KR20120052871A - Heat processing apparatus - Google Patents

Abstract

PURPOSE: A heating device is provided to increase a processing speed without damage of a substrate even though the substrate is a large glass substrate. CONSTITUTION: A plurality of upper planar heating units(81) are arranged on a return route. A plurality of lower planar heating units are arranged on a lower part of the return route. Some upper and lower planar heating units are classified according to the return direction of the return route. Some upper and lower planar heating units are classified into a central part and both ends in the width direction of the return route. Both ends are controlled at a lower temperature than the temperature of the classified central part.

Description

Heat processor {HEAT PROCESSING APPARATUS}

This invention relates to the heat processing apparatus which heat-processes to board | substrates, such as a glass substrate for flat panel displays (FPD), for example.

In general, flat panel displays (FPDs) are manufactured using a photolithography process. The photolithography process of FPD includes three basic steps: a coating step of applying a resist on a glass substrate or the like, an exposure step of transferring a pattern of a photomask to a resist film, and a developing step of developing a pattern after exposure. There is this. Before and after these basic processes, various heat processing processes are performed as an auxiliary | assistant. For example, before the application | coating process, heat processing (dehydration bake) for removing moisture from a board | substrate is performed. Between the application | coating process and an exposure process, the heat processing (prebaking) for evaporating a residual solvent is performed after application | coating of a resist film. After the developing step, heat treatment (post-baking) for evaporating and removing the developer or cleaning solution remaining in the resist pattern is performed.

Conventional heat treatment (baking) apparatus is, in most cases, configured as a hot plate oven, a glass substrate or the like is placed on a hot plate, a lid is formed from the top to form a chamber, and the substrate is heated in the chamber. A solvent such as thinner volatilized from the resist film is exhausted. In this type of heat treatment apparatus, a lift pin mechanism for up and down a plurality of lift pins from a through hole of a hot plate and up and down a substrate for carrying over a transfer robot and a substrate, or a lid is placed on a hot plate or opened upward. The lid opening and closing mechanism is provided. Or the thing of the type which fixes a top cover and provides the board | substrate carrying-out outlet on one wall is equipped with the gate mechanism for opening and closing the said board | substrate carrying-out outlet (for example, refer patent document 1, 2).

Japanese Unexamined Patent Publication No. 8-313855 Japanese Patent Application Laid-Open No. 11-204428

However, in the conventional heat treatment apparatus, there is a problem that the time taken for carrying in and out of the substrate is long and the throughput is low by the steps of the up and down of the lifting pins and the flipping of the transfer robot. In recent years, due to the increase in size of the FPD, large glass substrates having one side of 2 m or more have appeared. In the conventional heat treatment apparatus, a transfer arm and a lifting pin or a lifting pin and a heating plate There is a risk of breakage or particle generation due to the impact of the handover. Moreover, since the heat plate generally has a poor responsiveness of temperature and is maintained at a predetermined temperature, in the above conventional heat treatment apparatus, the glass substrate is placed on the heating plate, and then a considerable time is reached until the set temperature is reached. It can consume a lot of power because it is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the prior art, and provides a heat treatment apparatus capable of realizing particle reduction and energy saving while improving the processing speed without damaging the substrate even with a large glass substrate. The purpose.

MEANS TO SOLVE THE PROBLEM In order to solve the said problem, this invention is the heat processing apparatus which heat-processes a board | substrate WHEREIN: The conveyance path which conveys a board | substrate in a horizontal direction, and is installed so as to surround the said conveyance path, and the conveyance direction of the said board | substrate A frame provided with an exhaust mechanism for evacuating the inside, a plurality of upper faceted heating portions disposed in the upper portion of the conveying path, and a plurality of lower portions in the lower portion of the conveying path. It has a lower faceted heating part arranged, The heating part of one or both of the said upper and lower faceted shape heating parts is divided by the conveyance direction of the said conveyance path, The at least lower faceted shape heating part of the said upper and lower faceted shape heating parts is the said conveyance The temperature is divided into a central portion and both ends in the width direction of the furnace, and the temperature is lower at both ends than the divided central portion by a control device. It is characterized in that it is formed to be controllable.

In this invention, it is preferable that at least one of the said upper and lower surface heating parts is provided with a surface heat radiating body, and the tubular heater embedded in the said heating body. In this case, a 1st tubular heater is embedded in the center part of the width direction of the said planar heating part, and a 2nd tubular heater and a 3rd tubular heater are respectively embedded in the width direction both sides of the said planar heating part, It is preferable that the 2nd and 3rd tubular heaters are the same kind of tubular heaters, More preferably, the stage of the said 1st tubular heater and the stage of the said 2nd and 3rd tubular heaters of the said conveyance path It is good to separate at a predetermined distance in the width direction. In this case, it is preferable that the said 1st tubular heater is a sheath heater, and the said 2nd and 3rd tubular heaters are cartridge heaters.

In the present invention, at least a portion of the wall portion of the frame has a double wall structure having an inner wall and an outer wall provided with a space therebetween, and a space between the inner wall and the outer wall insulates the inside and the outside of the frame and It is preferable to function as a heat insulation layer by air.

