KR20060065502A - 양면 연마용 캐리어 및 반도체 웨이퍼의 연마 방법 - Google Patents
양면 연마용 캐리어 및 반도체 웨이퍼의 연마 방법 Download PDFInfo
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- KR20060065502A KR20060065502A KR1020050118417A KR20050118417A KR20060065502A KR 20060065502 A KR20060065502 A KR 20060065502A KR 1020050118417 A KR1020050118417 A KR 1020050118417A KR 20050118417 A KR20050118417 A KR 20050118417A KR 20060065502 A KR20060065502 A KR 20060065502A
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- carrier
- polishing
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (6)
- 워크를 수용하는 워크 수용 공이 설치된 원판 모양의 캐리어 디스크 및 전기 캐리어 디스크를 지지하기 위해 그 외주측에 설치되고, 전기 캐리어 디스크보다 두껍게 형성됨과 동시에, 구동용의 톱니바퀴가 서로 맞물리는 톱니부가 외주면에 형성된 링 모양의 지지 프레임을 구비하는 양면 연마용 캐리어.
- 제 1항에 있어서,상기 지지 프레임은 상기 캐리어 디스크와는 독립적인 별도의 부재이고, 상기 캐리어 디스크를 탈착 가능하게 지지하는 양면 연마용 캐리어.
- 제 2항에 있어서,상기 지지 프레임은 상기 캐리어 디스크와는 다른 재질로 구성되어 있는 양면 연마용 캐리어.
- 제 1항에 있어서,상기 캐리어 디스크의 상면은 상기 지지 프레임의 상면과 동일 레벨이거나 그것보다도 높은 위치에 위치하는 양면 연마용 캐리어.
- 제 1 항 에 있어서,상기 캐리어 디스크의 상면은 상기 지지 프레임의 상면보다도 낮은 레벨에 위치하는 양면 연마용 캐리어.
- 제 1항 내지 제 5항 중 어느 한 항에 기재된 양면 연마용 캐리어를 사용하는 반도체 웨이퍼의 연마 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004358247A JP4727218B2 (ja) | 2004-12-10 | 2004-12-10 | 両面研磨用キャリア |
JPJP-P-2004-00358247 | 2004-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060065502A true KR20060065502A (ko) | 2006-06-14 |
KR100695341B1 KR100695341B1 (ko) | 2007-03-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050118417A KR100695341B1 (ko) | 2004-12-10 | 2005-12-06 | 양면 연마용 캐리어 및 반도체 웨이퍼의 연마 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060128276A1 (ko) |
JP (1) | JP4727218B2 (ko) |
KR (1) | KR100695341B1 (ko) |
TW (1) | TWI271263B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100897677B1 (ko) | 2007-10-29 | 2009-05-14 | 주식회사 실트론 | 기판 양면연마 장치용 캐리어 플레이트 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5076723B2 (ja) * | 2007-08-09 | 2012-11-21 | 富士通株式会社 | 研磨装置、基板及び電子機器の製造方法 |
JP2009285768A (ja) * | 2008-05-28 | 2009-12-10 | Sumco Corp | 半導体ウェーハの研削方法および研削装置 |
DE102010063179B4 (de) * | 2010-12-15 | 2012-10-04 | Siltronic Ag | Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben |
DE102011082777A1 (de) | 2011-09-15 | 2012-02-09 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
KR101285897B1 (ko) | 2012-02-28 | 2013-07-12 | 주식회사 엘지실트론 | 웨이퍼 연마장치 및 웨이퍼를 연마하는 방법 |
JP5748717B2 (ja) * | 2012-09-06 | 2015-07-15 | 信越半導体株式会社 | 両面研磨方法 |
CN107431034A (zh) * | 2015-03-11 | 2017-12-01 | 贝卡尔特公司 | 用于临时键合晶片的载体 |
JP6707831B2 (ja) | 2015-10-09 | 2020-06-10 | 株式会社Sumco | 研削装置および研削方法 |
JP6513174B2 (ja) * | 2017-12-25 | 2019-05-15 | 信越半導体株式会社 | ウェーハ保持用キャリアの設計方法 |
CN112571261B (zh) * | 2020-12-31 | 2022-07-22 | 重庆化工职业学院 | 一种计算机箱体抛光装置 |
