperature is uneven, and the substrate processing cannot be performed uniformly on the entire surface of each substrate processing step including the coating process and the inspection process.

  The present invention has been made in view of the above points, and in a substrate processing apparatus for processing a substrate to be processed, the substrate processing apparatus capable of performing substrate processing uniformly on the entire surface of the substrate, and substrate processing in the substrate processing apparatus Provide a method.

  In order to solve the above-described problems, the present invention is characterized by the following measures.

  According to one embodiment of the present invention, there is provided a stage surface provided in the middle of a transport path for transporting a substrate to be processed along one direction, and the substrate to be processed is placed on the stage surface. And a part of a rotating body that is rotatably provided along an axis extending in a direction crossing the conveyance path below the stage surface and projecting above the stage surface along the axis. And a first rotating body having a first chord portion that forms a surface substantially parallel to the stage surface when in the first rotation angle position, and the axis along the axis. The stage surface is provided so as to be rotatable independently of the first rotating body, is formed in a shape obtained by cutting off a part of the rotating body having the radius along the axis, and is at the second rotation angle position. Second with a second chord forming a plane substantially parallel to the And a rotary member, a substrate processing apparatus is provided.

  Further, according to one embodiment of the present invention, there is a stage surface provided in the middle of a transport path for transporting the substrate to be processed along one direction, and the substrate to be processed is placed on the stage surface. And a part of a rotating body that is provided so as to be rotatable along an axis extending in a direction crossing the conveyance path below the stage surface and has a radius capable of projecting upward from the stage surface. And a first rotating body having a first chord portion that forms a surface substantially parallel to the stage surface when in the first rotation angle position, and along the axis. Provided to be rotatable independently of the first rotating body, formed in a shape obtained by cutting off a part of the rotating body having the radius along the axis, and when in a second rotational angle position It has a second chord that forms a surface that is substantially parallel to the stage surface. A substrate processing method in a substrate processing apparatus, comprising: a second rotating body, wherein the first string portion and the second string portion do not overlap when viewed along the axis, A loading step of rotating the first rotating body and the second rotating body to load the substrate to be processed onto the placement stage; and a rotation angle position of the first rotating body is the first rotating body. Rotation drive of the first rotator and rotation drive of the second rotator are stopped in a state where the rotation angle position of the second rotator is at the second rotation angle position. And the board | substrate processing method which has the mounting process which mounts the said to-be-processed substrate on the said stage surface is provided.

  ADVANTAGE OF THE INVENTION According to this invention, in the substrate processing apparatus which processes to a to-be-processed substrate, and the substrate processing method in the substrate processing apparatus, substrate processing can be performed uniformly on the whole substrate surface.

1 is a plan view showing an overall configuration of a coating and developing treatment system to which a substrate processing apparatus according to a first embodiment is applied. It is a flowchart which shows the process sequence of all the processes with respect to one board | substrate in the coating and developing treatment system which is a substrate processing apparatus which concerns on 1st Embodiment. It is a top view including the partial cross section which shows the structure of the resist coating unit, the reduced pressure drying unit, and the prebaking unit in the coating and developing processing system which is the substrate processing apparatus according to the first embodiment. It is a side view including the partial cross section which shows the structure of the pressure reduction drying unit of the substrate processing apparatus which concerns on 1st Embodiment. It is a perspective view which shows the structure of a mounting stage, a 1st roller, and a 2nd roller. It is a perspective view which shows the structure of a mounting stage, a 1st roller, and a 2nd roller. It is a perspective view which shows the structure of a 1st roller and a 2nd roller. It is a figure containing a partial cross section when a mounting stage and a 1st roller are seen along an axis | shaft. It is a flowchart for demonstrating the procedure of each process of the substrate processing method using a reduced pressure drying unit. It is a figure including the partial cross section which shows the mode of rotation of the 1st roller and the 2nd roller in each process of the substrate processing method using a reduced pressure drying unit (the 1). It is a figure including the partial cross section which shows the mode of rotation of the 1st roller and the 2nd roller in each process of the substrate processing method using a reduced pressure drying unit (the 2). It is a perspective view which shows the structure of the 1st roller in the 1st modification of 1st Embodiment, and a 2nd roller. It is a figure including the partial cross section which shows the mode of rotation of the 1st roller and the 2nd roller in the 2nd modification of 1st Embodiment. It is a top view including the partial cross section which shows the structure of the resist coating unit, the reduced pressure drying unit, and the prebaking unit in the coating and developing treatment system which is the substrate processing apparatus according to the second embodiment. It is a perspective view which shows the structure of a part of test | inspection unit in the coating-and-development processing system which is a substrate processing apparatus concerning 3rd Embodiment.

Next, a mode for carrying out the present invention will be described with reference to the drawings.
(First embodiment)
First, a substrate processing apparatus according to a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a plan view showing an overall configuration of a coating and developing treatment system to which a substrate processing apparatus according to the present embodiment is applied.

  As shown in FIG. 1, a coating and developing processing system 10 uses, for example, a glass substrate (hereinafter referred to as “substrate G”) as a substrate to be processed, and cleaning, resist coating, pre-baking, and developing in a photolithography process in an LCD manufacturing process. And a series of processes such as post-baking. The exposure process is performed by an external exposure apparatus 12 installed adjacent to this system.

  The coating and developing processing system 10 includes a cassette station (C / S) 14, a process station (P / S) 16, and an interface station (I / F) 18. A laterally long process station (P / S) 16 is disposed at the center of the coating and developing treatment system 10, and a cassette station (C / S) 14 and an interface station (I / F) are arranged at both ends in the longitudinal direction (X direction). 18 are arranged.

  The cassette station (C / S) 14 is a cassette loading / unloading port of the system 10 and includes a cassette stage 20 and a conveyance mechanism 22. The cassette stage 20 can mount up to four cassettes C that can accommodate a plurality of substrates G in a horizontal direction (Y direction) by stacking the substrates G in multiple stages. The transport mechanism 22 moves the substrate G in and out of the cassette C on the cassette stage 20. The transport mechanism 22 includes a transport arm 22a that can hold the substrate G in units of one sheet, and can operate on four axes of X, Y, Z, and θ, and the adjacent process station (P / S) 16 side and the substrate. G can be delivered.

  The process station (P / S) 16 has a pair of parallel and opposite process lines A and B extending in the horizontal system longitudinal direction (X direction). In the process lines A and B, the respective processing units are arranged in the order of process flow or process.

  The process line A is an upstream process line from the cassette station (C / S) 14 side to the interface station (I / F) 18 side. The process line A includes a carry-in unit (IN PASS) 24, a cleaning process unit 26, a first thermal processing unit 28, a coating process unit 30, a second thermal processing unit 32, and a first transport path 34. ing. The carry-in unit (IN PASS) 24, the cleaning process unit 26, the first thermal processing unit 28, the coating process unit 30 and the second thermal processing unit 32 are arranged along the first transport path 34 from the upstream side. They are arranged in a row in order. The first transport path 34 corresponds to the transport path in the present invention.

  The carry-in unit (IN PASS) 24 receives the unprocessed substrate G from the transport mechanism 22 of the cassette station (C / S) 14 and puts it into the first transport path 34 with the surface to be processed facing upward. The cleaning process unit 26 includes an excimer UV irradiation unit (E-UV) 36 and a scrubber cleaning unit (SCR) 38 provided in order from the upstream side along the first transport path 34. The first thermal processing unit 28 includes an adhesion unit (AD) 40 and a cooling unit (COL) 42 provided in order from the upstream side. The coating process unit 30 includes a resist coating unit (COT) 44 and a vacuum drying unit (VD) 46 that are provided in order from the upstream side. The second thermal processing unit 32 includes a pre-bake unit (PRE-BAKE) 48 and a cooling unit (COL) 50 that are sequentially provided from the upstream side. A pass unit (PASS) 52 is provided at the end point of the first transport path 34 located on the downstream side of the second thermal processing unit 32. The substrate G that has been transported on the first transport path 34 is transferred from the end unit PASS 52 to the interface station (I / F) 18.

  The process line B is a downstream process line from the interface station (I / F) 18 side to the cassette station (C / S) 14 side. The process line B includes a development unit (DEV) 54, a post-bake unit (POST-BAKE) 56, a cooling unit (COL) 58, an inspection unit (AP) 60, a carry-out unit (OUT-PASS) 62, and a second conveyance path. 64. The development unit (DEV) 54, the post-bake unit (POST-BAKE) 56, the cooling unit (COL) 58, the inspection unit (AP) 60, and the carry-out unit (OUT-PASS) 62 are arranged along the second conveyance path 64. They are arranged in a line in this order from the upstream side. Here, the post-bake unit (POST-BAKE) 56 and the cooling unit (COL) 58 constitute a third thermal processing unit 66. The carry-out unit (OUT PASS) 62 receives the processed substrates G one by one from the second transport path 64 and passes them to the transport mechanism 22 of the cassette station (C / S) 14.