In addition, in this invention, the said heat sink of a planar shape is the area | region located between the surface which faces the board | substrate which heat-processes, the back surface with respect to this surface, and the said step | section spaced apart from this back surface continuously. It is desirable to have cutouts installed in it.

Moreover, in this heat processing apparatus which heat-processes a board | substrate, it is provided so that the conveyance path which conveys a board | substrate in a horizontal direction, and the said conveyance path may be provided, and the center part of the conveyance direction of the said board | substrate, and a conveyance direction may be carried out. It has a frame body in which the exhaust mechanism which exhausts internally is provided in both ends, the upper surface heating part arrange | positioned in plurality at the upper part of the said conveyance path, and the lower surface heating part arrange | positioned in plurality at the lower part of the said conveyance path, Upper and lower faceted heating parts are divided in a conveying direction of the conveying path, and the upper and lower faceted heating parts are divided into a central part and both ends in the width direction of the conveying path, and the upper and lower faceted heating parts are It has a heater for heating inside a center part and the said both ends separately, The heater temperature of the said center part is a heater of the said both ends. It is preferable to set it to temperature higher than temperature, More preferably, the heater temperature of the said center part is made so that the heat accumulate | stored in the said frame body may be heat-transmitted at the both ends, and the temperature of the said both end part and the said center part may become the same temperature. It is preferable to set the temperature higher by a predetermined value than the heater temperature at both ends.

According to this invention, the frame body provided so that the said conveyance path was enclosed with the conveyance path which conveys a board | substrate in a horizontal direction, and the surface-shaped heating part arrange | positioned in the upper part and the lower part of the said conveyance path, The said heating part conveys the said conveyance path By controlling the temperature in each of the divided regions in the direction and the width direction, it is possible to perform high throughput and high uniformity heating on the substrate.

In addition, an exhaust mechanism for exhausting the air in the frame is provided at the center and both ends of the frame in the conveying direction, and the upper and lower heating portions are respectively provided in the width direction central portions of the conveying path. By being set to lower heating electric power, it becomes possible to heat-process with higher uniformity.

1 is a schematic plan view showing a coating and developing apparatus according to the present invention.
2 is a cross-sectional view in the planar direction of the lower portion of the heat treatment apparatus of the present invention.
3 is a cross-sectional view of the side direction of the heat treatment apparatus of the present invention.
It is a top view which shows a part of lower face shape heater in this invention in cross section.
Fig. 5 is a plan view showing a part of the upper faceted heater in the present invention in cross section.
6 is a temperature control schematic diagram of the widthwise division of the lower faceted heater in the present invention.
7 is a schematic cross-sectional view (a) of the lower faceted heater in the present invention, a heating power distribution diagram (b) to the lower faceted heater, and a temperature distribution diagram (c) of the lower faceted heater.
It is a top view which shows the notch provided in the heat sink in this invention.
It is a top view which shows the other form of the notch provided in the heat sink in this invention.
It is a top view which shows the other form of the notch provided in the heat sink in this invention.

Below, the case where the heat processing apparatus which concerns on this invention is applied to the resist coating and developing processing apparatus of an FPD board | substrate is demonstrated.

1, the application | coating and developing processing system as one structural example which can apply the heat processing apparatus of this invention is shown. This coating and developing processing system 200 is installed in a clean room, for example, a FPD substrate is referred to as a substrate to be processed (hereinafter referred to as a substrate G), and the cleaning in the photolithography step in the FPD manufacturing process, Each treatment such as resist coating, prebaking, developing and postbaking is performed.

This coating and developing processing system 200 is largely comprised of four blocks. Cassette station portion (C / S) 201 for handing over cassette C containing substrate G with an external device, coating line portion 202 for applying chemical to substrate G, and exposure It consists of the interface part (I / F) 203 which flips over an apparatus and a board | substrate, and the developing line part 205 which develops the board | substrate G after exposure. The exposure apparatus 204 is provided adjacent to the interface unit 203.

The cassette station unit (C / S) 201 is a cassette stage in which a plurality of cassettes C which can accommodate a plurality of sheets by stacking the substrate G in multiple stages can be placed in a horizontal direction, for example, in the X direction. 10) and the conveyance mechanism 11 which carries out the board | substrate G with respect to the cassette C of this cassette stage 10 is provided.

The conveyance mechanism 11 has the means which can hold | maintain the board | substrate G, for example, the conveyance arm 12, and is in four axes of horizontal X, Y direction, vertical Z direction, and horizontal rotation (theta). It is operable, and the board | substrate G can be flipped over the application | coating line 202 and the developing line 205 which adjoin.

On the application line 202, the excimer UV irradiation unit (e-UV) 21, the scrub cleaning unit (SCR) 22, and the preheat unit (PH) are directed from the cassette station C toward the interface unit 203. 23, Advance Unit (AD) 24, Cooling Unit (COL) 25, Resist Coating Unit (CT) 26, Decompression Drying Unit (DP) 27, Heat Treatment Unit (HT) (28) and cooling units (COL) 29 are arranged in order.

