TWI235162B - Unsaturated compounds containing silane, electron donor and electron acceptor functionality - Google Patents

Unsaturated compounds containing silane, electron donor and electron acceptor functionality Download PDF

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Publication number
TWI235162B
TWI235162B TW092132355A TW92132355A TWI235162B TW I235162 B TWI235162 B TW I235162B TW 092132355 A TW092132355 A TW 092132355A TW 92132355 A TW92132355 A TW 92132355A TW I235162 B TWI235162 B TW I235162B
Authority
TW
Taiwan
Prior art keywords
group
carbon
reaction
ministry
printed
Prior art date
Application number
TW092132355A
Other languages
English (en)
Chinese (zh)
Other versions
TW200418928A (en
Inventor
Osama M Musa
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Publication of TW200418928A publication Critical patent/TW200418928A/zh
Application granted granted Critical
Publication of TWI235162B publication Critical patent/TWI235162B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/06—Oxidation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C08C19/25—Incorporating silicon atoms into the molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW092132355A 2002-11-20 2003-11-19 Unsaturated compounds containing silane, electron donor and electron acceptor functionality TWI235162B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/302,574 US6809155B2 (en) 2002-11-20 2002-11-20 Unsaturated compounds containing silane, electron donor and electron acceptor functionality

Publications (2)

Publication Number Publication Date
TW200418928A TW200418928A (en) 2004-10-01
TWI235162B true TWI235162B (en) 2005-07-01

Family

ID=32229921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092132355A TWI235162B (en) 2002-11-20 2003-11-19 Unsaturated compounds containing silane, electron donor and electron acceptor functionality

Country Status (6)

Country Link
US (2) US6809155B2 (enExample)
EP (1) EP1422251A3 (enExample)
JP (1) JP2004197079A (enExample)
KR (1) KR20040044347A (enExample)
MY (1) MY140722A (enExample)
TW (1) TWI235162B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050215644A1 (en) * 2004-03-19 2005-09-29 Interhealth Nutraceuticals, Inc. Methods for increasing neurotransmitter levels using hydroxycitric acid
US20070212556A1 (en) * 2006-03-07 2007-09-13 Musa Osama M Curable materials containing siloxane
US8569538B2 (en) * 2006-06-30 2013-10-29 Johnson & Johnson Vision Care, Inc. Acryloyl materials for molded plastics
US20080063873A1 (en) * 2006-09-08 2008-03-13 Russell Stapleton Flexible microelectronics adhesive
US7838698B2 (en) 2006-09-29 2010-11-23 Johnson & Johnson Vision Care, Inc. Hydrolysis-resistant silicone compounds
US20080081850A1 (en) * 2006-09-29 2008-04-03 Kazuhiko Fujisawa Process for producing hydrolysis-resistant silicone compounds
US9056880B2 (en) 2006-09-29 2015-06-16 Johnson & Johnson Vision Care, Inc. Process for producing hydrolysis-resistant silicone compounds
US8080622B2 (en) * 2007-06-29 2011-12-20 Johnson & Johnson Vision Care, Inc. Soluble silicone prepolymers
US8324319B2 (en) * 2007-11-20 2012-12-04 Sridhar Laxmisha M Redox-induced cationically polymerizable compositions with low cure temperature
US7897654B2 (en) 2007-12-27 2011-03-01 Johnson & Johnson Vision Care Inc. Silicone prepolymer solutions
US9163102B2 (en) 2011-12-01 2015-10-20 Isp Investments Inc. Soluble branched polymers
FR3015488B1 (fr) * 2013-12-19 2018-05-04 Compagnie Generale Des Etablissements Michelin Procede de synthese d'un polymere dienique fonctionnalise par des groupements epoxyde pendants le long de la chaine.
US10745503B2 (en) 2017-08-18 2020-08-18 Fina Technology, Inc. Epoxidized polyfarnesene and methods for producing the same
CA3084753A1 (en) * 2017-12-05 2019-06-13 Kuraray Co., Ltd. Modified liquid diene polymer
JP6590048B1 (ja) * 2018-08-09 2019-10-16 横浜ゴム株式会社 熱硬化性樹脂組成物及び熱硬化性樹脂
JP7093150B2 (ja) * 2018-12-06 2022-06-29 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60159583A (ja) 1984-01-27 1985-08-21 井関農機株式会社 穀粒乾燥機の始動装置
JPS6189242A (ja) 1984-10-09 1986-05-07 Idemitsu Petrochem Co Ltd 液状ジエン系重合体組成物
JPS6420213A (en) * 1987-07-15 1989-01-24 Matsushita Electric Works Ltd Photocurable resin composition
KR900007765B1 (ko) * 1987-11-25 1990-10-19 고려화학 주식회사 고무가 피복된 저용력화제 제조방법 및 이를 함유한 조성물
JP2718962B2 (ja) 1988-11-11 1998-02-25 東芝シリコーン株式会社 加水分解性シリル基で分子鎖末端が閉塞されたポリブタジエン、その製造方法およびそれを含有する室温硬化性組成物
EP0476224A1 (en) * 1990-08-21 1992-03-25 Ricon Resins, Inc. Adhesive rubber compositions
EP0612334B1 (en) * 1991-11-15 2000-01-19 Imperial Chemical Industries Plc Polymerisable compositions
US5300589A (en) * 1993-05-28 1994-04-05 Hoechst Celanese Corporation Substituted triphenyl compounds & processes for preparing the same
US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
TWI282811B (en) * 2000-04-10 2007-06-21 Sumitomo Bakelite Co Die-attaching paste and semiconductor device
WO2003014248A2 (en) * 2001-08-07 2003-02-20 National Starch And Chemical Investment Holding Corporation Adhesion promoting resins with cross-linking properties

Also Published As

Publication number Publication date
EP1422251A2 (en) 2004-05-26
US20040242796A1 (en) 2004-12-02
US20040097651A1 (en) 2004-05-20
US6908969B2 (en) 2005-06-21
MY140722A (en) 2010-01-15
KR20040044347A (ko) 2004-05-28
EP1422251A3 (en) 2005-04-13
TW200418928A (en) 2004-10-01
US6809155B2 (en) 2004-10-26
JP2004197079A (ja) 2004-07-15

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MM4A Annulment or lapse of patent due to non-payment of fees