  An auxiliary transfer space 68 is provided between the process lines A and B, and a shuttle 70 capable of placing the substrate G horizontally in units of one sheet is both in the process line direction (X direction) by a drive mechanism (not shown). You can move in the direction.

  The interface station (I / F) 18 includes a transfer device 72, a rotary stage (R / S) 74, and a peripheral device 76. The transfer device 72 exchanges the substrate G with the first and second transfer paths 34 and 64 and the adjacent exposure device 12. The rotary stage (R / S) 74 and the peripheral device 76 are arranged around the transport device 72. The rotary stage (R / S) 74 is a stage that rotates the substrate G in a horizontal plane, and is used to change the orientation of the rectangular substrate G when it is transferred to the exposure apparatus 12. The peripheral device 76 is composed of, for example, a titler (TITLER), a peripheral exposure device (EE), or the like. The peripheral device 76 is connected to the second transport path 64.

  FIG. 2 is a flowchart showing a processing procedure of all the steps for one substrate in the coating and developing treatment system as the substrate processing apparatus according to the present embodiment.

  First, the transport mechanism 22 of the cassette station (C / S) 14 takes out one substrate G from any one of the cassettes C on the cassette stage 20 and carries it on the process line A side of the process station (P / S) 16. It is carried into the unit (IN PASS) 24 (step S1). The substrate G carried into the carry-in unit (IN PASS) 24 is transferred or loaded onto the first conveyance path 34.

  The substrate G put into the first transport path 34 is first subjected to an ultraviolet cleaning process (step S2) and a scrubbing cleaning by an excimer UV irradiation unit (E-UV) 36 and a scrubber cleaning unit (SCR) 38 in the cleaning process section 26. Processing (step S3) is sequentially performed. In the scrubber cleaning unit (SCR) 38, the substrate G is subjected to brushing cleaning and blow cleaning for removing particulate dirt from the substrate surface, followed by rinsing, and finally drying using an air knife or the like. Is given. After a series of cleaning processes in the scrubber cleaning unit (SCR) 38 is performed, the substrate G is carried into the first thermal processing unit 28 through the first transport path 34.

  In the first thermal processing section 28, the substrate G is first subjected to an adhesion process using vapor HMDS in the adhesion unit (AD) 40, and the surface to be processed is hydrophobized (step S4). After the adhesion process is performed, the substrate G is cooled to a predetermined substrate temperature by the cooling unit (COL) 42 (step S5). Thereafter, the substrate G is carried into the coating process unit 30 through the first transport path 34.

  In the coating process unit 30, the substrate G is first coated with a resist solution on the upper surface (surface to be processed) by a resist coating unit (COT) 44, and then a reduced pressure atmosphere described later by a reduced pressure drying unit (VD) 46. A lower resist drying process is performed (step S6). Thereafter, the substrate G passes through the first transfer path 34 and is carried into the second thermal processing unit 32.

  In the second thermal processing section 32, the substrate G is first pre-baked by the pre-bake unit (PRE-BAKE) 48 as a heat treatment after resist coating or a heat treatment before exposure (step S7). By this pre-baking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is enhanced. Next, the substrate G is cooled to a predetermined substrate temperature by the cooling unit (COL) 50 (step S8). Thereafter, the substrate G is taken from the pass unit (PASS) 52 at the end point of the first transport path 34 to the transport device 72 of the interface station (I / F) 18.

  In the interface station (I / F) 18, the substrate G undergoes a direction change of, for example, 90 degrees by the rotary stage (R / S) 74 and then is carried into the peripheral exposure apparatus (EE) of the peripheral apparatus 76. The substrate G carried into the peripheral exposure apparatus is subjected to exposure for removing the resist adhering to the peripheral portion during development, and then sent to the adjacent exposure apparatus 12 (step S9).

  In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. When the substrate G subjected to the pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18 (step S9), first, it is carried into a titler (TITLER) of the peripheral device 76. In the titler (TITLER), predetermined information is written on the substrate G at a predetermined portion on the substrate (step S10). Thereafter, the substrate G is carried into the starting point of the second conveyance path 64 laid on the process line B side of the process station (P / S) 16 from the conveyance device 72.

  In this way, the substrate G is now transported on the second transport path 64 toward the downstream side of the process line B with the surface to be processed facing upward. In the first development unit (DEV) 54, the substrate G is subjected to a series of development processes of development, rinsing, and drying (step S11).

  The substrate G that has undergone a series of development processing in the development unit (DEV) 54 is sequentially carried into the third thermal processing unit 66 and the inspection unit (AP) 60 through the second transport path 64. In the third thermal processing section 66, the substrate G is first subjected to post-baking as post-development heat treatment in the post-bake unit (POST-BAKE) 56 (step S12). By this post-baking, the developing solution and the cleaning solution remaining in the resist film on the substrate G are removed by evaporation, and the adhesion of the resist pattern to the substrate is enhanced. Next, the substrate G is cooled to a predetermined substrate temperature by the cooling unit (COL) 58 (step S13). In the inspection unit (AP) 60, non-contact line width inspection, film quality / film thickness inspection, and the like are performed on the resist pattern on the substrate G (step S14).

  The carry-out unit (OUT PASS) 62 receives the substrate G that has been processed in all steps from the second transfer path 64 and transfers it to the transfer mechanism 22 of the cassette station (C / S) 14. On the cassette station (C / S) 14 side, the transport mechanism 22 accommodates the processed substrate G received from the carry-out unit (OUT PASS) 62 in any one (usually the original) cassette C (step S1). ).

  In the coating and developing treatment system 10, resist processing units (44, 46, 48) from the resist coating unit (CT) 44 of the coating process unit 30 to the pre-bake unit (PRE-BAKE) 48 of the second thermal processing unit 32. Of these, the present invention is particularly applicable to the vacuum drying unit (VD) 46. Hereinafter, with reference to FIGS. 3 to 9, the configuration and operation of the resist processing unit (44, 46, 48) in the present embodiment will be described in detail.

  FIG. 3 is a plan view including a partial cross-section showing configurations of a resist coating unit, a vacuum drying unit, and a pre-bake unit in the coating and developing processing system which is the substrate processing apparatus according to the present embodiment.

  As shown in FIG. 3, the resist coating unit (COT) 44 includes a coating processing floating stage 80, a substrate transport mechanism 82, a resist nozzle 84, and a refresh unit 86. The coating treatment floating stage 80 constitutes a part or one section of the first conveyance path 34. The substrate transport mechanism 82 transports the substrate G floating on the coating treatment floating stage 80 in the longitudinal direction (X direction) of the coating treatment floating stage 80. The resist nozzle 84 supplies a resist solution to the upper surface of the substrate G conveyed on the coating treatment floating stage 80. The nozzle refresh unit 86 refreshes the resist nozzle 84 between coating processes.

  A large number of gas injection holes 88 for injecting a predetermined gas (for example, air) upward are provided on the upper surface of the coating treatment levitation stage 80, and the pressure of the gas injected from these gas injection holes 88 allows the substrate G to be injected. Is configured to float at a certain height from the upper surface of the stage.

  The substrate transport mechanism 82 includes guide rails 90 a and 90 b and a slider 92. The guide rails 90a and 90b are a pair of guide rails extending in the X direction with the coating treatment floating stage 80 interposed therebetween. The slider 92 is provided so as to be able to reciprocate along the guide rails 90a and 90b. Further, the slider 92 is provided with a substrate holding member (not shown) such as a suction pad so as to detachably hold both side ends of the substrate G on the coating treatment floating stage 80. Further, the substrate transport mechanism 82 is provided with a linear movement mechanism (not shown). By moving the slider 92 in the transport direction (X direction) by the linear movement mechanism, the substrate G is moved on the coating treatment floating stage 80. It is configured to perform floating transportation.

  The resist nozzle 84 is an elongate nozzle extending across the upper part of the coating treatment floating stage 80 in the horizontal direction (Y direction) orthogonal to the transport direction (X direction). The resist nozzle 84 discharges the resist liquid in a strip shape from the slit-shaped discharge port to the upper surface of the substrate G passing immediately below at a predetermined application position. Further, the resist nozzle 84 is configured to be movable in the X direction integrally with the nozzle support member 94 that supports the nozzle, and is movable up and down in the Z direction, and moves between the application position and the nozzle refreshing portion 86. It can be done.

  The nozzle refresh unit 86 includes a priming processing unit 98, a nozzle bath 100, and a nozzle cleaning mechanism 102. The priming processing unit 98 is held by the support member 96 at a predetermined position above the coating processing floating stage 80, and discharges the resist solution to the resist nozzle 84 as a preparation for the coating processing. The nozzle bath 100 is for keeping the resist discharge port of the resist nozzle 84 in a solvent vapor atmosphere for the purpose of preventing drying. The cleaning mechanism 102 is for removing the resist adhering to the vicinity of the resist discharge port of the nozzle bath 100 and the resist nozzle 84.

