KR20050086756A - 레이저 가공 장치 - Google Patents
레이저 가공 장치 Download PDFInfo
- Publication number
- KR20050086756A KR20050086756A KR1020057009325A KR20057009325A KR20050086756A KR 20050086756 A KR20050086756 A KR 20050086756A KR 1020057009325 A KR1020057009325 A KR 1020057009325A KR 20057009325 A KR20057009325 A KR 20057009325A KR 20050086756 A KR20050086756 A KR 20050086756A
- Authority
- KR
- South Korea
- Prior art keywords
- light
- laser light
- laser
- passage hole
- diameter
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical & Material Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Laser Beam Processing (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Laser Surgery Devices (AREA)
- Lasers (AREA)
- Lens Barrels (AREA)
Abstract
Description
Claims (4)
- 웨이퍼 형상의 가공 대상물의 내부에 집광점을 맞춰서 레이저 광을 조사하고, 상기 가공 대상물의 내부에 다광자 흡수에 의한 개질 영역을 형성하는 레이저 가공 장치로서,레이저 광원으로부터 출사된 레이저 광의 빔 사이즈를 확대하는 빔 익스팬더와,상기 빔 익스팬더를 통하여 입사한 레이저 광을 상기 가공 대상물의 내부에 집광하는 집광 렌즈와,상기 집광 렌즈를 유지하는 동시에, 상기 집광 렌즈에 레이저 광을 입사시키는 제1의 광 통과 구멍을 갖는 렌즈 홀더를 구비하고,상기 빔 익스팬더와 상기 제1의 광 통과 구멍을 연결하는 레이저 광의 광로 상에는, 레이저 광을 죄여서 통과시키는 제2의 광 통과 구멍을 갖는 다이어프램 부재가 설치되며, 그 다이어프램 부재는 상기 렌즈 홀더로부터 이간하고 있는 것을 특징으로 하는 레이저 가공 장치.
- 제1항에 있어서,상기 빔 익스팬더로부터 출사된 레이저 광이 대략 평행 광인 경우, 상기 제2의 광 통과 구멍의 지름은 상기 제1의 광 통과 구멍의 지름 이하인 것을 특징으로 하는 레이저 가공 장치.
- 제1항에 있어서,상기 레이저 광원이 빔 지름 φ0, 발산 각도 2θ0로 레이저 광을 출사하고, 상기 빔 익스팬더가 배율 M으로 레이저 광의 빔 사이즈를 확대하여, 발산 각도 2θ1으로 레이저 광을 출사하는 경우,상기 레이저 광원의 출사부와 상기 빔 익스팬더의 입사부와의 거리를 d1, 상기 빔 익스팬더의 출사부와 상기 제2의 광 통과 구멍의 입사측 개구와의 거리를 d2, 상기 제2의 광 통과 구멍의 입사측 개구와 상기 제1의 광 통과 구멍의 입사측 개구와의 거리를 d3로 하고,상기 제1의 광 통과 구멍의 지름을 φL, 상기 제2의 광 통과 구멍의 지름을 φS로 하면,상기 φL 및 상기 φS는,의 관계를 충족하는 것을 특징으로 하는 레이저 가공 장치.
