Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0007—Casings
  • H05K9/002—Casings with localised screening
  • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
  • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
  • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0284—Details of three-dimensional rigid printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0393—Flexible materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09018—Rigid curved substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10371—Shields or metal cases
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

• the highest level of shielding is achieved when a closed metal can with a free rim at downwardly extending side walls is soldered to the PWB along the entire free edge of the metal can.
• a critical requirement that must be fulfilled in order to achieve good shielding is that the solder joint between the shield can and the PWB is well controlled, preferably without leaving any unsoldered areas. If any areas remain unsoldered the shielding efficiency is determined by the largest gap between the shield can and the PWB. Therefore, if gaps exist between the shield can and the PWB the sizes of these must be well defined.
• This method is very similar to screen-printing. The difference is that the stencil is not elastic and therefore the stencil is placed in contact with the PWB. Stencil-printing is mostly used for fine-pitch devices. This is a method that is perfectly suitable for high-volume production.
• the individual sections of the shield can are able to flex in relation to each other such that the shield can is able to follow any non-planarity of a PWB on which the shield can is mounted.
• any non-planarity of the PWB that occurs by bending of a PWB can be compensated for.
• a secure and sufficiently close connection between the PWB and the shield can is ensured to achieve the desired shielding effect.
• the upper cover part may be made in one piece provided with a reduced material thickness between the sections. Thereby the flexible interconnections between the sections are achieved without use of other materials or elements than the one forming the shield can.
• Fig. 4 shows another embodiment of a shield can according to the invention
• Fig. 7 shows the shield can shown in Fig. 6 mounted on a PWB.
• the PWB 102 bends upwards and the rim 105 of the shield can 101 is connected to the PWB 102 at a very limited area only.
• the gap 107 which is not closed by the pre-applied solder paste 106, between the PWB 102 and the rim 105 of the shield can 101 extends over more than two sides of the shield can 101. Again the shielding efficiency of the shield can 101 is substantially reduced.
• Fig. 2 shows a first embodiment of a shield can 1 according to the invention.
• the shield can 1 is divided into six identical sections 2 that each serves as a separate shield can. That each section 2 defines a separate shield can is clearly illustrated by the foremost right section 2 that is shown partly in cross- section.
• Fig. 3 shows the shield can 1 mounted on a PWB 6 that bends upwards.
• the degree of bending is largely exaggerated in order to better show the gist of the invention. It is clearly shown how the sections 2 of the shield can 1 flex in relation to each other by means of the flexible elements 7 and thereby compensate for the bending of the PWB 6 without leaving any unsoldered areas between the PWB 6 and the shield can 1.
• Fig. 4 shows another embodiment for a shield can 11 according to the invention.
• This shield can 11 is also divided into sections 12 that are interconnected to form the shield can 11.
• the shield can 11 is made in one piece that is provided with a reduced material thickness between the sections 12; the area with a reduced material thickness forming bending lines 17 on the surface of the upper cover part.
• the shield can 11 is provided with a common upper cover part and downwardly extending side walls 14 at the outer circumference of the cover part. In this embodiment no internal walls are provided as indicated by the cut-away area at the foremost right corner of the shield can 11.
• the side walls 14 are unconnected in order to allow a mutual flexing between the sections 12 when the shield can 11 is mounted on a bended PWB 16 as shown in Fig. 5.
• Fig. 6 shows partly in cross-section yet another embodiment for a shield can 21 according to the invention.
• the shield can 21 is divided into sections 22 that in this embodiment form transversal strips that are interconnected by flexible elements 27 connected to the edges of the sections 22.
• the shield can 21 is able to compensate for the bending of a PWB 26 as shown in Fig. 7 which shows a downwardly bending PWB 26 provided with the shield can 21.
• This shield can also comprises a common upper cover without any internal walls.
• the material of the shield can When choosing the material of the shield can, there is a wide selection of different materials to choose from. Different types of plastic materials and metal alloys with varying shielding characteristics are used on the market. Metal cans are mainly used for non-complicated geometries and are relatively inexpensive. The possibilities to create more complicated geometries increase when a plastic material is used, but these types of shield cans are often more expensive to produce. In order to obtain sufficient shielding effectiveness, the plastic material must be conductive and this is achieved by e.g. spraying it with conductive paint.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Priority Applications (3)

Applications Claiming Priority (6)

Publications (1)

Family

ID=32853969

Family Applications (1)

Country Status (5)

Cited By (4)

Families Citing this family (1)

Citations (5)

• 2003
  • 2003-12-19 JP JP2005515704A patent/JP4657927B2/ja not_active Expired - Fee Related
  • 2003-12-19 WO PCT/EP2003/014798 patent/WO2004071144A1/en not_active Ceased
  • 2003-12-19 AU AU2003298234A patent/AU2003298234A1/en not_active Abandoned
  • 2003-12-19 BR BR0318090-5A patent/BR0318090A/pt not_active IP Right Cessation
  • 2003-12-19 KR KR1020057014374A patent/KR20060037236A/ko not_active Abandoned

Patent Citations (5)

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