  Here, main actions in the resist coating unit (COT) 44 will be described. First, the substrate G transported by, for example, roller transport from the first thermal processing section 28 (FIG. 1) on the upstream side is transported to a transport section set on the front end side on the coating treatment floating stage 80, The slider 92 that has been waiting there holds and receives the substrate G. On the coating treatment floating stage 80, the substrate G receives the pressure of the gas (air) injected from the gas injection holes 88 and keeps the floating state in a substantially horizontal posture.

  The substrate G is transported in the transport direction (X direction) toward the reduced-pressure drying unit (VD) 46 while being held by the slider 92. When the substrate G passes under the resist nozzle 84, the resist nozzle 84 discharges a liquid resist solution in a strip shape toward the surface to be processed which is the upper surface of the substrate G. A resist is coated on the substrate from the front end toward the rear end. The substrate G on which the resist has been applied is levitated and conveyed on the floating stage 80 for application treatment by the slider 92, and is transferred to the transfer roller conveyance path 104 for passing over the rear end of the application treatment floating stage 80. The substrate G delivered to the roller conveyance path 104 is carried into the downstream reduced pressure drying unit (VD) 46.

  On the other hand, after the substrate G on which the coating process has been performed is carried out to the reduced pressure drying unit (VD) 46 side, the slider 92 returns to the carry-in portion on the front end side of the coating processing floating stage 80 in order to receive the next substrate G. The resist nozzle 84 moves from the application position (resist discharge position) to the nozzle refresh unit 86 after completing one or a plurality of application processes, and refreshes or prepares for nozzle cleaning and priming processes there. To return to the application position.

  As shown in FIG. 3, in the middle of the first conveyance path 34, on the extension line (downstream side) of the coating treatment floating stage 80 of the resist coating unit (COT) 44, the roller conveyance path 104 and the vacuum drying are performed. A unit (VD) 46 is provided. Further, a roller conveyance path 105 and a pre-bake unit (PREBAKE) 48 are provided on the extension line (downstream side) of the reduced pressure drying unit (VD) 46.

  Next, the vacuum drying unit (VD) 46 will be described with reference to FIGS. 3 and 4. FIG. 4 is a side view including a partial cross section showing the configuration of the vacuum drying unit of the substrate processing apparatus according to the present embodiment.

  As shown in FIG. 3, on the extension (downstream side) of the coating treatment floating stage 80 of the resist coating unit (COT) 44, the roller transport path 104 constituting a part or one section of the first transport path 34. Is laid. The roller conveyance path 104 is continuously laid inside and outside (front and rear) of a chamber 106 described later of the reduced-pressure drying unit (VD) 46.

  The roller conveyance path 104 includes a carry-in side roller conveyance path 104a, an internal roller conveyance path 104b, and a carry-out side roller conveyance path 104c.

  The carry-in side roller conveyance path 104 a is laid on the conveyance upstream side of the chamber 106, that is, on the carry-in side. The carry-in side roller conveyance path 104 a receives the substrate G unloaded from the coating treatment floating stage 80 of the resist coating unit (COT) 44 as an extension of the floating conveyance and rolls it into the chamber 106 of the vacuum drying unit (VD) 46. To do. In the carry-in side roller conveyance path 104a, a plurality of rollers 108a arranged at appropriate intervals in the conveyance direction (X direction) are rotated by each independent or common conveyance drive unit, and the substrate G is conveyed in the conveyance direction ( (X direction).

  The carry-out side roller conveyance path 104c is laid on the conveyance downstream side of the chamber 106, that is, on the carry-out side. The carry-out side roller conveyance path 104c pulls out the processed substrate G sent out from the chamber 106 by roller conveyance at the same speed and sends it to the subsequent processing unit (second thermal processing unit 32). The carry-out side roller conveyance path 104c rotates a plurality of rollers 108c arranged at appropriate intervals in the conveyance direction (X direction) by each independent or common conveyance drive unit to convey the substrate G in the conveyance direction ( (X direction).

  On the other hand, the inner roller conveyance path 104b is laid in the chamber 106 as described later. The inner roller conveyance path 104b is provided so as to protrude upward from the stage surface 152 of the mounting stage 150. The internal roller transport path 104b draws the substrate G sent by the roller transport from the carry-in side roller transport path 104a into the chamber 106 by roller transport at the same speed, and the substrate G that has been subjected to the vacuum drying process in the chamber 106. Roll out to the outside of the chamber 106 (back stage) by roller conveyance.

  As shown in FIGS. 3 and 4, the vacuum drying unit (VD) 46 includes a chamber 106 and an internal roller conveyance path 104 b. The inner roller conveyance path 104b includes a placement stage 150, a first roller 160, and a second roller 170.

  The chamber 106 is formed in a relatively flat rectangular parallelepiped, and has a space for horizontally accommodating the substrate G therein. A pair of (upstream and downstream) chamber sidewalls facing each other in the transport direction (X direction) of the chamber 106 is formed with a slit-shaped transport inlet 110 and a transport outlet formed so as to allow the substrate G to pass through in a flat flow. 112 are provided. Furthermore, gate mechanisms 114 and 116 for opening and closing the carry-in port 110 and the carry-out port 112 are attached to the outer wall of the chamber 106. The upper surface portion or upper lid 118 of the chamber 106 is removable for maintenance.

  An exhaust port 138 is formed at one or a plurality of locations on the bottom wall of the chamber 106. A vacuum exhaust device 142 is connected to these exhaust ports 138 through an exhaust pipe 140. Each evacuation device 142 includes a vacuum pump that evacuates the chamber 106. Thereby, the chamber 106 is provided so that the inside of the chamber 106 can be depressurized from an atmospheric pressure state to a depressurized state with a predetermined degree of vacuum.

  Cylindrical nitrogen gas ejection portions 144 extending in the Y direction are provided at both ends in the chamber 106, that is, near the carry-in port 110 and the carry-out port 112 and lower than the internal roller transport path 104 b. These nitrogen gas ejection parts 144 are made of, for example, a porous hollow tube formed by sintering metal powder, and are connected to a nitrogen gas supply source (not shown). When returning from the reduced pressure state to the atmospheric pressure state with the chamber 106 sealed after completion of the reduced pressure drying process, these nitrogen gas ejection portions 144 eject nitrogen gas from the entire circumferential surface of the tube.

  Here, the mounting stage, the first roller, and the second roller will be described with reference to FIGS. 5 and 6 are perspective views showing the configuration of the mounting stage, the first roller, and the second roller. FIG. 7 is a perspective view showing the configuration of the first roller and the second roller. FIG. 5 shows a portion surrounded by a dotted line I in FIG. 6 and 7 are enlarged views showing the periphery of the first roller and the second roller surrounded by the dotted line II in FIG. FIG. 8 is a diagram including a partial cross section when the mounting stage and the first roller are viewed along the axis. In FIG. 8, the first roller and the second roller are represented by the first roller, and the second roller is not shown. FIG. 8A shows a state where the first roller forms the same plane as the stage surface. FIG. 8B and FIG. 8C show a state in which the first roller protrudes upward from the stage surface.

  As shown in FIGS. 3 and 4, the mounting stage 150 is provided in the chamber 106. The mounting stage 150 is provided in the middle of the 1st conveyance path 34 which conveys the board | substrate G along one direction. The placement stage 150 has a stage surface 152 and places the substrate G on the stage surface 152. The stage surface 152 is substantially parallel to the horizontal plane, and is provided so as to be approximately the same size as the substrate G or slightly larger than the substrate G in plan view. An opening 154 is formed in the stage surface 152, and a flat surface is formed except for the opening 154.

  As shown in FIGS. 5 to 7, the first roller 160 and the second roller 170 rotate independently of each other along an axis 156 extending in the direction (Y direction) across the conveyance path below the stage surface 152. It is provided as possible.

  The first roller 160 is formed in a shape in which a part of a roller having a radius which is axially symmetric with respect to the axis 156 and can protrude above the stage surface 152 is cut off along the axis 156. The first roller 160 includes a first arc portion 162 and a first chord portion 164 that forms the same plane as the stage surface 152 when in the first rotation angle position. The second roller 170 is also formed in a shape in which a part of a roller having a radius that is axially symmetric with respect to the axis 156 and can protrude above the stage surface 152 is cut off along the axis 156. The second roller 170 has a second arc portion 172 and a second chord portion 174 that forms the same plane as the stage surface 152 when in the second rotation angle position. Both the second roller 170 and the first roller 160 can be formed in a shape in which a part of a roller having the same radius is cut off along the axis 156.