CN114800109A (zh) * | 2022-06-27 | 2022-07-29 | 苏州博宏源机械制造有限公司 | 双面抛光机及其抛光方法 |
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US1536714A (en) * | 1921-04-04 | 1925-05-05 | Pratt & Whitney Co | Apparatus for and method of making similar articles |
JPS59156755A (ja) * | 1983-02-25 | 1984-09-06 | Kyowa Leather Kk | 多段多色シ−ト状物の製造法及びその装置 |
JPS59156755U (ja) * | 1983-04-06 | 1984-10-20 | 株式会社 市川製作所 | 両面研上盤 |
EP0173972B1 (en) * | 1984-08-30 | 1991-02-27 | Nec Corporation | Pre-processing system for pre-processing an image signal succession prior to identification |
DE3624878A1 (de) * | 1985-07-31 | 1987-02-12 | Speedfam Corp | Flachlaeppmaschine |
JPH0729263B2 (ja) * | 1989-04-25 | 1995-04-05 | 光永産業株式会社 | ラップ盤 |
JPH0646854U (ja) * | 1992-11-27 | 1994-06-28 | 直江津精密加工株式会社 | 半導体ウエハ等の研磨用キャリア |
JP2673216B2 (ja) * | 1993-10-23 | 1997-11-05 | 光永産業株式会社 | ラップ盤の加工物取出し装置 |
JPH08112751A (ja) * | 1994-10-17 | 1996-05-07 | Koei Sangyo Kk | ラップ盤のキャリア |
JP3379097B2 (ja) * | 1995-11-27 | 2003-02-17 | 信越半導体株式会社 | 両面研磨装置及び方法 |
JPH1076460A (ja) * | 1996-08-30 | 1998-03-24 | Shin Etsu Handotai Co Ltd | 薄板の研磨方法および研磨装置 |
JPH10175159A (ja) * | 1996-12-18 | 1998-06-30 | Nippon Electric Glass Co Ltd | 板状物の両面研磨装置 |
US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
JP4256977B2 (ja) * | 1999-04-13 | 2009-04-22 | 不二越機械工業株式会社 | 両面研磨装置システム |
US6210259B1 (en) * | 1999-11-08 | 2001-04-03 | Vibro Finish Tech Inc. | Method and apparatus for lapping of workpieces |
WO2001082354A1 (fr) * | 2000-04-24 | 2001-11-01 | Sumitomo Mitsubishi Silicon Corporation | Procédé de fabrication d'une plaquette de semi-conducteur |
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US7364495B2 (en) * | 2002-03-28 | 2008-04-29 | Etsu Handotai Co., Ltd. | Wafer double-side polishing apparatus and double-side polishing method |
JP2004106173A (ja) * | 2002-08-29 | 2004-04-08 | Fujikoshi Mach Corp | 両面研磨装置 |
JP4343020B2 (ja) * | 2003-12-22 | 2009-10-14 | 株式会社住友金属ファインテック | 両面研磨方法及び装置 |
-
2004
- 2004-12-10 JP JP2004358247A patent/JP4727218B2/ja active Active
-
2005
- 2005-11-21 TW TW094140774A patent/TWI271263B/zh active
- 2005-12-06 KR KR1020050118417A patent/KR100695341B1/ko active IP Right Grant
- 2005-12-08 US US11/296,488 patent/US20060128276A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100897677B1 (ko) | 2007-10-29 | 2009-05-14 | 주식회사 실트론 | 기판 양면연마 장치용 캐리어 플레이트 |
Also Published As
Publication number | Publication date |
---|---|
TW200631730A (en) | 2006-09-16 |
KR100695341B1 (ko) | 2007-03-16 |
JP2006159383A (ja) | 2006-06-22 |
US20060128276A1 (en) | 2006-06-15 |
TWI271263B (en) | 2007-01-21 |
JP4727218B2 (ja) | 2011-07-20 |
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