KR200470083Y1 - 발광 다이오드 조립 구조물 및 상기 구조물을 이용한 라이트 바 - Google Patents

발광 다이오드 조립 구조물 및 상기 구조물을 이용한 라이트 바 Download PDF

Info

Publication number
KR200470083Y1
KR200470083Y1 KR2020090007569U KR20090007569U KR200470083Y1 KR 200470083 Y1 KR200470083 Y1 KR 200470083Y1 KR 2020090007569 U KR2020090007569 U KR 2020090007569U KR 20090007569 U KR20090007569 U KR 20090007569U KR 200470083 Y1 KR200470083 Y1 KR 200470083Y1
Authority
KR
South Korea
Prior art keywords
light emitting
connection
connection block
emitting diode
cladding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR2020090007569U
Other languages
English (en)
Korean (ko)
Other versions
KR20100000463U (ko
Inventor
치아-한 쉬에
Original Assignee
루멘맥스 옵토일렉트로닉스 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 루멘맥스 옵토일렉트로닉스 컴퍼니 리미티드 filed Critical 루멘맥스 옵토일렉트로닉스 컴퍼니 리미티드
Publication of KR20100000463U publication Critical patent/KR20100000463U/ko
Application granted granted Critical
Publication of KR200470083Y1 publication Critical patent/KR200470083Y1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
KR2020090007569U 2008-07-03 2009-06-11 발광 다이오드 조립 구조물 및 상기 구조물을 이용한 라이트 바 Expired - Fee Related KR200470083Y1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW097125009 2008-07-03
TW97125009 2008-07-03
TW098105067 2009-02-18
TW098105067A TW201003991A (en) 2008-07-03 2009-02-18 Package structure of LED and light bar using the same

Publications (2)

Publication Number Publication Date
KR20100000463U KR20100000463U (ko) 2010-01-13
KR200470083Y1 true KR200470083Y1 (ko) 2013-11-26

Family

ID=40984554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020090007569U Expired - Fee Related KR200470083Y1 (ko) 2008-07-03 2009-06-11 발광 다이오드 조립 구조물 및 상기 구조물을 이용한 라이트 바

Country Status (5)

Country Link
US (1) US7939919B2 (enExample)
JP (1) JP3152802U (enExample)
KR (1) KR200470083Y1 (enExample)
DE (1) DE202009007540U1 (enExample)
TW (1) TW201003991A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011009298A (ja) * 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
KR101352276B1 (ko) * 2009-07-24 2014-01-16 엘지디스플레이 주식회사 발광다이오드의 방열장치와 이를 이용한 액정표시장치
KR101075774B1 (ko) * 2009-10-29 2011-10-26 삼성전기주식회사 발광소자 패키지 및 그 제조 방법
KR101867106B1 (ko) 2010-03-30 2018-06-12 다이니폰 인사츠 가부시키가이샤 Led용 수지 부착 리드 프레임, 반도체 장치, 반도체 장치의 제조 방법 및 led용 수지 부착 리드 프레임의 제조 방법
KR101298406B1 (ko) * 2010-05-17 2013-08-20 엘지이노텍 주식회사 발광소자
JP5896302B2 (ja) 2010-11-02 2016-03-30 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、樹脂付リードフレーム、半導体装置の製造方法、および半導体素子搭載用リードフレーム
JP6286857B2 (ja) * 2013-04-10 2018-03-07 三菱電機株式会社 照明ランプおよび照明装置
JP2019114624A (ja) * 2017-12-22 2019-07-11 スタンレー電気株式会社 半導体発光装置及びその製造方法
KR102307915B1 (ko) 2019-10-31 2021-10-05 김순희 골프 티꽂이
CN113921682B (zh) * 2021-10-12 2024-10-22 深圳市伟特立光电有限公司 基于半导体led发光芯片用封装结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002353515A (ja) * 2001-05-24 2002-12-06 Samsung Electro Mech Co Ltd 発光ダイオード及びこれを用いた発光装置とその製造方法
JP2005353914A (ja) * 2004-06-11 2005-12-22 Toshiba Corp 半導体発光装置及びその製造方法並びに半導体発光ユニット
US7208772B2 (en) * 2004-09-01 2007-04-24 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI277223B (en) * 2004-11-03 2007-03-21 Chen-Lun Hsingchen A low thermal resistance LED package
TW200843130A (en) * 2007-04-17 2008-11-01 Wen Lin Package structure of a surface-mount high-power light emitting diode chip and method of making the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002353515A (ja) * 2001-05-24 2002-12-06 Samsung Electro Mech Co Ltd 発光ダイオード及びこれを用いた発光装置とその製造方法
JP2005353914A (ja) * 2004-06-11 2005-12-22 Toshiba Corp 半導体発光装置及びその製造方法並びに半導体発光ユニット
US7208772B2 (en) * 2004-09-01 2007-04-24 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof

Also Published As

Publication number Publication date
TW201003991A (en) 2010-01-16
JP3152802U (ja) 2009-08-13
US20100001298A1 (en) 2010-01-07
TWI379445B (enExample) 2012-12-11
US7939919B2 (en) 2011-05-10
DE202009007540U1 (de) 2009-08-20
KR20100000463U (ko) 2010-01-13

Similar Documents

Publication Publication Date Title
KR200470083Y1 (ko) 발광 다이오드 조립 구조물 및 상기 구조물을 이용한 라이트 바
CN100407453C (zh) 表面安装型led及使用它的发光装置
JP5749709B2 (ja) 発光装置
JP2005064047A (ja) 発光ダイオード
JP6628739B2 (ja) 発光装置
US9349930B2 (en) LED module and lighting assembly
JP2006295085A (ja) 発光ダイオード光源ユニット
JP2010129615A (ja) 発光装置及び照明装置
TWI496323B (zh) 發光模組
CN104170106A (zh) Led用基板、led模块和led灯
KR101055074B1 (ko) 발광 장치
KR20110080474A (ko) 방열기판을 갖는 ｌｅｄ 패키지
CN201434352Y (zh) 发光二极管封装结构及应用该结构的灯条
CN109994458B (zh) 发光装置
JP2009231148A (ja) 照明装置
KR20090102208A (ko) 방열 ｌｅｄ 패키지
KR101337598B1 (ko) 크기가 감소된 캐비티를 갖는 ｌｅｄ 패키지
JP2014011461A (ja) 発光ダイオードライトバー
KR20100063877A (ko) 발광 소자
CN118676175B (zh) 一种芯片阵列及发光模组
CN222851445U (zh) 一种发光模组
CN102324423A (zh) 一种cobled集成封装结构
KR20110107134A (ko) 발광 유닛 및 형광등형 조명 기구
JP2009259768A (ja) 照明装置
JP2010287749A (ja) 発光体および照明器具

Legal Events

Date Code Title Description
UA0108 Application for utility model registration

St.27 status event code: A-0-1-A10-A12-nap-UA0108

UG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-UG1501

A201 Request for examination
UA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-UA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
UE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-UE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
UE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-UE0701

REGI Registration of establishment
UR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-UR0701

UR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-UR1002

Fee payment year number: 1

UG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-UG1601

UC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-UC1903

Not in force date: 20161121

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

UC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-UC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20161121

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000