  In addition, the roller in this Embodiment is corresponded to the rotary body in this invention. In addition, the roller in the present embodiment is a cylindrical shape (round bar shape) having a large ratio of the length in the rotation axis direction to the radius, and a disk shape having a small ratio of the length in the rotation axis direction to the radius. The rotating body is also included.

  In the following, a case where the first string portion 164 and the second string portion 174 form the same plane as the stage surface 152 will be described as an example. Here, the same plane as the stage surface 152 means a plane having the same height as the stage surface 152. However, the plane formed by the first chord part 164 and the second chord part 174 is not limited to the same plane as the stage surface 152 (a plane having the same height), and is substantially the same plane (substantially the same as the stage surface 152). It may be a plane of equal height). Further, as will be described later, the first string portion 164 and the second string portion 174 may be formed by embossing or blasting, and irregularities or grooves may be formed. Furthermore, the case where the plane formed by the first chord portion 164 and the second chord portion 174 is slightly different from the stage surface 152 is also included. Therefore, the first chord portion 164 may form a surface substantially parallel to the stage surface 152 when in the first rotation angle position. Further, the second string portion 174 may form a surface substantially parallel to the stage surface 152 when in the second rotation angle position.

  As shown in FIG. 8, the radius of the first arc portion 162 of the first roller 160 is R1, the distance from the shaft 156 to the stage surface 152 of the mounting stage 150 is D0, and the first chord portion 164 is from the shaft 156. The distance to is D1. Although not shown in FIG. 8, the radius of the second arc portion 172 of the second roller 170 is R2, and the distance from the shaft 156 to the second chord portion 174 is D2. Then, R1 = R2 and D0 = D1 = D2. That is, the radius R2 of the second arc portion 172 is made equal to the radius R1 of the first arc portion 162. Further, the distance D1 from the shaft 156 to the first chord portion 164 and the distance D2 from the shaft 156 to the second chord portion 174 are made equal to the distance D0 from the shaft 156 to the stage surface 152 of the mounting stage 150.

  In the circle, since the distance from the center to the chord is smaller than the radius, D1 <R1 and D2 <R2 hold. That is, the distance D1 from the shaft 156 to the first chord portion 164 is smaller than the radius R1 of the first arc portion 162, and the distance D2 from the shaft 156 to the second chord portion 174 is the second arc portion 172. Smaller than the radius R2.

  By satisfying the above relationship, the relationship between the rotation angle position of the first roller 160 and the presence or absence of protrusion from the stage surface 152 is as follows.

  When the first chord portion 164 is at a rotation angle position (first rotation angle position) such that the first chord portion 164 is parallel to the stage surface 152, as shown in FIG. The same plane as the stage surface 152 can be formed. In the state shown in FIG. 8A, the first roller 160 does not protrude from the stage surface 152 at any part. When the rotation angle position is not the first rotation angle position, the first arc portion 162 protrudes above the stage surface 152 via the opening 154 as shown in FIG. In particular, when the first chord portion 164 is in the range of the rotation angle position so as to be completely below the stage surface 152, only the first arc portion 162 has an opening as shown in FIG. It protrudes upward from the stage surface 152 via 154. In the state shown in FIG. 8C, the first roller 160 protrudes from the stage surface 152 by the distance R1-D0 at the highest point.

  Further, the relationship between the rotational angle position of the second roller 170 and the presence or absence of the upward projection from the stage surface 152 is also the relationship between the rotational angle position of the first roller 160 and the presence or absence of the upward projection from the stage surface 152. It is the same. That is, when the second string portion 174 is at a rotation angle position (second rotation angle position) such that the second string portion 174 is parallel to the stage surface 152, the second string portion 174 has the same plane as the stage surface 152. Form.

  In addition, when the first roller 160 is at the first rotation angle position and the second roller 170 is at the second rotation angle position, the mounting stage 150 places the substrate G on the stage including the opening 154. It can be placed in contact with substantially the entire surface 152.

  As shown in FIG. 4, the inner conveyance path 104 b composed of the first roller 160 and the second roller 170 has a shaft 156 whose carry-in side roller conveyance path 104 a, carry-out side roller conveyance path 104 c, and carry-in / out port (110, 112). Therefore, when the first string portion 164 and the second string portion 174 form the same plane as the stage surface 152 and the substrate G is placed on the stage surface 152, the height of the substrate G is set to the carry-in side roller. The height is lower than the height corresponding to the conveyance path 104a, the carry-out side roller conveyance path 104c, and the carry-in / out port (110, 112).

  As shown in FIGS. 6 and 7, the first roller 160 provided along the shaft 156 is provided outside the chamber 106 via the first gear 166 and the first drive shaft 168. Not connected to the first rotary motor. The first gear 166, the first drive shaft 168, and the first rotary motor correspond to the first rotary drive mechanism in the present invention. A plurality of first rollers 160 may be provided along the axis 156.

  On the other hand, as shown in FIGS. 6 and 7, the second roller 170 provided along the shaft 156 is provided outside the chamber 106 via the second gear 176 and the second drive shaft 178. Connected to a second rotary motor (not shown). The second gear 176, the second drive shaft 178, and the second rotary motor correspond to the second rotary drive mechanism in the present invention. A plurality of second rollers 170 may be provided along the axis 156.

  As shown in FIGS. 3 and 5, the shaft 156 on which the first roller 160 and the second roller 170 are provided has an appropriate interval in the transport direction (X direction) over substantially the entire mounting stage 150. Are arranged to arrange.

  As shown in FIGS. 5 to 7, the first roller 160 and the second roller 170 are in contact with each other along the axis 156 so that the first roller 160 and the second roller 170 can protrude upward from the stage surface 152 through one opening 154. Is provided. The opening 154 is formed in the stage surface 152 so that there is almost no gap between the first roller 160 and the second roller 170 that are in contact with each other along the axis 156.

  For example, the first roller 160 and the second roller 170 may have a half-moon shape in which a part of a disk having a diameter of about 50 to 100 mm and an axial thickness of about 5 mm is cut off along the axis. it can. Moreover, the clearance gap between the opening part 154 and the 1st roller 160 or the 2nd roller 170 can be about 0.3 mm-0.4 mm, for example.

  As described above, the first roller 160 and the second roller 170 are provided in contact with each other, and the gap between the opening 154 is almost eliminated, so that the mounting stage 150, the first roller 160, and the second roller 170 have a gap. And the same plane can be formed. Accordingly, when the substrate G is placed on the placement stage 150 and stopped, the entire surface of the substrate G can be uniformly supported, and unevenness in the temperature of the substrate G can be prevented, and the entire surface of the substrate G can be uniformly distributed. Substrate processing can be performed.

  Further, the stage surface 152 may be formed by embossing or blasting. By forming the stage surface 152 by embossing or blasting, minute uneven surfaces are uniformly distributed on the surface. Therefore, when the substrate G is placed on the stage surface 152, the distribution of contact points in contact with the lower surface of the substrate G can be made uniform over the entire surface of the substrate. Thereby, it is possible to prevent unevenness in the temperature of the substrate G placed on the stage surface 152.

  Further, when the stage surface 152 is embossed or blasted, it is a surface of the first chord portion 164 and the second chord portion 174 that forms the same plane as the stage surface 152 depending on the rotational angle position. Similarly, it may be formed by embossing or blasting. This can also prevent the temperature of the substrate G placed on the stage surface 152 from becoming uneven.

  Next, a substrate processing method using the reduced pressure drying unit (VD) 46 and its operation will be described with reference to FIGS. 9 to 10B.

  FIG. 9 is a flowchart for explaining the procedure of each step of the substrate processing method using the vacuum drying unit. FIG. 10A and FIG. 10B are views including a partial cross section showing a state of rotation of the first roller and the second roller in each step. 10A (a) to 10B (g), a perspective view showing rotation angle positions of the first roller and the second roller is shown on the left side, and the substrate, the mounting stage, and the first roller at the rotation angle position are shown. A partial cross section when the state of the second roller is viewed along the axis is shown on the right side. In FIGS. 10A to 10B, the length of the substrate along the transport direction is shortened for easy viewing.

  As shown in FIG. 9, the substrate processing method using the reduced pressure drying unit (VD) 46 includes a carry-in process (step S21), a placing process (step S22 and step S23), and a carry-out process (step S24 and step S25). Have. The placement process includes a first rotation stop process (step S22) and a second rotation stop process (step S23). The carry-out process includes a first rotation start process (step S24) and a second rotation start process (step S25).

  First, the carrying-in process of step S21 is performed. In step S21, the first roller 160 and the second roller 170 are rotationally driven in a state where the first string portion 164 and the second string portion 174 do not overlap when viewed along the axis 156. The substrate G is carried onto the mounting stage 150. FIG. 10A (a) shows the rotational angle positions of the first roller and the second roller in step S21.

  The substrate G on which the resist solution has been coated in advance by the resist coating unit (COT) 44 adjacent to the upstream side is transferred from the coating processing floating stage 80 to the rollers 108a of the loading-side roller transport unit 104a. The substrate G transferred onto the roller 108a is transported in the transport direction (X direction) by the driving force of the roller 108a, and enters the chamber 106 of the vacuum drying unit (VD) 46 from the transport inlet 110 thereof. At this time, the gate mechanism 114 keeps the carry-in entrance 110 open.

  In step S21, the plurality of first rollers 160 and the plurality of second rollers 170 are rotationally driven in synchronization by the first rotation driving mechanism and the second rotation driving mechanism, respectively. As shown in FIG. 10A (a), when the first roller 160 and the second roller 170 are viewed along the axis 156, the first string portion 164 and the second string portion 174 do not overlap. Thus, it is driven to rotate synchronously. Further, the first roller 160 and the second roller 170 are synchronously driven so as to look like one circle when viewed along the axis 156. Thereby, the first roller 160 and the second roller 170 function as one normal cylindrical (round bar) or disk-shaped roller. Accordingly, the substrate G is held in the transport direction (X direction) while being held horizontally with the surface to be processed facing upward by the first roller 160 and the second roller 170 that are rotationally driven synchronously. It is smoothly transported horizontally along.

  In this way, the internal roller conveyance path 104b composed of the plurality of first rollers 160 and the plurality of second rollers 170 has the same conveyance speed as the roller conveyance operation of the carry-in side roller conveyance path 104a. The operation is performed, and the substrate G that has entered from the carry-in port 110 is drawn into the interior of the chamber 106 by roller conveyance.

  In step S21, the distance from the stage surface 152 at the highest point of the second roller 170 is R2-D0.

  Next, the first rotation stop process in step S22 is performed. In step S22, the rotation of the first roller 160 is stopped when the first roller 160 is at the first rotation angle position. FIG. 10A (b) shows the rotational angle positions of the first roller and the second roller in step S22.

  In step S22, when the first chord portion 164 of the first roller 160 forms the same plane as the stage surface 152, that is, when the rotation angle position is at the first rotation angle position, the first rotation drive mechanism. Is stopped, the rotation of the first roller 160 is stopped. In step S21, the plurality of first rollers 160 and the plurality of second rollers 170 were driven to rotate in synchronization with each other by the first rotation driving mechanism and the second rotation driving mechanism. Accordingly, in step S22, the second roller 170 is rotationally driven by the second rotational drive mechanism subsequent to step S21. Accordingly, the substrate G is smoothly transported horizontally along the transport direction (X direction) while being held horizontally with the surface to be processed facing upward by the second roller 170 that is rotationally driven. The

  However, in the middle of step S22, the second string portion 174 of the second roller 170 protrudes above the stage surface 152 through the opening 154, and the front end P1 of the second string portion 174 is the true axis of the shaft 156. After passing above, the height of the substrate G from the stage surface 152 gradually decreases. FIG. 10A (c) shows the rotational angular positions of the first roller and the second roller after the front end of the second chord has passed right above the axis.

  As shown in FIG. 10A (c), in the state after the tip P1 of the second chord portion 174 has passed over the shaft 156, the distance from the stage surface 152 at the highest point of the second roller 170 is as described above. Smaller than R2-D0. Accordingly, while the substrate G is transported along the transport direction (X direction) with the surface to be processed facing upward, the height from the stage surface 152 gradually decreases.

  Next, a second rotation stop process in step S23 is performed. In step S23, the rotation of the second roller 170 is stopped when the second roller 170 is at the second rotation angle position, and the substrate G is placed on the stage surface 152. FIG. 10A (d) shows the rotational angle positions of the first roller and the second roller in step S23.

  In step S23, when the second string portion 174 of the second roller 170 forms the same plane as the stage surface 152, that is, when the rotation angle position is at the second rotation angle position, the second rotation drive mechanism. Is stopped, the rotation of the second roller 170 is stopped. Thus, the substrate G is placed on the stage surface 152 of the placement stage 150 while being held horizontally with the surface to be processed facing upward.

  In addition, after performing step S21, before performing step S22, or when performing step S23, or when performing step S23, the gate mechanisms 114 and 116 are operated, and the carry-in port 110 and the carry-out port 112 that have been opened so far are respectively closed. Then, the chamber 106 is sealed. Then, immediately after the chamber 106 is sealed, the evacuation device 142 is operated to evacuate the chamber 106 to a predetermined degree of vacuum. Thereby, the diffusion (volatilization) of the solvent into the air in the resist coating film can be kept constant. As a result, the film thickness is uniformly reduced from the initial drying value (for example, 8 μm) to a desired drying target value (for example, 2 to 3 μm) without causing variation (dry spots) in the degree of drying in the resist coating film. become. In this way, the substrate G is placed in a reduced-pressure atmosphere in the chamber 106, so that the resist liquid film on the substrate G on which the resist is applied by the resist application unit (COT) 44 is dried under reduced pressure. Is done.

  The reduced-pressure drying process ends when a certain time has elapsed, and the vacuum exhaust device 142 stops the exhaust operation. Instead of this, the nitrogen gas ejection part 144 flows nitrogen gas into the chamber 106. Then, after the indoor pressure rises to atmospheric pressure, the gate mechanisms 114 and 116 are operated to open the carry-in port 110 and the carry-out port 112.

  Next, the first rotation start process in step S24 is performed. In step S24, the rotation of the second roller 170 is started. FIG. 10B (f) shows the rotation angle positions of the first roller and the second roller in step S24.

  In step S24, the second rotation drive is performed in a state where the first chord portion 164 of the first roller 160 forms the same plane as the stage surface 152, that is, in a state where the rotation angle position is at the first rotation angle position. The rotation of the second roller 170 is started by the mechanism. Accordingly, the substrate G is smoothly transported horizontally along the transport direction (X direction) while being held horizontally with the surface to be processed facing upward by the second roller 170 that is rotationally driven. The

  However, after starting step S24, the second chord part 174 of the second roller 170 protrudes upward from the stage surface 152 through the opening 154, and the rear end P2 of the second chord part 174 is connected to the shaft 156. Before passing directly above, the height of the substrate G from the stage surface 152 gradually increases. FIG. 10B (e) shows the rotational angular positions of the first roller and the second roller before the rear end of the second string portion passes right above the axis.

  As shown in FIG. 10B (e), in the state before the rear end P2 of the second chord 174 passes over the axis 156, the distance from the stage surface 152 of the highest point of the second roller 170 is It is smaller than R2-D0 described above. Further, the substrate G is transported along the transport direction (X direction) with the surface to be processed facing upward, but the height from the stage surface 152 gradually increases.

  Next, the second rotation start process in step S25 is performed. In step S <b> 25, the rotation of the first roller 160 is stopped when the second string portion 174 of the second roller 170 is at a rotation angle position that does not protrude upward from the stage surface 152. FIG. 10B (g) shows the rotational angle positions of the first roller and the second roller in step S25.

  In step S25, as shown in FIG. 10B (g), when the first roller 160 and the second roller 170 appear to be a single circle when viewed along the axis 156, The rotation of the first roller 160 is started by one rotation driving mechanism. In step S25, the plurality of first rollers 160 and the plurality of second rollers 170 are rotationally driven in synchronization by the first rotation driving mechanism and the second rotation driving mechanism, respectively. Thereby, the first roller 160 and the second roller 170 function as one normal cylindrical (round bar) or disk-shaped roller. Accordingly, the substrate G is held in the transport direction (X direction) while being held horizontally with the surface to be processed facing upward by the first roller 160 and the second roller 170 that are rotationally driven synchronously. It is smoothly transported horizontally along.

  In this manner, the roller conveyance operation is started in the internal roller conveyance path 104b including the plurality of first rollers 160 and the plurality of second rollers 170. Then, the substrate G that has been subjected to the reduced-pressure drying process is carried out by roller conveyance from the carry-out port 112 and carried into the pre-bake unit (PRE-BAKE) 48.

  As shown in FIG. 3, the pre-bake unit (PRE-BAKE) 48 includes, for example, a plate-shaped sheathed heater 184 as a heater for heating. One or a plurality of sheathed heaters 184 are arranged in the transport direction (X direction) between adjacent rollers 109 and rollers 109 constituting the roller transport path 105. Each sheathed heater 184 has, for example, a ceramic coating on its surface (upper surface). The ceramic coating energizes with electric power supplied from a heater power source (not shown) to generate heat, so that the heat radiated from the hot surface of the sheathed heater 184 is applied to the substrate G on the roller conveyance path 105 from a very short distance.