The excimer UV irradiation unit (e-UV) 21 performs the removal process of the organic substance contained in the substrate G, and the scrub cleaning unit (SCR) 22 performs the scrub cleaning treatment and the drying treatment of the substrate G. Is done. The preheat unit (PH) 23 performs the heat treatment of the substrate G, the advice unit (AD) 24 performs the hydrophobization treatment of the substrate G, and the cooling unit (COL) ( 25 cools the substrate (G). The resist coating unit (CT) 26 supplies a resist liquid on the substrate G to form a resist film, and the vacuum drying unit (DP) 27 volatilizes contained in the resist film on the substrate G under reduced pressure. The component is evaporated to dry the resist film. The heat treatment unit (HT) 28 described later in detail performs the heat treatment of the substrate G, and the cooling unit COL 29 cools the substrate G like the cooling unit COL 25. .

In the developing line 205, the developing unit (DEV) 30, the heating processing unit (HT) 31, and the cooling unit (COL) 32 are directed from the interface unit 203 toward the cassette station 201 side. They are arranged in order. On the other hand, between the cooling unit (COL) 32 and the cassette station 201, an inspection apparatus (IP) 35 for inspecting the substrate G subjected to a series of processes including resist coating and developing is provided. It is.

The developing unit (DEV) 30 performs application of the developing solution onto the substrate G, rinsing the substrate G, and drying processing of the substrate G in this order. The heat treatment unit (HT) 31 performs the heat treatment of the substrate G like the heat treatment unit (HT) 28, and the cooling unit (COL) 32 is the cooling unit (COL) 25. The substrate G is cooled as described above.

The interface unit 203 is a rotary stage (RS) 44 serving as a flipping part of the substrate G, on which a buffer cassette capable of accommodating the substrate G is disposed, and the substrate G on which the application line 202 is conveyed. The carrier arm 43 which receives and conveys to the rotary stage (RS) 44 is provided. The conveyance arm 43 is operable in four axes of horizontal X, Y direction, vertical Z direction, and horizontal rotation (θ), and the exposure apparatus 204 provided adjacent to the conveyance arm 43, and conveyance An external device block 90 having a peripheral exposure device EE and a titler TITLER, which are provided adjacent to the arm 43 and the developing unit DEV 30, is also accessible.

The coating and developing processing system 200 is connected and controlled by the controller 101. The controller 101 includes a keyboard on which an operator inputs commands to operate each part or each unit of the coating and developing processing system 200, a display display for monitoring the operation status of each part or each unit, or the like. The control program and the processing condition data for realizing the input / output unit 102 consisting of the control unit 101 and various processes such as heating and cooling processing performed by the coating and developing processing system 200 are controlled by the control unit 101. The storage unit 103 for storing the prepared recipe is connected.

If necessary, an arbitrary recipe is called from the storage unit 103 by an instruction from the input / output unit 102 and executed by the control unit 101, so that the application and development processing system under the control of the control unit 101 ( 200, desired processing is performed. In addition, recipes, such as control programs and processing condition data, use data recorded on a computer-readable storage medium, for example, a CD-ROM, a hard disk, a flash memory, or the like, from another device, for example, via a dedicated line. It can also be sent online for use.

In the coating and developing processing system 200 configured as described above, first, the substrate G in the cassette C placed on the mounting table 10 of the cassette station 201 is the transfer arm of the conveying device 11. It is conveyed to the upstream edge part of the application | coating line 202 by (12), and the board | substrate G is dry-cleaned by ultraviolet irradiation in the excimer UV irradiation unit (e-UV) 21. In this ultraviolet cleaning, the organic substance of the surface of a board | substrate is mainly removed. After completion | finish of ultraviolet washing, it transfers to the scrubber washing | cleaning unit (SCR) 22 of a washing | cleaning process part by roller conveyance.

In the scrubber washing | cleaning unit (SCR) 22, brushing and blow washing | cleaning are performed to the upper surface (processed surface) of the board | substrate G, conveying in horizontal flow to a horizontal posture by roller conveyance, Remove the dirt. On the other hand, the liquid is cut off by an air knife or the like while the substrate G is conveyed in flat flow even after washing, and the substrate G is dried. In the scrubber cleaning unit (SCR) 22, the substrate G having been cleaned is subjected to heat treatment in the preheat unit PH 23 to be dewatered. The substrate G on which the heat treatment in the preheat unit PH 23 is completed is subjected to a hydrophobization treatment in the advice unit AD 24. By the hydrophobization treatment, the adhesion between the substrate G and the resist liquid is enhanced. The board | substrate G in which the hydrophobization process in the advice unit AD 24 was complete | finished is cooled by the cooling unit COL 25 to the temperature of a constant normal temperature.

In the substrate G cooled by the cooling unit (COL) 25, a resist film is formed in the resist coating unit (CT) 26. The substrate G is coated with a resist liquid on the upper surface of the substrate (to-be-processed surface) by the spin coating method or the slit coating method. The board | substrate G in which the resist film was formed in the resist coating unit (CT) 26 is conveyed on a conveyance line, and the drying process of a resist film is performed by the reduced pressure atmosphere in the pressure reduction drying unit (DP) 27.

