KR20070044126A - 웨이퍼 정렬장치 및 방법 - Google Patents

웨이퍼 정렬장치 및 방법 Download PDF

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Publication number
KR20070044126A
KR20070044126A KR1020050100087A KR20050100087A KR20070044126A KR 20070044126 A KR20070044126 A KR 20070044126A KR 1020050100087 A KR1020050100087 A KR 1020050100087A KR 20050100087 A KR20050100087 A KR 20050100087A KR 20070044126 A KR20070044126 A KR 20070044126A
Authority
KR
South Korea
Prior art keywords
wafer
rotating
group
degrees
receiving unit
Prior art date
Application number
KR1020050100087A
Other languages
English (en)
Korean (ko)
Inventor
강병주
손영성
조현우
Original Assignee
주식회사 케이씨텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020050100087A priority Critical patent/KR20070044126A/ko
Priority to CNB2006101402341A priority patent/CN100449725C/zh
Priority to TW95139022A priority patent/TWI331787B/zh
Publication of KR20070044126A publication Critical patent/KR20070044126A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020050100087A 2005-10-24 2005-10-24 웨이퍼 정렬장치 및 방법 KR20070044126A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020050100087A KR20070044126A (ko) 2005-10-24 2005-10-24 웨이퍼 정렬장치 및 방법
CNB2006101402341A CN100449725C (zh) 2005-10-24 2006-10-20 晶片排列装置及排列方法
TW95139022A TWI331787B (en) 2005-10-24 2006-10-23 Apparatus and method of arraying wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050100087A KR20070044126A (ko) 2005-10-24 2005-10-24 웨이퍼 정렬장치 및 방법

Publications (1)

Publication Number Publication Date
KR20070044126A true KR20070044126A (ko) 2007-04-27

Family

ID=38063393

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050100087A KR20070044126A (ko) 2005-10-24 2005-10-24 웨이퍼 정렬장치 및 방법

Country Status (2)

Country Link
KR (1) KR20070044126A (zh)
CN (1) CN100449725C (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114927450A (zh) * 2022-05-27 2022-08-19 北京北方华创微电子装备有限公司 传输装置和半导体工艺设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107507798A (zh) * 2017-08-15 2017-12-22 无锡先导智能装备股份有限公司 用于形成硅片批的装卸装置及装卸方法
TWI723577B (zh) * 2019-10-14 2021-04-01 環球晶圓股份有限公司 排列多個晶圓的方法、欲對多個晶圓進行清洗步驟的方法及晶片的製造方法
CN112736002B (zh) * 2020-12-31 2022-06-07 至微半导体(上海)有限公司 一种晶圆清洗设备晶圆片高速装载方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4804007A (en) * 1987-04-29 1989-02-14 Verteq, Inc. Cleaning apparatus
JP3250090B2 (ja) * 1995-06-27 2002-01-28 東京エレクトロン株式会社 洗浄処理装置及び洗浄処理方法
JP3243708B2 (ja) * 1995-12-07 2002-01-07 東京エレクトロン株式会社 処理方法及び処理装置
JPH1126420A (ja) * 1997-07-04 1999-01-29 Tokyo Electron Ltd 洗浄・乾燥処理方法及びその装置
JP3681329B2 (ja) * 2000-10-20 2005-08-10 東京エレクトロン株式会社 基板表面処理方法及び基板表面処理装置
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
JP3643954B2 (ja) * 2001-08-29 2005-04-27 東京エレクトロン株式会社 洗浄処理装置
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114927450A (zh) * 2022-05-27 2022-08-19 北京北方华创微电子装备有限公司 传输装置和半导体工艺设备

Also Published As

Publication number Publication date
CN1956161A (zh) 2007-05-02
CN100449725C (zh) 2009-01-07

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A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E601 Decision to refuse application