- 제1항에 있어서,상기 레이저 광원이 빔 지름 φ0, 발산 각도 2θ0로 레이저 광을 출사하고, 상기 빔 익스팬더가 배율 M으로 레이저 광의 빔 사이즈를 확대하여, 집속 각도 2θ1으로 레이저 광을 출사하는 경우,상기 레이저 광원의 출사부와 상기 빔 익스팬더의 입사부와의 거리를 d1, 상기 빔 익스팬더의 출사부와 상기 제2의 광 통과 구멍의 입사측 개구와의 거리를 d2, 상기 제2의 광 통과 구멍의 입사측 개구와 상기 제1의 광 통과 구멍의 입사측 개구와의 거리를 d3로 하고,상기 제1의 광 통과 구멍의 지름을 φL, 상기 제2의 광 통과 구멍의 지름을 φS로 하면,상기 φL 및 상기 φS는,의 관계를 충족하는 것을 특징으로 하는 레이저 가공 장치.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002354234 | 2002-12-05 | ||
JPJP-P-2002-00354234 | 2002-12-05 | ||
PCT/JP2003/015555 WO2004050291A1 (ja) | 2002-12-05 | 2003-12-04 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050086756A true KR20050086756A (ko) | 2005-08-30 |
KR101119262B1 KR101119262B1 (ko) | 2012-03-16 |
Family
ID=32463334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057009325A KR101119262B1 (ko) | 2002-12-05 | 2003-12-04 | 레이저 가공 장치 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7489454B2 (ko) |
EP (1) | EP1588793B1 (ko) |
JP (1) | JP3683580B2 (ko) |
KR (1) | KR101119262B1 (ko) |
CN (1) | CN100445014C (ko) |
AT (1) | ATE550129T1 (ko) |
AU (1) | AU2003289188A1 (ko) |
ES (1) | ES2381254T3 (ko) |
WO (1) | WO2004050291A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101369531B1 (ko) * | 2005-12-22 | 2014-03-05 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공장치 |
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JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
US8268704B2 (en) * | 2002-03-12 | 2012-09-18 | Hamamatsu Photonics K.K. | Method for dicing substrate |
ATE493226T1 (de) | 2002-03-12 | 2011-01-15 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
TWI326626B (en) * | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
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JP4907965B2 (ja) * | 2005-11-25 | 2012-04-04 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP4907984B2 (ja) * | 2005-12-27 | 2012-04-04 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップ |
JP5183892B2 (ja) | 2006-07-03 | 2013-04-17 | 浜松ホトニクス株式会社 | レーザ加工方法 |
EP1875983B1 (en) | 2006-07-03 | 2013-09-11 | Hamamatsu Photonics K.K. | Laser processing method and chip |
JP5145673B2 (ja) * | 2006-08-30 | 2013-02-20 | 住友電気工業株式会社 | レーザ加工方法およびレーザ加工装置 |
JP4954653B2 (ja) | 2006-09-19 | 2012-06-20 | 浜松ホトニクス株式会社 | レーザ加工方法 |
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JP5241527B2 (ja) | 2009-01-09 | 2013-07-17 | 浜松ホトニクス株式会社 | レーザ加工装置 |
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KR101769158B1 (ko) | 2009-04-07 | 2017-08-17 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공 장치 및 레이저 가공 방법 |
JP5491761B2 (ja) | 2009-04-20 | 2014-05-14 | 浜松ホトニクス株式会社 | レーザ加工装置 |
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2003
- 2003-12-04 KR KR1020057009325A patent/KR101119262B1/ko active IP Right Grant
- 2003-12-04 US US10/537,511 patent/US7489454B2/en active Active
- 2003-12-04 ES ES03777262T patent/ES2381254T3/es not_active Expired - Lifetime
- 2003-12-04 AT AT03777262T patent/ATE550129T1/de active
- 2003-12-04 JP JP2004556913A patent/JP3683580B2/ja not_active Expired - Lifetime
- 2003-12-04 EP EP03777262A patent/EP1588793B1/en not_active Expired - Lifetime
- 2003-12-04 WO PCT/JP2003/015555 patent/WO2004050291A1/ja active Application Filing
- 2003-12-04 AU AU2003289188A patent/AU2003289188A1/en not_active Abandoned
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101369531B1 (ko) * | 2005-12-22 | 2014-03-05 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공장치 |
Also Published As
Publication number | Publication date |
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AU2003289188A1 (en) | 2004-06-23 |
CN100445014C (zh) | 2008-12-24 |
ES2381254T3 (es) | 2012-05-24 |
JP3683580B2 (ja) | 2005-08-17 |
US20060151443A1 (en) | 2006-07-13 |
JPWO2004050291A1 (ja) | 2006-03-30 |
CN1720116A (zh) | 2006-01-11 |
EP1588793A1 (en) | 2005-10-26 |
EP1588793B1 (en) | 2012-03-21 |
KR101119262B1 (ko) | 2012-03-16 |
EP1588793A4 (en) | 2008-09-03 |
WO2004050291A1 (ja) | 2004-06-17 |
US7489454B2 (en) | 2009-02-10 |
ATE550129T1 (de) | 2012-04-15 |
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