KR20040110075A - 화상 표시 장치 - Google Patents
화상 표시 장치 Download PDFInfo
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- KR20040110075A KR20040110075A KR1020040008323A KR20040008323A KR20040110075A KR 20040110075 A KR20040110075 A KR 20040110075A KR 1020040008323 A KR1020040008323 A KR 1020040008323A KR 20040008323 A KR20040008323 A KR 20040008323A KR 20040110075 A KR20040110075 A KR 20040110075A
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- thin film
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- 239000010409 thin film Substances 0.000 claims abstract description 94
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 239000010408 film Substances 0.000 claims abstract description 57
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 31
- 239000013078 crystal Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 5
- 238000005070 sampling Methods 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 description 29
- 239000011521 glass Substances 0.000 description 22
- 239000007787 solid Substances 0.000 description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 10
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 8
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 8
- 229910004444 SUB1 Inorganic materials 0.000 description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 239000012535 impurity Substances 0.000 description 7
- 229910004438 SUB2 Inorganic materials 0.000 description 6
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 238000002513 implantation Methods 0.000 description 6
- 101150018444 sub2 gene Proteins 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000015654 memory Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 101100214488 Solanum lycopersicum TFT2 gene Proteins 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- KKIMDKMETPPURN-UHFFFAOYSA-N 1-(3-(trifluoromethyl)phenyl)piperazine Chemical compound FC(F)(F)C1=CC=CC(N2CCNCC2)=C1 KKIMDKMETPPURN-UHFFFAOYSA-N 0.000 description 2
- 101100489584 Solanum lycopersicum TFT1 gene Proteins 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002407 reforming Methods 0.000 description 2
- 102100040862 Dual specificity protein kinase CLK1 Human genes 0.000 description 1
- 102100040844 Dual specificity protein kinase CLK2 Human genes 0.000 description 1
- 101000749294 Homo sapiens Dual specificity protein kinase CLK1 Proteins 0.000 description 1
- 101000749291 Homo sapiens Dual specificity protein kinase CLK2 Proteins 0.000 description 1
- 101001135252 Pseudomonas fluorescens Phosphate starvation-inducible protein 1 Proteins 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000005499 laser crystallization Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
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- 239000003566 sealing material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136277—Active matrix addressed cells formed on a semiconductor substrate, e.g. of silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1285—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/13624—Active matrix addressed cells having more than one switching element per pixel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
- H01L29/78627—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD
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- Condensed Matter Physics & Semiconductors (AREA)
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- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
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Abstract
Description
Claims (12)
- 화상 표시 장치에 있어서,절연성 기판; 및상기 절연성 기판 위에 다결정 실리콘 반도체막을 갖는 화소부 및 화소 구동 회로부를 적어도 포함하는 복수개의 회로 영역을 형성한 액티브 매트릭스 기판을 포함하고,상기 복수개의 회로 영역 중 적어도 하나에, 채널을 흐르는 전류의 방향이 서로 다른 복수개의 박막 트랜지스터를 구비하는 화상 표시 장치.
- 화상 표시 장치에 있어서,절연성 기판; 및상기 절연성 기판 위에 다결정 실리콘 반도체막을 갖는 화소부 및 화소 구동 회로부를 적어도 포함하는 복수개의 회로 영역을 형성한 액티브 매트릭스 기판을 포함하고,채널을 흐르는 전류의 방향이 동일한 회로 영역에서, 그 방향이 적어도 1조의 회로 영역끼리에서는 서로 다른 화상 표시 장치.
- 제1항에 있어서,상기 복수개의 회로 영역의 각각을 구성하는 상기 박막 트랜지스터의 전류가흐르는 방향이 영역 내에서 동일한 회로 영역과, 상기 전류가 흐르는 방향이 영역 내에서 서로 다른 회로 영역이 적어도 1조 존재하는 화상 표시 장치.
- 제3항에 있어서,각각의 회로 영역을 구성하는 상기 박막 트랜지스터의 전류가 흐르는 방향이, 영역 내에서 동일한 회로 영역 모두에서 동일한 방향을 갖는 화상 표시 장치.
- 제3항에 있어서,각각의 상기 회로 영역을 구성하는 상기 박막 트랜지스터의 전류가 흐르는 방향이 영역 내에서 동일한 회로 영역에서는, 상기 박막 트랜지스터의 채널 및 소스·드레인 영역의 표면의 고저 차가 5㎚ 이하이고,상기 다결정 실리콘 반도체막의 결정립의 형태는, 폭이 0.3㎛ 이상 2㎛ 이하, 길이가 4㎛ 이상의 장방형상의 박막으로 형성되며,상기 회로 영역을 구성하는 박막 트랜지스터의 전류가 흐르는 방향이 영역 내에서 복수개 존재하는 회로 영역에서는 상기 채널 및 소스·드레인 영역에서의 상기 결정립의 평균 입경이 1㎛ 이하, 또한 표면의 고저 차가 20㎚ 이상인 화상 표시 장치.
