KR20060037236A - Ｐｗｂ 상의 전자 소자를 실딩하는 실드 캔 - Google Patents

Ｐｗｂ 상의 전자 소자를 실딩하는 실드 캔 Download PDF

Info

Publication number
KR20060037236A
KR20060037236A KR1020057014374A KR20057014374A KR20060037236A KR 20060037236 A KR20060037236 A KR 20060037236A KR 1020057014374 A KR1020057014374 A KR 1020057014374A KR 20057014374 A KR20057014374 A KR 20057014374A KR 20060037236 A KR20060037236 A KR 20060037236A
Authority
KR
South Korea
Prior art keywords
shield
pwb
sections
shielding
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020057014374A
Other languages
English (en)
Korean (ko)
Inventor
구스타브 파그레니우스
핸드릭 벵손
토미 산데비
프레드릭 헤르만
니클라스 안데르손
한스 마이네르트
Original Assignee
소니 에릭슨 모빌 커뮤니케이션즈 에이비
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP03388024A external-priority patent/EP1445998B1/en
Application filed by 소니 에릭슨 모빌 커뮤니케이션즈 에이비 filed Critical 소니 에릭슨 모빌 커뮤니케이션즈 에이비
Publication of KR20060037236A publication Critical patent/KR20060037236A/ko
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
KR1020057014374A 2003-02-07 2003-12-19 Ｐｗｂ 상의 전자 소자를 실딩하는 실드 캔 Abandoned KR20060037236A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
EP03388007.1 2003-02-07
EP03388007 2003-02-07
EP03388024.6 2003-04-25
EP03388024A EP1445998B1 (en) 2003-02-07 2003-04-25 A shield can for shielding electronic components on a PWB
US46775403P 2003-05-02 2003-05-02
US60/467,754 2003-05-02

Publications (1)

Publication Number Publication Date
KR20060037236A true KR20060037236A (ko) 2006-05-03

Family

ID=32853969

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057014374A Abandoned KR20060037236A (ko) 2003-02-07 2003-12-19 Ｐｗｂ 상의 전자 소자를 실딩하는 실드 캔

Country Status (5)

Country Link
JP (1) JP4657927B2 (enExample)
KR (1) KR20060037236A (enExample)
AU (1) AU2003298234A1 (enExample)
BR (1) BR0318090A (enExample)
WO (1) WO2004071144A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220397A (ja) * 2013-05-09 2014-11-20 富士通株式会社 シールド部品および電子装置
KR102286337B1 (ko) 2014-10-17 2021-08-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체
US10186350B2 (en) 2016-07-26 2019-01-22 General Cable Technologies Corporation Cable having shielding tape with conductive shielding segments
US10517198B1 (en) 2018-06-14 2019-12-24 General Cable Technologies Corporation Cable having shielding tape with conductive shielding segments
CN113766822A (zh) * 2021-10-28 2021-12-07 维沃移动通信有限公司 一种电路板组件和电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
US5608188A (en) * 1994-09-02 1997-03-04 Motorola, Inc. Multi compartment electromagnetic energy shield
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
DE29612557U1 (de) * 1996-07-19 1996-09-12 Nokia Mobile Phones Ltd., Salo Abschirmeinrichtung gegen elektromagnetische Strahlung
WO2002052916A1 (en) * 2000-12-21 2002-07-04 Shielding For Electronics, Inc. Emi and rfi containment enclosure for electronic devices

Also Published As

Publication number Publication date
AU2003298234A1 (en) 2004-08-30
JP4657927B2 (ja) 2011-03-23
BR0318090A (pt) 2005-12-20
JP2006514442A (ja) 2006-04-27
WO2004071144A1 (en) 2004-08-19

Similar Documents

Publication Publication Date Title
US4836435A (en) Component self alignment
US5172852A (en) Soldering method
US8338715B2 (en) PCB with soldering pad projections forming fillet solder joints and method of production thereof
CN109874237A (zh) Smt焊接工艺和用于smt焊接工艺的钢网
EP0915641A1 (en) Surface mount assembly for electronic components
JPH06177526A (ja) 接合剤の印刷方法
KR20060037236A (ko) Ｐｗｂ 상의 전자 소자를 실딩하는 실드 캔
EP1445999B1 (en) A method of providing a PWB with a shield can and a PWB therefor
JPH07131139A (ja) 電子部品用配線基板
JP4274264B2 (ja) モジュールの製造方法
JP4273918B2 (ja) モジュールの製造方法
EP0245713A1 (en) Solder pads for use on printed circuit boards
EP1445998B1 (en) A shield can for shielding electronic components on a PWB
JPH0222889A (ja) クリーム半田の印刷方法
CN100423625C (zh) 用于屏蔽印刷电路板上电子元件的屏蔽盒
JP2009111410A (ja) モジュール
JPH09327980A (ja) クリームはんだのスクリーン印刷用メタルマスク
EP1446000B1 (en) A shield can for shielding electronic components on a PWB
CN115884528B (zh) 一种防锡珠印刷模板开孔方法及防锡珠印刷模板
JP3855592B2 (ja) 小型モジュールの製造方法
JP3152482B2 (ja) 電子部品実装における半田形成方法
JPH11330661A (ja) 表面実装モジュール
JP2005032794A (ja) 印刷用マスク及びそれを用いた部品実装基板の製造方法
JPH06244541A (ja) 回路基板装置
KR20050068087A (ko) 다용도 인쇄용 스퀴지를 이용한 인쇄방법 및 다용도인쇄용 스퀴지

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20050804

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20081218

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20100825

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20110303

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee