JP2004197079A - シラン、電子供与体及び電子受容体官能基を含有する不飽和化合物 - Google Patents

シラン、電子供与体及び電子受容体官能基を含有する不飽和化合物 Download PDF

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Publication number
JP2004197079A
JP2004197079A JP2003389186A JP2003389186A JP2004197079A JP 2004197079 A JP2004197079 A JP 2004197079A JP 2003389186 A JP2003389186 A JP 2003389186A JP 2003389186 A JP2003389186 A JP 2003389186A JP 2004197079 A JP2004197079 A JP 2004197079A
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Prior art keywords
group
reaction
carbon
curable compound
precursor
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Ceased
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JP2003389186A
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Japanese (ja)
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JP2004197079A5 (enExample
Inventor
Osama M Musa
エム．ムーサ オサマ
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National Starch and Chemical Investment Holding Corp
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National Starch and Chemical Investment Holding Corp
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Publication of JP2004197079A publication Critical patent/JP2004197079A/ja
Publication of JP2004197079A5 publication Critical patent/JP2004197079A5/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/06—Oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C08C19/25—Incorporating silicon atoms into the molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/838—Bonding techniques
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    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003389186A 2002-11-20 2003-11-19 シラン、電子供与体及び電子受容体官能基を含有する不飽和化合物 Ceased JP2004197079A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/302,574 US6809155B2 (en) 2002-11-20 2002-11-20 Unsaturated compounds containing silane, electron donor and electron acceptor functionality

Publications (2)

Publication Number Publication Date
JP2004197079A true JP2004197079A (ja) 2004-07-15
JP2004197079A5 JP2004197079A5 (enExample) 2006-12-28

Family

ID=32229921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003389186A Ceased JP2004197079A (ja) 2002-11-20 2003-11-19 シラン、電子供与体及び電子受容体官能基を含有する不飽和化合物

Country Status (6)

Country Link
US (2) US6809155B2 (enExample)
EP (1) EP1422251A3 (enExample)
JP (1) JP2004197079A (enExample)
KR (1) KR20040044347A (enExample)
MY (1) MY140722A (enExample)
TW (1) TWI235162B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019111819A1 (ja) * 2017-12-05 2019-06-13 株式会社クラレ 変性液状ジエン系重合体
JP2020026441A (ja) * 2018-08-09 2020-02-20 横浜ゴム株式会社 熱硬化性樹脂組成物及び熱硬化性樹脂
JP2020090610A (ja) * 2018-12-06 2020-06-11 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

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US20050215644A1 (en) * 2004-03-19 2005-09-29 Interhealth Nutraceuticals, Inc. Methods for increasing neurotransmitter levels using hydroxycitric acid
US20070212556A1 (en) * 2006-03-07 2007-09-13 Musa Osama M Curable materials containing siloxane
US8569538B2 (en) * 2006-06-30 2013-10-29 Johnson & Johnson Vision Care, Inc. Acryloyl materials for molded plastics
WO2008030910A1 (en) * 2006-09-08 2008-03-13 Lord Corporation Flexible microelectronics adhesive
US9056880B2 (en) 2006-09-29 2015-06-16 Johnson & Johnson Vision Care, Inc. Process for producing hydrolysis-resistant silicone compounds
US20080081850A1 (en) * 2006-09-29 2008-04-03 Kazuhiko Fujisawa Process for producing hydrolysis-resistant silicone compounds
US7838698B2 (en) 2006-09-29 2010-11-23 Johnson & Johnson Vision Care, Inc. Hydrolysis-resistant silicone compounds
US8080622B2 (en) * 2007-06-29 2011-12-20 Johnson & Johnson Vision Care, Inc. Soluble silicone prepolymers
US8324319B2 (en) * 2007-11-20 2012-12-04 Sridhar Laxmisha M Redox-induced cationically polymerizable compositions with low cure temperature
US7897654B2 (en) 2007-12-27 2011-03-01 Johnson & Johnson Vision Care Inc. Silicone prepolymer solutions
WO2013082359A1 (en) * 2011-12-01 2013-06-06 Isp Investments Inc. Soluble branched polymers
FR3015488B1 (fr) * 2013-12-19 2018-05-04 Compagnie Generale Des Etablissements Michelin Procede de synthese d'un polymere dienique fonctionnalise par des groupements epoxyde pendants le long de la chaine.
EP3668907B1 (en) 2017-08-18 2023-02-15 Fina Technology, Inc. Epoxidized polyfarnesene and methods for producing the same

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JPS60159583A (ja) 1984-01-27 1985-08-21 井関農機株式会社 穀粒乾燥機の始動装置
JPS6189242A (ja) 1984-10-09 1986-05-07 Idemitsu Petrochem Co Ltd 液状ジエン系重合体組成物
JPS6420213A (en) * 1987-07-15 1989-01-24 Matsushita Electric Works Ltd Photocurable resin composition
KR900007765B1 (ko) 1987-11-25 1990-10-19 고려화학 주식회사 고무가 피복된 저용력화제 제조방법 및 이를 함유한 조성물
JP2718962B2 (ja) 1988-11-11 1998-02-25 東芝シリコーン株式会社 加水分解性シリル基で分子鎖末端が閉塞されたポリブタジエン、その製造方法およびそれを含有する室温硬化性組成物
EP0476224A1 (en) 1990-08-21 1992-03-25 Ricon Resins, Inc. Adhesive rubber compositions
ATE188980T1 (de) 1991-11-15 2000-02-15 Ici Plc Polymerisierbare zusammensetzung
US5300589A (en) * 1993-05-28 1994-04-05 Hoechst Celanese Corporation Substituted triphenyl compounds & processes for preparing the same
US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
TWI282811B (en) * 2000-04-10 2007-06-21 Sumitomo Bakelite Co Die-attaching paste and semiconductor device
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019111819A1 (ja) * 2017-12-05 2019-06-13 株式会社クラレ 変性液状ジエン系重合体
JP6581746B1 (ja) * 2017-12-05 2019-09-25 株式会社クラレ 変性液状ジエン系重合体
JP2020026441A (ja) * 2018-08-09 2020-02-20 横浜ゴム株式会社 熱硬化性樹脂組成物及び熱硬化性樹脂
JP2020090610A (ja) * 2018-12-06 2020-06-11 日本化薬株式会社 硬化性樹脂組成物及びその硬化物
JP7093150B2 (ja) 2018-12-06 2022-06-29 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
US6908969B2 (en) 2005-06-21
EP1422251A3 (en) 2005-04-13
US20040097651A1 (en) 2004-05-20
US20040242796A1 (en) 2004-12-02
EP1422251A2 (en) 2004-05-26
KR20040044347A (ko) 2004-05-28
TWI235162B (en) 2005-07-01
US6809155B2 (en) 2004-10-26
TW200418928A (en) 2004-10-01
MY140722A (en) 2010-01-15

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