  Furthermore, the pre-bake unit (PRE-BAKE) 48 may be provided with an exhaust suction ceiling plate (perforated plate) 190 made of, for example, a grating panel above the roller conveyance path 105. The exhaust suction ceiling plate 190 may be horizontally disposed with a gap of a predetermined distance from the conveyance surface of the roller conveyance path 105, and a buffer chamber 192 may be formed thereabove. The buffer chamber 192 communicates with an exhaust unit 196 having an exhaust pump or an exhaust fan through an exhaust pipe or an exhaust path 194. The solvent evaporated from the resist coating film on the substrate G on the roller transport path 105 is sucked into the exhaust suction ceiling plate 190 together with the surrounding air and sent to the exhaust unit 196.

  A roller 109 constituting the roller conveyance path 105 is rotatably supported by a bearing (not shown) fixed to a frame or the like, and a transmission mechanism such as a gear mechanism or a belt mechanism is provided as a conveyance drive source such as an electric motor. Connected through.

  Next, the operation in the pre-bake unit (PRE-BAKE) 48 will be described.

  The substrate G that has been dried by the reduced pressure drying unit (VD) 46 is transported to the roller transport path 105 and is transported into the pre-bake unit (PRE-BAKE) 48. When the substrate G is carried into the pre-bake unit (PRE-BAKE) 48 on the roller conveyance path 105, the substrate G receives radiant heat from the sheathed heater 184 at a close distance to the substrate back surface. Due to this rapid heating, the temperature of the substrate G rises to a predetermined temperature (for example, about 180 to 200 ° C.) while being conveyed on the roller conveyance path 105, and most of the residual solvent in the resist coating film in a short time. Evaporates, the film becomes thinner and harder, and the adhesion to the substrate G is improved. During the pre-baking heat treatment, the solvent in the bulk portion of the resist coating film is averaged or homogenized by the normal pressure drying treatment in the previous step, even if it is thermally affected by the sheathed heater 184. In addition, the film thickness is sufficiently thin (for example, up to 2 to 3 μm). Therefore, even in the heating step, spots are hardly generated on the resist coating film. The solvent evaporated from the resist coating film is sucked into the exhaust suction ceiling plate 190 together with the surrounding air and sent to the exhaust unit 196.

  The substrate G that has been pre-baked by the pre-bake unit (PRE-BAKE) 48 is transported on the roller transport path 105 as it is, and is sent to the cooling unit (COL) 50 (FIG. 1) adjacent to the downstream side.

  Further, each part in the resist coating unit (COT) 44, the reduced pressure drying unit (VD) 46, and the pre-bake unit (PRE-BAKE) 48 is controlled by a controller 201 as shown in FIG. When the controller 201 is configured by a microcomputer, the controller 201 can also control the operation (sequence) of the entire apparatus. Also connected to the controller 201 is a storage unit 202 composed of a storage medium (recording medium) storing a control program for realizing various processes executed by the coating and developing processing system as a substrate processing apparatus under the control of the controller. May be. The storage medium (recording medium) may be a hard disk or a semiconductor memory. Further, the control program may be appropriately transmitted from another device via, for example, a dedicated line.

  In addition, the substrate processing method including the step of carrying the substrate G into the reduced-pressure drying unit (VD) 46 (carrying-in step), placing it on the mounting stage (mounting step), and carrying it out after the drying process (carrying-out step) is a controller. A control program to be executed by 201 may be stored in the storage unit 202 including a storage medium (recording medium).

In this embodiment, an example is described in which the first roller and the second roller are provided so as to be adjacent to each other along the axis, and are provided so as to protrude upward from the stage surface through the same opening. did. However, the first roller and the second roller may be provided apart along the axis, or may be provided so as to protrude above the stage surface via different openings formed separately. .
(First modification of the first embodiment)
Next, a substrate processing apparatus according to a first modification of the first embodiment of the present invention will be described with reference to FIG.

  The substrate processing apparatus according to the present modification is different from the substrate processing apparatus according to the first embodiment in that a rotation motor is individually attached to the plurality of first rollers and the plurality of second rollers. To do.

  FIG. 11 is a perspective view showing the configuration of the first roller and the second roller. In the following text, the same reference numerals are given to the portions described above, and the description may be omitted (the same applies to the following modified examples and embodiments).

  Also in this modification, each processing unit of the coating and developing processing system other than the reduced-pressure drying unit can be the same as the coating and developing processing system according to the first embodiment described with reference to FIGS. 1 to 4. Further, the mounting stage, the first roller, and the second roller can be the same as those of the first embodiment described with reference to FIGS.

  Further, the roller in this modification also corresponds to the rotating body in the present invention. In addition, the roller in this modified example, and the rotating body in a cylindrical shape (round bar shape) with a large ratio of the length in the rotation axis direction to the radius, and the disk-shaped rotation in which the ratio of the length in the rotation axis direction to the radius is small It also includes the body.

  Also in this modified example, the first chord portion may form a surface substantially parallel to the stage surface when the first chord portion is at the first rotation angle position. Further, the second chord portion may form a surface substantially parallel to the stage surface when in the second rotation angle position.

  On the other hand, in this modification, the first roller 160 and the second roller 170 provided along the shaft 156 are connected to a rotary motor provided outside the chamber 106 through a gear and a drive shaft. Not. The first roller 160 and the second roller 170 are directly connected to the rotary motors 169 and 179, respectively. The rotation shafts 169a and 179a of the rotary motors 169 and 179 are attached to the mounting stage by attachment members 169b and 179b. Since each rotary motor has only to rotate and drive one roller, a small and inexpensive one can be used.

  Also in this modification, the first roller and the second roller have the first string portion and the second string portion, respectively, and the first string portion and the second string portion are stages of the placement stage. The same plane as the surface can be formed. Therefore, when the substrate is stopped, the entire surface of the substrate can be supported uniformly, unevenness in the substrate temperature can be prevented, and substrate processing can be performed uniformly on the entire surface of the substrate.

Further, in this modification, the gear, the drive shaft, and the rotary motor provided outside the chamber can be omitted. Therefore, the substrate processing apparatus can be downsized and the apparatus cost of the substrate processing apparatus can be reduced.
(Second modification of the first embodiment)
Next, a substrate processing apparatus according to a second modification of the first embodiment of the present invention will be described with reference to FIG.

  The substrate processing apparatus according to this modification is different from the substrate processing apparatus according to the first embodiment in that a plurality of first chord portions are provided along the axis.

  As will be described later, a plurality of second chord portions may be provided along the axis, but here, as an example, one second chord portion is provided, An example in which only a plurality of strings are provided will be described.

  FIG. 12 is a view including a partial cross section showing a state of rotation of the first roller and the second roller. 12 (a) to 12 (d), a perspective view showing rotation angle positions of the first roller and the second roller is shown on the left side, and the substrate, the mounting stage, and the first roller at the rotation angle position are shown on the left side. A partial cross section when the state of the second roller is viewed along the axis is shown on the right side.

  Also in this modification, each processing unit of the coating and developing processing system other than the reduced-pressure drying unit can be the same as the coating and developing processing system according to the first embodiment described with reference to FIGS. 1 to 4. Further, the mounting stage and the second roller can be the same as those in the first embodiment described with reference to FIGS.

  Further, the roller in this modification also corresponds to the rotating body in the present invention. In addition, the roller in this modified example, and the rotating body in a cylindrical shape (round bar shape) with a large ratio of the length in the rotation axis direction to the radius, and the disk-shaped rotation in which the ratio of the length in the rotation axis direction to the radius is small It also includes the body.

  Also in this modified example, the first chord portion may form a surface substantially parallel to the stage surface when the first chord portion is at the first rotation angle position. Further, the second chord portion may form a surface substantially parallel to the stage surface when in the second rotation angle position.

  On the other hand, in the present modification, a plurality of first chord portions 164a are provided around the shaft 156 in the first roller 160a. For example, as shown in FIGS. 12A and 12B, three first chord portions 164a can be provided. FIG. 12A shows a state when the substrate is transported by synchronously rotating the first roller and the second roller. The first roller 160a and the second roller 170 are synchronously driven so as to look like one circle when viewed along the axis 156. FIG. 12B shows a state when the first string portion and the second string portion form the same plane as the stage surface. That is, the rotation angle position of the first roller 160a and the rotation angle position of the second roller 170 are in the first rotation angle position and the second rotation angle position, respectively.

  As shown in FIGS. 12A and 12B, three first chord portions 164 a are provided along the axis 156. In addition, three first arc portions 162 a are provided so as to be alternately arranged with three first chord portions 164 a provided around the shaft 156. Therefore, the first roller 160 a has three rotation angle positions such that the first chord portion 164 a forms the same plane as the stage surface 152. That is, there are three first rotation angle positions in the range of 360 ° per revolution.

