KR20060123462A - 웨이퍼의 전사방법 - Google Patents

웨이퍼의 전사방법 Download PDF

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Publication number
KR20060123462A
KR20060123462A KR1020067013783A KR20067013783A KR20060123462A KR 20060123462 A KR20060123462 A KR 20060123462A KR 1020067013783 A KR1020067013783 A KR 1020067013783A KR 20067013783 A KR20067013783 A KR 20067013783A KR 20060123462 A KR20060123462 A KR 20060123462A
Authority
KR
South Korea
Prior art keywords
wafer
adhesive sheet
frame
chip
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020067013783A
Other languages
English (en)
Korean (ko)
Inventor
킨야 모치다
미키오 코미야마
켄이찌 와타나베
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20060123462A publication Critical patent/KR20060123462A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020067013783A 2004-03-01 2005-02-25 웨이퍼의 전사방법 Ceased KR20060123462A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004055720A JP4768963B2 (ja) 2004-03-01 2004-03-01 ウェハの転写方法
JPJP-P-2004-00055720 2004-03-01

Publications (1)

Publication Number Publication Date
KR20060123462A true KR20060123462A (ko) 2006-12-01

Family

ID=34908879

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067013783A Ceased KR20060123462A (ko) 2004-03-01 2005-02-25 웨이퍼의 전사방법

Country Status (6)

Country Link
JP (1) JP4768963B2 (https=)
KR (1) KR20060123462A (https=)
DE (1) DE112005000448T5 (https=)
MY (1) MY162177A (https=)
TW (1) TW200532786A (https=)
WO (1) WO2005083763A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101160200B1 (ko) * 2005-02-18 2012-06-26 가부시기가이샤 디스코 웨이퍼의 분할방법
KR20190028099A (ko) * 2017-09-08 2019-03-18 삼성전자주식회사 반도체 제조 장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5275553B2 (ja) * 2006-06-27 2013-08-28 スリーエム イノベイティブ プロパティズ カンパニー 分割チップの製造方法
JP2011091293A (ja) * 2009-10-26 2011-05-06 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5533695B2 (ja) * 2011-01-26 2014-06-25 豊田合成株式会社 半導体チップの製造方法および半導体チップの実装方法
JP6044986B2 (ja) * 2012-11-13 2016-12-14 株式会社ディスコ 切削装置
JP5855034B2 (ja) * 2013-02-18 2016-02-09 古河電気工業株式会社 半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法
JP5657828B1 (ja) * 2014-07-17 2015-01-21 大宮工業株式会社 転写方法及び転写装置
JP6695173B2 (ja) 2016-03-07 2020-05-20 日東電工株式会社 基板転写方法および基板転写装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2893741B2 (ja) * 1989-08-02 1999-05-24 日本電気株式会社 電歪効果素子
JPH063321B2 (ja) * 1989-10-13 1994-01-12 貞一 阿部 温水ボイラー
JP2877997B2 (ja) * 1991-08-29 1999-04-05 日東電工株式会社 半導体ウエハの処理方法
JP2001110757A (ja) * 1999-10-06 2001-04-20 Toshiba Corp 半導体装置の製造方法
JP2001257222A (ja) * 2000-03-09 2001-09-21 Hitachi Ltd 半導体実装装置およびその製造方法
JP3408805B2 (ja) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2003086540A (ja) * 2001-09-07 2003-03-20 Toshiba Corp 半導体装置の製造方法及びその製造装置
JP3624909B2 (ja) * 2002-03-12 2005-03-02 浜松ホトニクス株式会社 レーザ加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101160200B1 (ko) * 2005-02-18 2012-06-26 가부시기가이샤 디스코 웨이퍼의 분할방법
KR20190028099A (ko) * 2017-09-08 2019-03-18 삼성전자주식회사 반도체 제조 장치

Also Published As

Publication number Publication date
TW200532786A (en) 2005-10-01
JP4768963B2 (ja) 2011-09-07
JP2007220693A (ja) 2007-08-30
MY162177A (en) 2017-05-31
DE112005000448T5 (de) 2007-03-29
TWI354325B (https=) 2011-12-11
WO2005083763A1 (ja) 2005-09-09

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000