On the other hand, in the case where the resist coating unit (CT) 26 is a spin coat method, both the rollers of 26i on the upstream side and 26o on the downstream side of the resist coating unit (CT) 26 convey the substrate G as much as possible. It becomes a mechanism. In addition, in the case where the resist coating unit (CT) 26 is the slit coat method, 26i on the upstream side of the resist coating unit (CT) 26 is applied to the slit coat from the roller conveyance mechanism of the cooling unit (COL) 25. Transfer unit to the conveyance mechanism by air floating used in the case, 26o of the downstream side transfers to the roller conveyance mechanism of the pressure reduction drying unit (DP) 27 from the conveyance mechanism by air floating It is a unit.

The substrate G subjected to the drying treatment of the resist film in the reduced pressure drying unit (DP) 27 is conveyed to the conveying line, and the solvent contained in the resist film by the heat treatment in the heat treatment unit (HT) 28 Evaporated off. The heat treatment is performed while being conveyed on the conveying line by the roller conveyance mechanism 5 described later. The detailed operation of the heat treatment unit (HT) 28 of the present invention will be described later.

The board | substrate G by which the heat processing in the heat processing unit (HT) 28 was complete | finished is conveyed on a conveyance line, and is cooled by the cooling unit (COL) 29. FIG. The board | substrate G cooled by the cooling unit (COL) 29 conveys the application line shape to the downstream end part, and is then rotary stage (RS) 44 by the conveyance arm 43 of the interface part 203. Is returned. Subsequently, the substrate G is conveyed to the peripheral exposure apparatus EE of the external device block 90 by the transfer arm 43, and the exposure treatment for removing the unnecessary peripheral portion of the resist film in the peripheral exposure apparatus EE. Is carried out.

Subsequently, the board | substrate G is conveyed to the exposure apparatus 204 by the conveyance arm 43, and the exposure process of a predetermined pattern is performed to a resist film. On the other hand, the board | substrate G may be conveyed to the exposure apparatus 204 after being temporarily accommodated in the buffer cassette on the rotary stage (RS) 44. FIG. The substrate G on which the exposure process is completed is conveyed to the titler (TITLER) 90 of the external device block 90 by the conveyance arm 43, and the ID information of the product in the titler TITLER 90. The predetermined information is recorded as a two-dimensional code or an OCR character.

The board | substrate G on which the predetermined information was recorded by the titler 90 was conveyed on the developing line 205, and application | coating process, rinse process, and drying process of the developing solution in the developing unit (DEV) 30 are carried out. Are carried out in turn. In the coating, rinsing, and drying treatment of the developer, for example, the developer is filled on the substrate G while the substrate G is transported on the transfer line, the conveyance is stopped once, and the substrate is inclined at a predetermined angle so that the developer is discharged. Flowing and falling, the rinse liquid is supplied to the substrate G in this state, and the developer is washed, and then, the dry gas is sprayed onto the substrate G while the substrate G is returned to the horizontal position and conveyed again. It is done by.

The board | substrate G which the process of the developing solution in the developing unit (DEV) 30 complete | finished is conveyed on a conveyance line, and heat processing is performed in the heat processing unit (HT) 31, and the solvent contained in a resist film And moisture is evaporated off. The heat treatment is performed while being conveyed on the conveying line by the roller conveying mechanism 5. In addition, you may install the i-line UV irradiation unit which decolorizes a developing solution between the developing unit (DEV) 30 and the heat processing unit (HT) 31. FIG. The board | substrate G by which the heat processing in the heat processing unit (HT) 31 was complete | finished is conveyed on the developing line 205, and is cooled by the cooling unit (COL) 32. As shown in FIG.

The substrate G cooled by the cooling unit (COL) 32 is conveyed to the developing line 205 and inspected by the inspection unit (IP) 35. The board | substrate G which passed the test | inspection is accommodated in the predetermined | prescribed cassette C mounted on the mounting base 10 by the conveyance arm 12 of the conveying apparatus 11 installed in the cassette station 201.

Next, the heat processing of the board | substrate G in the heat processing unit (HT) 28 * 31 comprised as mentioned above with reference to FIG. 3 is demonstrated. The heat processing unit (HT) 28 is conveyed from the pressure reduction drying unit (DP) 27 side, and the heat processing unit (HT) 31 is conveyed from the developing unit (DEV) 30 side (G). ) Passes through the board | substrate carrying-in port 61, and is handed over to the roller conveyance mechanism 5, and conveyed by this roller conveyance mechanism 5, and the upper and lower face bodies shape temperature-controlled by the hotplate controller 104 was carried out. The heaters 81 and 71 are heated in the frame 6.

Thus, since conveyance and heating of a board | substrate are performed in parallel, processing time can be shortened and performed. Since the board | substrate G is heated from the upper and lower both sides by the upper and lower surface heaters 81 and 71, the curvature is suppressed. When the board | substrate G conveyed by the roller conveyance mechanism 5 passes the carrying out opening 62, it is a cooling unit (COL) in the cooling unit (COL) 29 side (heat processing unit (HT) 31). It is handed over to the conveyance mechanism of the (32) side}.

Next, the heat treatment unit (HT) 28 will be described in detail. On the other hand, since the heat processing unit (HT) 31 also has the same structure as the heat processing unit (HT) 28, it demonstrates here on behalf of the heat processing unit (HT) 28 here.

2 is a plan view showing the lower heating portion of the heat treatment unit (HT) 28 (heat treatment apparatus), and FIG. 3 is a side view. The heat processing unit (HT) 28 includes the roller conveyance mechanism 5 which conveys the board | substrate G toward one side of a Y direction, the frame 6 provided so that the roller conveyance mechanism 5 may be enclosed or accommodated, The heating mechanisms 7 and 8 which heat the board | substrate G which are roller-conveyed by the roller conveyance mechanism 5 in the frame 6 are provided.

The roller conveyance mechanism 5 arrange | positions several rows of the substantially cylindrical rotatable roller member 50 extended in a X direction at intervals in a Y direction. Each of the roller members 50 is directly connected to a motor (not shown) by the rotating shaft 51 or indirectly with a gear or the like interposed therebetween, and rotates by driving of the motor, whereby a plurality of substrates G are obtained. On the roller member 50 is conveyed toward one direction of a Y direction.

Moreover, the roller member 50 has the shape which contact | abuts over the whole width direction (X direction) of the board | substrate G, respectively, so that the heat of the board | substrate G heated by the heating mechanism 7 may be hard to be transmitted. The roller outer peripheral surface portion 52 is formed of a material having low thermal conductivity such as resin, and the rotating shaft 51 is a shaft made of ferritic stainless steel having high strength and high corrosion resistance.

The frame 6 is formed in a box shape and can accommodate the substrate G in a substantially horizontal state, and arranges the slit-shaped substrate inlet 61 and the substrate outlet 62 in the substrate conveyance direction (Y direction). Doing. The roller member 50 of the roller conveyance mechanism 5 is rotatably supported by the bearing 60 provided in the side wall part in which the rotating shaft 51 opposes the X direction of the frame 6, respectively, and is arrange | positioned in the frame 6 It is.

The wall part of the frame 6, here the upper wall part, the bottom wall part, and the side wall part which opposes the Y direction has the double-wall structure provided with the inner wall 63 and the outer wall 64 which mutually provided space, and the inner wall 63 And the space 65 between the outer walls 64 functions as an air insulating layer that insulates the inside and outside of the frame 6. The inner side surface of the outer wall 64 is provided with a heat insulating material 66 for insulating the inside and outside of the frame 6.

The heating mechanism 7 is provided with lower surface heaters 71 (71a-71o) which are lower surface heating parts provided in the frame 6 along the conveyance path of the board | substrate G by the roller conveyance mechanism 5, and are provided. The lower surface heater 71 has a back surface (lower surface) side of the substrate G conveyed by the roller conveyance mechanism 5 so as to be close to the substrate G conveyed by the roller conveyance mechanism 5, respectively. Installed in

Moreover, the heating mechanism 8 uses the upper surface heater {81 (81a-81h)} which is the upper surface heating part provided in the frame 6 along the conveyance path of the board | substrate G by the roller conveyance mechanism 5. It is equipped with the upper surface heater 81 on the surface (upper surface) side of the board | substrate G conveyed by the roller conveyance mechanism 5 so that each may be approached by the board | substrate conveyed by the roller conveyance mechanism 5, respectively. It is installed.

In the case of a material with many distortion of the board | substrate G at the time of a heating, the upper surface heater (81 (81a-81h)) of the surface (upper surface) side is provided, and the lower surface heater {which is provided in the rear surface (lower surface) side { 71 (71a to 71o)}, by distributing vertically, the distortion can be reduced by making the heat distribution up and down uniform.

The lower surface heater 71 is divided | segmented and formed in the X direction, and is provided between roller members 50, respectively, and is arranged in plurality (71a-71o in order from the Y-direction upstream side) in the Y direction. The upper surface heater 81 is attached to and supported by the side wall part which opposes the X direction of the frame 6, for example. In the case where the heating of the substrate G is controlled in more detail, the upper surface heater 81 may be formed by dividing in the X direction.

An exhaust port 67 is provided in each of the upper wall portions of the center portion and the both ends of the conveying direction, and the exhaust device 68 is connected to the exhaust port 67. The exhaust device 68 is configured to exhaust the air in the frame 6 through the exhaust port 67. For example, a plurality of exhaust ports 67 may be formed in the X direction, or may be formed in a slit shape extending in the X direction.

By providing the exhaust mechanisms at both ends of the frame 6 in the Y direction, air curtains are formed at the inlet and outlet ports 62, and external particles are formed at the inlet and outlet outlets 62. It is suppressed that invading into the frame 6 from In addition, since the exhaust flow in the Y direction is formed in the same direction as the conveyance direction of the substrate G, particles generated inside the frame 6 are also exhausted without generating turbulence, thereby preventing adhesion to the substrate G. can do.

In FIG. 3, the exhaust port 67 is disposed above the frame 6, but when the exhaust or heat of the solvent is to be increased, or when a large amount of particles are to be exhausted, the exhaust port 67 is also formed in the lower portion symmetric to the upper exhaust port 67. You may be provided. In addition, the upper wall portion of the frame 6 can be opened and closed at a position in the center of the conveying direction (Y direction), thereby facilitating the cleaning of the solvent attached to the inner wall 63 and the internal repair.