  The first rotation angle positions may be provided such that the rotation angle positions are equally spaced, for example, 120 °, 240 °, and 360 °. In such a case, the first roller 160a has a shape that is three-fold symmetric when viewed along the axis 156. However, it is not limited to a three-fold symmetrical shape.

  Moreover, in this modification, as shown in FIG.12 (c) and FIG.12 (d), the four 1st string parts 164b can also be provided, for example. FIG. 12C shows a state when the substrate is transported by synchronously rotating the first roller and the second roller. The first roller 160b and the second roller 170 are rotationally driven synchronously so that they appear as one circle when viewed along the axis 156. FIG. 12D shows a state where the first string portion and the second string portion form the same plane as the stage surface. That is, the rotation angle position of the first roller 160b and the rotation angle position of the second roller 170 are in the first rotation angle position and the second rotation angle position, respectively.

  As shown in FIGS. 12C and 12D, four first chord portions 164 b are provided along the axis 156. Four first arc portions 162b are provided so as to be alternately arranged with four first chord portions 164b provided around the axis 156. Therefore, the first roller 160 b has four rotation angle positions such that the first chord portion 164 b forms the same plane as the stage surface 152. That is, there are four rotation angle positions in the range of 360 ° per revolution.

  The first rotation angle positions may be provided such that the rotation angle positions are equally spaced, for example, 90 °, 180 °, 270 °, 360 °. In such a case, the first roller 160b has a shape that is four-fold symmetric when viewed along the axis 156. However, the shape is not limited to four-fold symmetry.

  Also in this modification, the first roller and the second roller have the first string portion and the second string portion, respectively, and the first string portion and the second string portion are stages of the placement stage. The same plane as the surface can be formed. Therefore, when the substrate is stopped, the entire surface of the substrate can be supported uniformly, unevenness in the substrate temperature can be prevented, and substrate processing can be performed uniformly on the entire surface of the substrate.

  Furthermore, in this modification, since a plurality of first chord portions can be provided, the shape of the first roller can be designed with an arbitrary shape in order to reduce the weight, for example.

  Further, the first roller and the second roller are synchronously driven to rotate in such an arrangement that the first chord part and the second chord part are close to each other in the circumferential direction when viewed along the axis. When this is done, the distance that the substrate moves from when the first roller is stopped to when the second roller is stopped can be shortened. Therefore, the length along the carrying direction of the mounting stage can be shortened so as to be substantially equal to the length along the carrying direction of the substrate, and the footprint of the substrate processing apparatus can be reduced. Further, by reducing the volume of the chamber, the vacuum exhaust device can be reduced in size and power can be saved.

  In this modification, the second roller has the same shape as that of the first embodiment, and the first roller has been changed so that a plurality of first chords are provided. However, the shape of the first roller may be the same as that of the first embodiment, and the shape of the second roller may be provided with a plurality of second string portions.

  In addition, since the first roller and the second roller only need to form a plane substantially the same as the stage surface, the first chord part and the second chord part are not flat and have some unevenness, You may have a groove | channel etc.

In the present modification, an example in which only the first roller is provided with a plurality of first chord portions around the axis has been described. However, as described above, in addition to the plurality of first chord portions provided around the axis in the first roller, the second chord portion is provided around the axis in the second roller. A plurality may be provided. That is, the shape of the second roller may be substantially the same as the shape of the first roller in this modification. At this time, also in the second roller, a plurality of second chord portions and a plurality of second arc portions are provided so as to be alternately arranged around the axis. Accordingly, the first chord part and the second chord part are close to each other in the circumferential direction when viewed along the axis at any rotational angle position. To do. Therefore, the distance that the substrate moves from when the first roller is stopped to when the second roller is stopped can be shortened. Therefore, the length along the carrying direction of the mounting stage can be shortened to be substantially equal to the length along the carrying direction of the substrate, and the footprint of the substrate processing apparatus can be reduced. Further, by reducing the volume of the chamber, the vacuum exhaust device can be reduced in size and power can be saved.
(Second Embodiment)
Next, a substrate processing apparatus according to a second embodiment of the present invention will be described with reference to FIG.

  The substrate processing apparatus according to the present embodiment is different from the substrate processing apparatus according to the first embodiment in that the resist coating unit includes a mounting stage, a first roller, and a second roller.

  FIG. 13 is a plan view including a partial cross-section showing configurations of a resist coating unit, a vacuum drying unit, and a pre-bake unit in the coating and developing processing system which is the substrate processing apparatus according to the present embodiment. In FIG. 13, the refresh unit is not shown.

  Also in this embodiment, each processing unit of the coating and developing processing system other than the resist coating unit can be the same as the coating and developing processing system according to the first embodiment described with reference to FIGS. 1 to 4. . Further, the refresh unit not shown in FIG. 13 can be the same as that of the first embodiment described with reference to FIGS.

  Further, the roller in the present embodiment also corresponds to the rotating body in the present invention. In addition, the roller in the present embodiment is also a cylindrical body (round bar shape) having a large ratio of the length in the rotation axis direction to the radius, and the disk-shaped rotation body having a small ratio of the length in the rotation axis direction to the radius. A rotating body is also included.

  Also in the present embodiment, the first chord portion may form a surface substantially parallel to the stage surface when in the first rotation angle position. Further, the second chord portion may form a surface substantially parallel to the stage surface when in the second rotation angle position.

  On the other hand, in the present embodiment, the resist coating unit (COT) 44 does not have a coating processing floating stage and a substrate transport mechanism. Instead, in this embodiment, the resist coating unit (COT) 44 includes a placement stage 250, a first roller 260, and a second roller 270. In the present embodiment, the resist nozzle 284 is provided on the mounting stage 250 so as to be movable back and forth along the transport direction (X direction).

  Similar to the mounting stage 150 provided in the reduced pressure drying unit (VD), the mounting stage 250 is provided in the middle of the first transport path 34 that transports the substrate G along one direction. The placement stage 250 has a stage surface 252 and places the substrate G on the stage surface 252. An opening 254 is formed in the stage surface 252, and a flat surface is formed except for the opening 254.

  The first roller 260 and the second roller 270 are rotatably provided independently of each other along an axis 256 extending in a direction (Y direction) across the conveyance path below the stage surface 252. The first roller 260 and the second roller 270 have a shape in which a part of a roller having an equal radius that is axially symmetric with respect to the axis 256 and can protrude above the stage surface 252 is cut off along the axis 256. Is formed. Similar to the first roller 160 shown in FIGS. 10A and 10B, the first roller 260 forms the same plane as the stage surface 252 when it is at the first rotation angle position. And a first string portion. Similarly to the second roller 170 shown in FIGS. 10A and 10B, the second roller 270 forms the same plane as the stage surface 252 when it is at the second rotation angle position with the second arc portion. And a second string portion. Further, regarding the mounting stage 250, the first roller 260, and the second roller 270, the first rotation driving mechanism, the second rotation driving mechanism, and other parts are the same as in the first embodiment. be able to.

  The resist nozzle 284 is a long nozzle extending across the placement stage 250 in a horizontal direction (Y direction) orthogonal to the transport direction (X direction). The resist nozzle 284 discharges the resist liquid in a strip shape from the slit-like discharge port to the upper surface of the substrate G immediately below the application position while moving the application position.

  The resist nozzle 284 can move in the X direction above the mounting stage 250 within a range of a distance longer than that of the first embodiment. The resist nozzle 284 is configured to be movable in the transport direction (X direction) of the first transport path 34 integrally with a nozzle support member 294 that supports the nozzle. Thereby, the first chord part and the second chord part are stopped at a rotation angle position so as to form the same plane as the stage surface 252 of the placement stage 250, and the substrate G is placed on the stage surface 252. After that, the resist solution can be applied over the entire surface of the substrate G while moving the resist nozzle 284 in the transport direction (X direction).

In this embodiment, since the first roller and the second roller have the first string portion and the second string portion, respectively, the entire surface of the substrate is uniformly supported when the substrate is stopped. Thus, unevenness in the substrate temperature can be prevented, and the substrate can be uniformly processed over the entire surface of the substrate. Thereby, the coating nonuniformity at the time of apply | coating a resist liquid can be prevented.
(Third embodiment)
Next, a substrate processing apparatus according to a third embodiment of the present invention will be described with reference to FIG.

  The substrate processing apparatus according to the present embodiment is different from the substrate processing apparatus according to the first embodiment in that the inspection unit includes a mounting stage, a first roller, and a second roller.

  FIG. 14 is a perspective view showing a partial configuration of the inspection unit in the coating and developing treatment system which is the substrate processing apparatus according to the present embodiment.

  Also in this embodiment, each processing unit of the coating and developing processing system other than the inspection unit can be made the same as the coating and developing processing system according to the first embodiment described with reference to FIGS.