- 제1항에 있어서,상기 박막 트랜지스터는, 복수 종류의 표면 형상을 갖는 다결정 실리콘 박막으로 형성되어 있고, 그 중에서 적어도 하나의 회로 영역을 구성하는 박막 트랜지스터의 채널 및 소스·드레인 영역의 표면의 고저차가 5㎚ 이하이며, 상기 다결정 실리콘 박막의 결정립의 형태는 폭이 0.3㎛ 이상 2㎛ 이하, 길이가 4㎛ 이상의 장방형상인 화상 표시 장치.
- 제1항에 있어서,상기 박막 트랜지스터는 복수 종류의 게이트 절연 재료 및 막 두께를 상기 회로 영역마다 갖는 화상 표시 장치.
- 제1항에 있어서,상기 박막 트랜지스터는, 상기 회로 영역마다 복수 종류의 구조를 갖는 화상 표시 장치.
- 화상 표시 장치에 있어서,동일한 절연성 기판 위에 형성되고, 다결정 실리콘 박막으로 형성되는 박막 트랜지스터를 갖는 화소부 및 화소 구동 회로부를 적어도 포함하는 복수개의 회로 영역을 형성한 액티브 매트릭스 기판을 포함하고,상기 화소부의 회로 영역을 형성하는 박막 트랜지스터의 채널 및 소스·드레인 영역은, 평균 입경이 1㎛ 이하이며, 표면의 고저 차가 20㎚ 이상인 다결정 실리콘 박막이고,상기 화소부의 회로 영역을 제외한 상기 복수개의 회로 영역 중 적어도 하나의 회로 영역을 구성하는 박막 트랜지스터의 채널 및 소스·드레인 영역의 상기 다결정 실리콘 박막의 결정립의 형태는 폭이 0.3㎛ 이상 2㎛ 이하, 길이가 4㎛ 이상의 장방형상이며, 또한 상기 채널 및 소스·드레인 영역의 표면의 고저차가 5㎚ 이하인 화상 표시 장치.
- 제9항에 있어서,상기 화소부의 회로 영역을 제외한 상기 복수개의 회로 영역을 구성하는 박막 트랜지스터는, 복수 종류의 게이트 절연 재료, 및 막 두께를 갖는 화상 표시 장치.
- 제9항에 있어서,상기 화소부를 제외한 회로 영역을 구성하는 상기 박막 트랜지스터는, 복수 종류의 구조를 갖는 화상 표시 장치.
- 제9항에 있어서,상기 화소부의 회로 영역을 제외한 상기 복수개의 회로 영역에, 레벨 시프터, 샘플링 스위치 회로, 버퍼 회로를 갖는 화소 구동 회로를 포함하고,상기 화소 구동 회로를 구성하는 박막 트랜지스터의 채널 및 소스·드레인영역은 평균 입경이 1㎛ 이하, 표면의 고저 차가 20㎚ 이상인 다결정 실리콘 박막으로 형성되어 있으며,상기 레벨 시프터와 상기 샘플링 스위치 회로를 제외한 회로 중, 적어도 하나를 구성하는 박막 트랜지스터의 채널 및 소스·드레인 영역을 구성하는 다결정 실리콘 박막의 결정립의 형태는 폭 0.3㎛ 이상 2㎛ 이하, 길이가 4㎛ 이상의 장방형상이고, 또한 표면의 고저 차가 5㎚ 이하인 다결정 실리콘 박막으로 형성되어 있는 화상 표시 장치.
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JP2003176281A JP4464078B2 (ja) | 2003-06-20 | 2003-06-20 | 画像表示装置 |
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JP (1) | JP4464078B2 (ko) |
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CN102844873B (zh) * | 2010-03-31 | 2015-06-17 | 株式会社半导体能源研究所 | 半导体显示装置 |
US9159283B2 (en) * | 2011-07-18 | 2015-10-13 | Innolux Corporation | Switch circuit, pixel element and display panel for using in refreshing memory in pixel |
TWI456555B (zh) * | 2011-12-23 | 2014-10-11 | Innolux Corp | 顯示系統 |
CN106784412B (zh) * | 2017-03-30 | 2019-02-26 | 武汉华星光电技术有限公司 | 柔性有机发光二极管显示器及其制作方法 |
CN109458986A (zh) * | 2018-11-12 | 2019-03-12 | 吴基玄 | 一种海拔高度计量装置 |
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CN1573436A (zh) | 2005-02-02 |
KR101022619B1 (ko) | 2011-03-16 |
CN100595638C (zh) | 2010-03-24 |
TWI364742B (en) | 2012-05-21 |
JP2005010606A (ja) | 2005-01-13 |
US20040257486A1 (en) | 2004-12-23 |
US20070262319A1 (en) | 2007-11-15 |
US7262821B2 (en) | 2007-08-28 |
JP4464078B2 (ja) | 2010-05-19 |
TW200501027A (en) | 2005-01-01 |
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