Next, overall temperature control of the lower surface-shaped heater 71 is demonstrated by FIG. The command of the temperature set to the hot plate controller 104 is issued from the control apparatus 101. The hot plate controller 104 issues a set temperature command to the hot plate power source 105. In this case, the hot plate power source is divided into six blocks of 105a, 105b, 105c, 105d, 105e, and 105f. The lower facet heater 71 also corresponds to the hot plate controller 104 along the Y axis in the conveying direction, for every six blocks of 71a to 71b, 71c to 71d, 71e to 71g, 71h to 71j, 71k to 71m, and 71n to 71o. It is arranged. The heating power for each block can be controlled for each block because the temperature of the inlet part, the center part, the outlet part, and the width direction of the board | substrate G differs by the airflow and the heat storage variation of an inner wall.

In addition, the hot plate power source 105 is divided into S, T, and U corresponding to the division of D, E, and F in the width direction of the lower faceted heater 71. For example, the block D of the lower faceted heaters 71a to 71b is controlled by S of the hot plate power source 105a. Similarly, the block E of the lower facet heaters 71a to 71b is controlled by T of the hot plate power supply 105a and the block of F of the lower facet heaters 71a to 71b is controlled by the U of the hot plate power supply 105a. S, T, and U of the other hot plate power supplies 105b to 105f also control in response to D, E, and F of the lower faceted heaters 71c to 71d, 71e to 71g, 71h to 71j, 71k to 71m, and 71n to 71o. Is done.

Here, when the temperature distribution of the heat treatment apparatus 28 (31) is demonstrated in FIG. 3, the exhaust_gas | exhaustion of the heat in the housing | casing 6 is equipped with the exhaust port 67 in the center part of the conveyance direction, and the upper wall part of both ends, respectively, 67, an exhaust device 68 is connected. In addition, since the board | substrate delivery opening 61 and the board | substrate carrying out opening 62 are open | released, even if the same electric power is applied to the lower surface heater 71 and the upper surface heater 81, the temperature of a center part and both ends will become low. Moreover, both ends of the X direction of the board | substrate G become high by the heat storage of the frame inner wall 63 shown in FIG. Since the temperature is different even if the same electric power is applied in this manner, it is necessary to be able to control the lower faceted heater 71 and the upper faceted heater 81 for each block in the conveying direction (Y axis). Therefore, the lower surface heater 71 divides into D * E * F and 3 blocks in the width direction (X-axis) of the board | substrate G, and performs fine control.

4 is a plan view showing a part of the lower faceted heater 71 in cross section. Heat dissipation of the entire lower faceted heater 71 is performed by heat radiators 71p such as aluminum, stainless steel, and ceramics. The heating of the heat of E in FIG. 4 is performed by two tubular heaters 71q parallel to each other embedded in the heat radiator 71p. The sensing of the temperature is sensed by the sensor 71t, and the sensed temperature is input to the hot plate controller 104 through the hot plate power source 105. The hot plate controller 104 issues a command to increase or decrease the temperature according to the sensed temperature. The hot plate power source 105 supplies power to the hot plate in accordance with the command. In the rows of D and F at both ends of the heat sink 71p, the blank areas (spaces) 71w and 71x are disposed between the tubular heaters 71q. The temperature of the tubular heater 71r is controlled by the temperature sensor 71u, and the temperature of the tubular heater 71s is controlled by the temperature sensor 71v.

In FIG. 4, one tubular heater 71r, 71s is arrange | positioned with respect to two tubular heater 71q. With respect to the two tubular heaters 71q corresponding to the row of center E, one tubular heater 71r and 71s corresponding to the rows of D and F at both ends supplies low heating power. This is because, due to the heat storage effect of the side wall portion of the mold body 6, the temperature is maintained even in the low heat generation amount of 71r and 71s. In addition, the tubular heater 71q and 71r, 71s may be the same number of tubular heaters.

Next, the temperature distribution of a hot plate is demonstrated with FIG. In Fig.7 (a), the lower surface heater 71 which heats the lower part (lower surface) of the board | substrate G is divided into E row of the center part, D row and F row of the both ends. Heating of the upper part (surface) of the board | substrate G is performed by the upper surface heater 81. As shown in FIG.

Fig. 7B is a schematic diagram of the electric power applied to the faceted heater. The heat power applied to the column E of the lower faceted heater 71 and the heat power applied to the columns D and E of both ends are set high. On the other hand, at both ends of the tubular heater 71q, there are blank areas (spaces) 71w and 71x of heating power between the tubular heaters 71r and 71s. This can also be confirmed by FIG.

Fig. 7C is a schematic diagram of the actual temperature distribution. Although the heat | fever E corresponding to the heating of the tubular heater 71q is maintained in the heat | fever E of the lower surface-shaped heater 71, the temperature is maintained to the area | region of about half of space 71w and 71x by heat conduction simultaneously. Similarly, the temperature is maintained by the heat conduction heat conduction of tubular heaters 71r and 71s to almost half of the spaces 71w and 71x. Since electric powers D and F of tubular heaters 71r and 71s are low electric powers, temperature is only Dh and Fh minutes. However, heat transfer of the heat storage 63h of the wall surface portion of the mold body 6 occurs, accumulated in the heat of Dh and Fh, and becomes the same temperature as the temperature of Eh.

