KR20050105280A - 고 어스펙트비의 구멍을 가지는 작업물의 전기도금 방법 - Google Patents

고 어스펙트비의 구멍을 가지는 작업물의 전기도금 방법 Download PDF

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Publication number
KR20050105280A
KR20050105280A KR1020057016921A KR20057016921A KR20050105280A KR 20050105280 A KR20050105280 A KR 20050105280A KR 1020057016921 A KR1020057016921 A KR 1020057016921A KR 20057016921 A KR20057016921 A KR 20057016921A KR 20050105280 A KR20050105280 A KR 20050105280A
Authority
KR
South Korea
Prior art keywords
workpiece
pulse
current pulse
electroplating
aspect ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020057016921A
Other languages
English (en)
Korean (ko)
Inventor
베르트 렌츠
타파즈와 마가야
Original Assignee
아토테크더치랜드게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아토테크더치랜드게엠베하 filed Critical 아토테크더치랜드게엠베하
Publication of KR20050105280A publication Critical patent/KR20050105280A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020057016921A 2003-03-10 2004-02-04 고 어스펙트비의 구멍을 가지는 작업물의 전기도금 방법 Withdrawn KR20050105280A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10311575A DE10311575B4 (de) 2003-03-10 2003-03-10 Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
DE10311575.7 2003-03-10

Publications (1)

Publication Number Publication Date
KR20050105280A true KR20050105280A (ko) 2005-11-03

Family

ID=32892263

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057016921A Withdrawn KR20050105280A (ko) 2003-03-10 2004-02-04 고 어스펙트비의 구멍을 가지는 작업물의 전기도금 방법

Country Status (7)

Country Link
US (1) US20060151328A1 (https=)
EP (1) EP1601822A1 (https=)
JP (1) JP2006519931A (https=)
KR (1) KR20050105280A (https=)
DE (1) DE10311575B4 (https=)
TW (1) TW200502443A (https=)
WO (1) WO2004081262A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101335480B1 (ko) * 2006-03-30 2013-12-02 아토테크 도이칠란드 게엠베하 홀 및 캐비티를 금속으로 충전하기 위한 전기분해 방법
KR20170089864A (ko) * 2014-12-05 2017-08-04 아토테크더치랜드게엠베하 기판 상에 금속을 전기도금하는 방법 및 장치

Families Citing this family (22)

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US7947161B2 (en) * 2004-03-19 2011-05-24 Faraday Technology, Inc. Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
US7553401B2 (en) * 2004-03-19 2009-06-30 Faraday Technology, Inc. Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
US20070063521A1 (en) * 2004-12-03 2007-03-22 Lancashire Christopher L Method and apparatus for plating automotive bumpers
US8062496B2 (en) * 2008-04-18 2011-11-22 Integran Technologies Inc. Electroplating method and apparatus
JP5425440B2 (ja) * 2008-10-20 2014-02-26 株式会社Ｊｃｕ 銅めっきにおけるウィスカーの抑制方法
US20100206737A1 (en) * 2009-02-17 2010-08-19 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
JP5504147B2 (ja) 2010-12-21 2014-05-28 株式会社荏原製作所 電気めっき方法
US9816193B2 (en) * 2011-01-07 2017-11-14 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
EP2668317B1 (en) 2011-01-26 2017-08-23 MacDermid Enthone Inc. Process for filling vias in the microelectronics
CN103179806B (zh) * 2011-12-21 2019-05-28 奥特斯有限公司 组合的通孔镀覆和孔填充的方法
US9816196B2 (en) 2012-04-27 2017-11-14 Novellus Systems, Inc. Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
US9435048B2 (en) * 2013-02-27 2016-09-06 Taiwan Semiconductor Manufacturing Co., Ltd. Layer by layer electro chemical plating (ECP) process
DE102013021586A1 (de) * 2013-12-19 2015-06-25 Ludy Galvanosysteme Gmbh Verfahren und Vorrichtung zum elektrochemischen Behandeln von flachem Behandlungsgut
US10154598B2 (en) 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
JP6906237B2 (ja) * 2018-12-12 2021-07-21 奥野製薬工業株式会社 断続的電気めっき方法
KR102619843B1 (ko) * 2018-12-28 2024-01-02 에이씨엠 리서치 (상하이), 인코포레이티드 도금 장치 및 도금 방법
CN110699725A (zh) * 2019-11-21 2020-01-17 上海江南轧辊有限公司 一种液中放电沉积系统及其使用方法
WO2021245766A1 (ja) * 2020-06-02 2021-12-09 奥野製薬工業株式会社 断続的電気めっき方法
NL2030054B1 (nl) * 2021-12-07 2023-06-22 Meco Equipment Eng B V Inrichting en werkwijze voor het elektrolytisch behandelen van substraten.
CN114554727B (zh) * 2022-03-31 2024-12-06 生益电子股份有限公司 一种实现高纵横比通盲孔的电镀方法及pcb
CN120425431B (zh) * 2025-07-09 2025-11-07 阜阳师范大学 一种微孔电镀方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH629542A5 (de) * 1976-09-01 1982-04-30 Inoue Japax Res Verfahren und vorrichtung zur galvanischen materialablagerung.
DE4134632C1 (https=) * 1991-10-19 1993-04-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4225961C5 (de) * 1992-08-06 2011-01-27 Atotech Deutschland Gmbh Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19547948C1 (de) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
US6210555B1 (en) * 1999-01-29 2001-04-03 Faraday Technology Marketing Group, Llc Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
EP1069212A1 (en) * 1999-07-12 2001-01-17 Applied Materials, Inc. Electrochemical deposition for high aspect ratio structures using electrical pulse modulation
US20040045832A1 (en) * 1999-10-14 2004-03-11 Nicholas Martyak Electrolytic copper plating solutions
US6652727B2 (en) * 1999-10-15 2003-11-25 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
US6881318B2 (en) * 2001-07-26 2005-04-19 Applied Materials, Inc. Dynamic pulse plating for high aspect ratio features

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101335480B1 (ko) * 2006-03-30 2013-12-02 아토테크 도이칠란드 게엠베하 홀 및 캐비티를 금속으로 충전하기 위한 전기분해 방법
KR20170089864A (ko) * 2014-12-05 2017-08-04 아토테크더치랜드게엠베하 기판 상에 금속을 전기도금하는 방법 및 장치

Also Published As

Publication number Publication date
DE10311575A1 (de) 2004-09-23
WO2004081262A1 (en) 2004-09-23
JP2006519931A (ja) 2006-08-31
TW200502443A (en) 2005-01-16
EP1601822A1 (en) 2005-12-07
US20060151328A1 (en) 2006-07-13
WO2004081262A8 (en) 2004-12-16
DE10311575B4 (de) 2007-03-22

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000