KR20040044347A - 실란, 전자 공여체 및 전자 수용체 작용기를 함유하는불포화 화합물 - Google Patents

실란, 전자 공여체 및 전자 수용체 작용기를 함유하는불포화 화합물 Download PDF

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Publication number
KR20040044347A
KR20040044347A KR1020030080996A KR20030080996A KR20040044347A KR 20040044347 A KR20040044347 A KR 20040044347A KR 1020030080996 A KR1020030080996 A KR 1020030080996A KR 20030080996 A KR20030080996 A KR 20030080996A KR 20040044347 A KR20040044347 A KR 20040044347A
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South Korea
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group
reaction
functional group
carbon
precursor
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Ceased
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KR1020030080996A
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English (en)
Korean (ko)
Inventor
무사오사마엠.
Original Assignee
내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
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Application filed by 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 filed Critical 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
Publication of KR20040044347A publication Critical patent/KR20040044347A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/06—Oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C08C19/25—Incorporating silicon atoms into the molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/838—Bonding techniques
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    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020030080996A 2002-11-20 2003-11-17 실란, 전자 공여체 및 전자 수용체 작용기를 함유하는불포화 화합물 Ceased KR20040044347A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/302,574 2002-11-20
US10/302,574 US6809155B2 (en) 2002-11-20 2002-11-20 Unsaturated compounds containing silane, electron donor and electron acceptor functionality

Publications (1)

Publication Number Publication Date
KR20040044347A true KR20040044347A (ko) 2004-05-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030080996A Ceased KR20040044347A (ko) 2002-11-20 2003-11-17 실란, 전자 공여체 및 전자 수용체 작용기를 함유하는불포화 화합물

Country Status (6)

Country Link
US (2) US6809155B2 (enExample)
EP (1) EP1422251A3 (enExample)
JP (1) JP2004197079A (enExample)
KR (1) KR20040044347A (enExample)
MY (1) MY140722A (enExample)
TW (1) TWI235162B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050215644A1 (en) * 2004-03-19 2005-09-29 Interhealth Nutraceuticals, Inc. Methods for increasing neurotransmitter levels using hydroxycitric acid
US20070212556A1 (en) * 2006-03-07 2007-09-13 Musa Osama M Curable materials containing siloxane
US8569538B2 (en) * 2006-06-30 2013-10-29 Johnson & Johnson Vision Care, Inc. Acryloyl materials for molded plastics
US20080063873A1 (en) * 2006-09-08 2008-03-13 Russell Stapleton Flexible microelectronics adhesive
US20080081850A1 (en) * 2006-09-29 2008-04-03 Kazuhiko Fujisawa Process for producing hydrolysis-resistant silicone compounds
US7838698B2 (en) * 2006-09-29 2010-11-23 Johnson & Johnson Vision Care, Inc. Hydrolysis-resistant silicone compounds
US9056880B2 (en) 2006-09-29 2015-06-16 Johnson & Johnson Vision Care, Inc. Process for producing hydrolysis-resistant silicone compounds
US8080622B2 (en) * 2007-06-29 2011-12-20 Johnson & Johnson Vision Care, Inc. Soluble silicone prepolymers
US8324319B2 (en) * 2007-11-20 2012-12-04 Sridhar Laxmisha M Redox-induced cationically polymerizable compositions with low cure temperature
US7897654B2 (en) 2007-12-27 2011-03-01 Johnson & Johnson Vision Care Inc. Silicone prepolymer solutions
US9163102B2 (en) 2011-12-01 2015-10-20 Isp Investments Inc. Soluble branched polymers
FR3015488B1 (fr) * 2013-12-19 2018-05-04 Compagnie Generale Des Etablissements Michelin Procede de synthese d'un polymere dienique fonctionnalise par des groupements epoxyde pendants le long de la chaine.
MX2020001733A (es) 2017-08-18 2020-03-20 Fina Technology Polifarnesenos epoxidizados y metodos para producirlos.
WO2019111819A1 (ja) * 2017-12-05 2019-06-13 株式会社クラレ 変性液状ジエン系重合体
JP6590048B1 (ja) * 2018-08-09 2019-10-16 横浜ゴム株式会社 熱硬化性樹脂組成物及び熱硬化性樹脂
JP7093150B2 (ja) * 2018-12-06 2022-06-29 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60159583A (ja) 1984-01-27 1985-08-21 井関農機株式会社 穀粒乾燥機の始動装置
JPS6189242A (ja) 1984-10-09 1986-05-07 Idemitsu Petrochem Co Ltd 液状ジエン系重合体組成物
JPS6420213A (en) * 1987-07-15 1989-01-24 Matsushita Electric Works Ltd Photocurable resin composition
KR900007765B1 (ko) * 1987-11-25 1990-10-19 고려화학 주식회사 고무가 피복된 저용력화제 제조방법 및 이를 함유한 조성물
JP2718962B2 (ja) 1988-11-11 1998-02-25 東芝シリコーン株式会社 加水分解性シリル基で分子鎖末端が閉塞されたポリブタジエン、その製造方法およびそれを含有する室温硬化性組成物
EP0476224A1 (en) * 1990-08-21 1992-03-25 Ricon Resins, Inc. Adhesive rubber compositions
AU668369B2 (en) * 1991-11-15 1996-05-02 Imperial Chemical Industries Plc Polymerisable compositions
US5300589A (en) * 1993-05-28 1994-04-05 Hoechst Celanese Corporation Substituted triphenyl compounds & processes for preparing the same
US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
TWI282811B (en) * 2000-04-10 2007-06-21 Sumitomo Bakelite Co Die-attaching paste and semiconductor device
WO2003014248A2 (en) * 2001-08-07 2003-02-20 National Starch And Chemical Investment Holding Corporation Adhesion promoting resins with cross-linking properties

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Publication number Publication date
US20040097651A1 (en) 2004-05-20
TW200418928A (en) 2004-10-01
JP2004197079A (ja) 2004-07-15
US20040242796A1 (en) 2004-12-02
US6809155B2 (en) 2004-10-26
US6908969B2 (en) 2005-06-21
EP1422251A2 (en) 2004-05-26
EP1422251A3 (en) 2005-04-13
MY140722A (en) 2010-01-15
TWI235162B (en) 2005-07-01

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