The spaces 71w and 71x can adjust the accumulated temperature by moving the tubular heaters 71r and 71s in the X direction. By this adjustment, the center part and the both ends of the lower faceted heater 71 become temperatures averaged. As shown in FIG. 4, the tubular heater 71q in the center may be formed by the sheath heater, and the tubular heaters 71r and 71s at both ends may be formed by the cartridge heater.

The structure of the sheath heater is to fill and enclose a heat-resistant insulating material having high electrical insulation and thermal conductivity between the heating wire and the metal pipe through a coil-shaped heating wire (nichrome wire) in the metal pipe, thus preventing particle generation. It is possible. Electric wiring is arranged at both ends of the heater. By this structure, it is buried in the center part of lower surface heater, ie, the center tubular heater 71q. The sheath heater formed in this way is excellent in mechanical strength, such as a vibration and an impact.

The cartridge heater has a structure in which a heating wire (nichrome wire) wrapped in a rod shape (for example, ceramic) is inserted into a pipe (for example, stainless steel), and the heat generating wire and the pipe are excellent in high thermal conductivity and high insulation. It is sealed with magnesium oxide (MgO). Since the cartridge heater can be wired only in one direction, the heater can be inserted into the hole of the metal block to be heated, and the temperature can be adjusted by adjusting the length of the insertion. Moreover, in a cartridge heater, it is possible to adjust the uniformity of the temperature which generate | occur | produces by inserting in the both ends of a surface heater, and adjusting the distance with the said sheath heater. The cartridge heater thus formed is suitable as a heater which withstands vibration and does not generate particles.

Thus, the tubular heater 71q of the center is formed by a sheath heater, and the tubular heater 71r, 71s of both ends is formed by a cartridge heater, and the board | substrate G which concerns on this invention is used for flat panel displays. In the case where the glass substrate has a size larger than 2 meters, even if the vibration of the conveyance is severe for conveying the substrate G, the glass substrate can withstand the vibration. In addition, the circuit pattern on the flat panel display has become extremely fine, and it is an important problem to reduce the generation of particles as much as possible, but it is also suitable for this.

As shown in FIG. 3, the upper surface heater 81 is equipped with eight upper surface heaters 81a-81h arrange | positioned at the upper surface (surface side) of the board | substrate G. As shown in FIG. The upper surface heater 81d and 81e among them are divided from the middle of the width part of the conveyance direction of the upper surface heater 81a-81c, 81f-81h. This is because the upper wall part of the frame 6 opens and closes at a position in the center of the conveying direction (Y direction) and performs maintenance or internal cleaning.

5 is a plan view showing a portion of the upper faceted heater 81 in cross section. The upper face heater 81 is basically the same as the control method of the lower face heater 71, but is not divided in the X direction. In addition, three tubular heaters 81q are embedded in the heat sink 81p. The detection of the heat generated temperature is performed by the sensor 81t. It is controlled by the hot plate controller 104 via the hot plate power supply 105 of FIG. On the other hand, tubular heaters are embedded one by one in the upper surface heaters 81d and 81e.

As mentioned above, according to the heat processing apparatus of embodiment, since heat processing is possible, conveying the board | substrate G, shortening of processing time can be aimed at, and making flow of an air stream the same as the conveyance direction of the board | substrate G is carried out. This can suppress the generation of turbulence, prevent the generation of particles in advance, and further utilize the structure of the faceted heaters 71 and 81 and the heat storage of the side wall surface of the heat treatment device by the heat plate controller 104. It becomes possible to realize saving and to realize uniformity of heating of the substrate G.

Next, a second embodiment will be described. In addition, description of the same part as embodiment mentioned above abbreviate | omits description, and demonstrates only another part. In 2nd Embodiment, as shown in FIG. 8, in the radiator 71p, the surface which opposes the board | substrate G is made into the surface 90, and the opposite surface is made into the back surface 91. As shown in FIG.

In the second embodiment, groove-shaped notches 92 are formed in the rear surfaces 91 in the spaces 71w and 71x. The notch 92 is arrange | positioned in linear form, for example from the direction of arrow K. FIG. In addition, the cross-sectional shape of the notch 92 is square. Thus, by forming the notch 92, it is possible to limit the thermal conduction between the D, E, and F rows, and to further uniformize the temperature distribution on the surface 90. On the other hand, this notch 92 is also used for heat radiation.

In addition, the cross-sectional shape of the notch 92 is not limited to square, The circular arc shape shown in FIG. 9 may be sufficient. In addition, the cross-sectional shape of the notch 92 may be triangular shape shown in FIG.

If the cross-sectional shape of the notch 92 is present at each tip at the tip of the notch 92 such as a square or a triangle, the thermal conductivity tends to be uneven at each of these parts. By using this in reverse, by making the cross-sectional shape of the notch 92 square or triangular, it is possible to equalize the temperature distribution on the surface 90.

Moreover, when the cross-sectional shape of the notch 92 is made into circular arc shape, and the front end of the notch 92 is formed smoothly, the thermal conductivity in this part will become easy to be uniform. By using this, the cross-sectional shape of the notch 92 may be made into circular arc shape, and it is possible to make the temperature distribution in the surface 90 uniform.