  Further, the roller in the present embodiment also corresponds to the rotating body in the present invention. In addition, the roller in the present embodiment is also a cylindrical body (round bar shape) having a large ratio of the length in the rotation axis direction to the radius, and the disk-shaped rotation body having a small ratio of the length in the rotation axis direction to the radius. A rotating body is also included.

  Also in the present embodiment, the first chord portion may form a surface substantially parallel to the stage surface when in the first rotation angle position. Further, the second chord portion may form a surface substantially parallel to the stage surface when in the second rotation angle position.

  On the other hand, in the present embodiment, the inspection unit (AP) 60 includes a mounting stage 350, a first roller 360, and a second roller 370.

  The mounting stage 350 is provided in the middle of the second transport path 64 that transports the substrate G along one direction. The placement stage 350 has a stage surface 352 and places the substrate G on the stage surface 352. An opening 354 is formed on the stage surface 352, and a flat surface is formed except for the opening 354. The second transport path 64 corresponds to the transport path in the present invention.

  The first roller 360 and the second roller 370 are provided independently of each other along an axis 356 extending in a direction (Y direction) across the second transport path 64 below the stage surface 352. . The first roller 360 and the second roller 370 have a shape in which a part of a roller that is axially symmetric with respect to the axis 356 and has an equal radius that can protrude upward from the stage surface 352 is cut off along the axis 356. Is formed. Similar to the first roller 160 shown in FIGS. 10A and 10B, the first roller 360 has a first arc portion 362 and the same plane as the stage surface 352 when in the first rotation angle position. A first string portion to be formed. Similar to the second roller 170 shown in FIGS. 10A and 10B, the second roller 370 has the same plane as the stage surface 352 when it is at the second rotation angle position with the second arc portion 372. And a second string portion 374 to be formed. Further, regarding the mounting stage 350, the first roller 360, and the second roller 370, the first rotation driving mechanism, the second rotation driving mechanism, and other parts are the same as those in the first embodiment. be able to.

  However, in the present embodiment, the mounting stage 350 is different from the mounting stage provided in the reduced pressure drying unit (VD), and has a length along the transport direction (X direction) as shown in FIG. It is shorter than the length of the substrate G. Therefore, for example, about one shaft 356 on which the first roller 360 and the second roller 370 are provided is provided along the transport direction (X direction). Further, as shown in FIG. 14, for example, two sets of the first roller 360 and the second roller 370 are provided.

  The inspection unit (AP) 60 performs non-contact line width inspection, film quality / film thickness inspection, and the like. Depending on the inspection item, the inspection may not be performed simultaneously over the entire surface of the substrate, but may be sequentially performed by repeating the inspection step and the transport step. Specifically, an inspection apparatus is installed in a line along a direction (Y direction) crossing the conveyance path, and is temporarily stopped under the inspection apparatus to inspect a part of the substrate G, and a conveyance direction ( The moving step of moving a minute distance along (X direction) is repeated.

  In this embodiment, when a part of the substrate is inspected by temporarily stopping in the inspection step, the part to be inspected is placed on the stage surface 352 of the placement stage 350. The first roller 360 and the second roller 370 have a first string portion and a second string portion 374, respectively, and the first string portion and the second string portion 374 are stages of the mounting stage 350. The same plane as the surface 352 can be formed. Therefore, when the substrate is stopped, the entire surface of the substrate can be uniformly supported, and unevenness in the substrate temperature can be prevented. Therefore, even when using an inspection device having a large temperature dependency, or when inspecting an inspection item having a large temperature dependency, the entire surface of the substrate can be inspected.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be modified or changed.

DESCRIPTION OF SYMBOLS 10 Coating / development processing system 34 1st conveyance path 46 Pressure reduction drying unit (VD)
150 Placement stage 152 Stage surface 154 Opening 156 Axis 160 First roller 164 First chord part 170 Second roll 174 Second chord part

Claims (15)

A stage having a stage surface provided in the middle of a conveyance path for conveying the substrate to be processed along one direction; and a stage for placing the substrate to be processed on the stage surface;
A shape in which a part of a rotating body that is provided so as to be rotatable along an axis extending in a direction crossing the conveyance path below the stage surface and has a radius capable of projecting upward from the stage surface is cut off along the axis. And a first rotating body including a first chord portion that forms a surface substantially parallel to the stage surface when in the first rotation angle position;
It is provided so as to be able to rotate independently of the first rotating body along the axis, and is formed in a shape obtained by cutting off a part of the rotating body having the radius along the axis, and at a second rotational angle position. A substrate processing apparatus comprising: a second rotating body including a second chord portion that forms a surface substantially parallel to the stage surface at a certain time. The mounting stage has an opening formed on the stage surface,
The first rotating body includes a first arc portion that can protrude upward from the stage surface through the opening,
The substrate processing apparatus according to claim 1, wherein the second rotating body includes a second arc portion that can protrude upward from the stage surface through the opening.   The substrate processing apparatus according to claim 1, wherein a plurality of the first chord portions are provided along the axis.   The substrate processing apparatus according to claim 1, wherein a plurality of the second chord portions are provided along the axis. A plurality of the first rotating bodies are provided along the axis,
A plurality of the second rotating bodies are provided along the axis,
The plurality of first rotating bodies are rotationally driven by a first rotational driving mechanism,
The substrate processing apparatus according to claim 1, wherein the plurality of second rotating bodies are rotationally driven by a second rotational driving mechanism. A depressurizable chamber provided in the middle of the transfer path and having a space for accommodating the substrate to be processed;
An exhaust part for evacuating the chamber,
The substrate processing apparatus according to claim 1, wherein the placement stage, the first rotating body, and the second rotating body are provided in the chamber. A stage surface provided in the middle of a transport path for transporting the substrate to be processed along one direction, a mounting stage for mounting the substrate to be processed on the stage surface, and a position below the stage surface A part of a rotating body, which is provided so as to be rotatable along an axis extending in a direction crossing the conveyance path and has a radius capable of projecting upward from the stage surface, is formed in a shape cut off along the axis. And a first rotating body having a first chord portion that forms a surface substantially parallel to the stage surface when the rotation angle position is set to be independent of the first rotating body along the axis. A second part that is formed in a shape that is partly cut off along the axis and that is substantially parallel to the stage surface when in a second rotational angle position. And a second rotating body having a string portion of the substrate. The substrate processing method in the apparatus,
When the first chord and the second chord are not overlapped when viewed along the axis, the first rotating body and the second rotating body are rotated to drive the object. A loading step of loading the processing substrate onto the mounting stage described above;
In a state where the rotation angle position of the first rotation body is at the first rotation angle position and the rotation angle position of the second rotation body is at the second rotation angle position, the first rotation body And a mounting step of mounting the substrate to be processed on the stage surface by stopping the rotational driving of the second rotating body and the rotational driving of the second rotating body. The previous placement process is
A first rotation stopping step for stopping rotation of the first rotating body when the rotation angle position of the first rotating body is at the first rotation angle position after the carrying-in step;
After the first rotation stopping step, when the rotation angle position of the second rotation body is at the second rotation angle position, the rotation of the second rotation body is stopped, and the substrate to be processed is placed on the stage. The substrate processing method according to claim 7, further comprising a second rotation stopping step that is placed on the surface. The unloading step
A first rotation starting step for starting rotation of the second rotating body after the placing step;
After the first rotation start step, the rotation of the first rotating body starts when the rotation angle position of the second rotating body is at a rotation angle position at which the second chord portion does not protrude from the stage surface. Then, when the first chord part and the second chord part do not overlap when viewed along the axis, the first rotary body and the second rotary body are rotationally driven. The substrate processing method according to claim 7, further comprising a second rotation start step of unloading the substrate to be processed from the placement stage. The mounting stage has an opening formed on the stage surface,
The first rotating body includes a first arc portion that can protrude upward from the stage surface through the opening,
The substrate processing method according to claim 7, wherein the second rotating body includes a second arc portion that can project upward from the stage surface through the opening.   The substrate processing method according to claim 7, wherein a plurality of the first string portions are provided along the axis.   The substrate processing method according to claim 7, wherein a plurality of the second chord portions are provided along the axis. A plurality of the first rotating bodies are provided along the axis,
A plurality of the second rotating bodies are provided along the axis,
The plurality of first rotating bodies are rotationally driven by a first rotational driving mechanism,
The substrate processing method according to claim 7, wherein the plurality of second rotating bodies are rotationally driven by a second rotational driving mechanism. The substrate processing apparatus has a decompressable chamber provided in the middle of the transfer path and having a space for accommodating the substrate to be processed, and an exhaust unit for evacuating the chamber,
The substrate processing method according to claim 7, wherein the placement stage, the first rotating body, and the second rotating body are provided in the chamber.   A computer-readable recording medium recording a program for causing a computer to execute the substrate processing method according to claim 7.

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