Next, a third embodiment will be described. In addition, description of the same part as embodiment mentioned above abbreviate | omits description, and demonstrates only another part. In 3rd Embodiment, a tubular heater 71r, 71s is comprised so that an operator can go in and out from the radiator 71p. That is, the insertion length of tubular heater 71r, 71s with respect to the radiator 71p can be changed. When the tubular heaters 71r and 71s are pulled forward with respect to the radiator 71p, the spaces 71w and 71x are widened. In addition, when the tubular heaters 71r and 71s are pushed against the radiator 71p, the spaces 71w and 71x are narrowed.

First, the temperature of tubular heaters 71q, 71r, and 71s is set to a temperature which is used, and the temperature is raised. The temperature distribution is measured after the heat sink 71p rises in temperature and the temperature of the heat sink 71p is stabilized. And if the temperature of the part of space 71w, 71x is lower than the temperature of another part, for example, an operator pushes tubular heater 71r, 71s with respect to the radiator 71p, and space 71w, 71x. Narrow). After the temperature of the heat sink 71 is stabilized, the temperature distribution of the heat sink 71p is measured again. This operation is repeated to adjust the positions of the tubular heaters 71r and 71s so that the temperature of the radiator 71p becomes uniform. By setting it as such a structure, it is possible to make uniform the temperature distribution of the radiator 71p.

On the other hand, according to the heat processing apparatus which concerns on this invention, although a board | substrate is suitable especially when a large sized board | substrate like a glass substrate for FPD, it is not limited to a glass substrate, It can apply widely also to the heat processing of other board | substrates, such as a semiconductor wafer. have.

G: Substrate
5: roller conveying mechanism
6: frame
7: heating mechanism
8: heating appliance
50: roller member
61: substrate loading part
62: substrate carrying part
63: frame inner wall
64: frame outer wall
65: air insulation layer
66: insulation
71 (71a to 71o): lower faceted heater (lower faceted heater)
71p: heat sink
71q to 71s: Tubular heater
71t to 71ｖ: temperature sensor
71w, 71x: space of heating power
81 (81a to 81h): upper surface heater (upper surface heater)
101: controller
104: hot plate controller
105: hot plate power

Claims (9)

In the heat treatment apparatus which heat-processes a board | substrate,
A conveying path for conveying the substrate in a horizontal direction;
A frame body provided to surround the conveying path and provided with an exhaust mechanism for exhausting the inside of the substrate at a central portion in the conveying direction and at both ends of the conveying direction;
An upper faceted heating portion disposed in plural on an upper portion of the conveying path;
It has a lower faceted heating part arranged in multiple numbers below the said conveyance path,
One or both heating parts of the upper and lower faceted heating parts are divided in a conveying direction of the conveying path,
At least a lower surface-shaped heating portion of the upper and lower surface-shaped heating portions is divided into a central portion and both ends in the width direction of the conveying path,
A heat treatment apparatus, characterized in that the control device is configured to control the temperature at both ends lower than the divided center portion. The heat treatment apparatus according to claim 1, wherein at least one of the upper and lower faceted heating portions includes a faceted heat radiator and a tubular heater embedded in the heat radiator. The first tubular heater is embedded in the central portion of the width direction of the faceted heating part, and the second tubular heater and the third tubular heater are buried in both side portions of the width direction of the faceted heating part. And the second and third tubular heaters are tubular heaters of the same kind. The heat treatment apparatus according to claim 2, wherein the stages of the first tubular heater and the stages of the second and third tubular heaters are separated at a predetermined distance in the width direction of the conveying path. The heat treatment apparatus according to claim 4, wherein the first tubular heater is a sheath heater, and the second and third tubular heaters are cartridge heaters. The at least part of the wall part of the said frame body has a double wall structure provided with the inner wall and the outer wall provided spaced from each other, and the space between the said inner wall and the outer wall is the said, A heat treatment apparatus, which functions as a heat insulating material that insulates the inside and outside of the frame and a heat insulating layer by air. The said heat sink of claim 4, wherein
The surface facing the substrate subjected to the heat treatment,
On the back side of this surface,
It has a notch provided in the area | region located between the steps | parts which are separated from this back surface continuously. The heat processing apparatus characterized by the above-mentioned. In the heat treatment apparatus which heat-processes a board | substrate,
A conveying path for conveying the substrate in a horizontal direction;
A frame body provided to surround the conveying path and provided with an exhaust mechanism for exhausting the inside of the substrate at a central portion in the conveying direction and at both ends of the conveying direction;
An upper faceted heating portion disposed in plural on an upper portion of the conveying path;
It has a lower faceted heating part arranged in multiple numbers below the said conveyance path,
The upper and lower faceted heating parts are divided in the conveying direction of the conveying path,
The upper and lower faceted heating portions are divided into a central portion and both ends in the width direction of the conveying path,
The upper and lower faceted heating parts individually have heaters for heating inside the central part and the both ends,
And the heater temperature of the center portion is set to a temperature higher than the heater temperatures of the both ends. 9. The temperature of the heater in the center portion is higher by a predetermined value than the heater temperature in the both ends so that heat accumulated in the frame is transferred to the both ends so that the temperature of the both ends and the center portion is the same temperature. Heating treatment apparatus characterized in that set to.

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