KR20040018918A - 와이어본딩 방법, 와이어본딩 장치 및 와이어본딩 프로그램 - Google Patents
와이어본딩 방법, 와이어본딩 장치 및 와이어본딩 프로그램 Download PDFInfo
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- KR20040018918A KR20040018918A KR1020030054546A KR20030054546A KR20040018918A KR 20040018918 A KR20040018918 A KR 20040018918A KR 1020030054546 A KR1020030054546 A KR 1020030054546A KR 20030054546 A KR20030054546 A KR 20030054546A KR 20040018918 A KR20040018918 A KR 20040018918A
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- Prior art keywords
- wire
- capillary
- bonding point
- bonding
- loop
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 55
- 230000003028 elevating effect Effects 0.000 abstract 1
- 230000009466 transformation Effects 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000007665 sagging Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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Abstract
Description
Claims (3)
- 와이어를 삽입 통과시키고 유지하는 캐필러리를 본딩 대상에 대하여 상대적으로 이동시켜서 와이어를 변형하고, 제 1 본딩점과 제 2 본딩점을 와이어 루프로 접속하는 와이어본딩 방법으로서,제 1 본딩점에 와이어를 접속후, 제 1 본딩점에서 와이어를 기립시키는 네크 부분 형성 공정과,상기 와이어 루프의 전장으로부터 상기 네크 부분을 뺀 길이에 상당하는 분량의 와이어를 풀어 내면서 상기 캐필러리를 상기 네크 부분으로부터 상승시키고, 이어서 제 2 본딩점을 향하는 방향으로 상기 캐필러리를 이동시킴으로써 제 2 본딩점에서의 와이어의 제 1 변형부여 부분을 형성하는 제 1 변형부여 공정과,상기 캐필러리를 하강시켜서 제 2 본딩점에서의 기립 부분의 길이에 상당하는 분량의 와이어를 상기 캐필러리에 흡입시키고, 이어서 상기 제 2 본딩점과 반대측을 향하는 방향으로 상기 캐필러리를 이동시킴으로써 제 2 본딩점에서의 와이어의 기립 부분의 정점에서의 제 2 변형부여 부분을 형성하는 제 2 변형부여 공정과,상기 캐필러리를 상승시켜서 상기 제 1 변형부여 부분이 상기 캐필러리 선단에 위치할 때까지 와이어를 풀어 내고 그 상태에서 와이어를 유지하고, 상기 캐필러리를 상기 제 2 본딩점까지 이동시키고, 와이어의 상기 제 1 변형부여 부분에서 제 2 본딩점에 접속하여 와이어 루프를 형성하는 루프 형성 공정을 구비하는 것을 특징으로 하는 와이어본딩 방법.
- 와이어를 삽입 통과시키고 유지하는 캐필러리와,본딩 대상을 유지하는 재물대와,상기 캐필러리를 상기 재물대에 대하여 상대적으로 이동시키는 이동기구와,상기 캐필러리의 상대적 이동과 상기 와이어의 유지를 제어하고, 상기 본딩 대상의 제 1 본딩점과 제 2 본딩점 사이에 와이어 루프를 형성하여 접속하는 루프 형성 제어수단을 구비하는 와이어본딩 장치로서,상기 루프 형성 제어수단은,제 1 본딩점에 와이어를 접속후, 제 1 본딩점에서 와이어를 기립시키는 네크 부분 형성 처리 수순과,상기 와이어 루프의 전장으로부터 상기 네크 부분을 뺀 길이에 상당하는 분량의 와이어를 풀어 내면서 상기 캐필러리를 상기 네크 부분으로부터 상승시키고, 이어서 제 2 본딩점을 향하는 방향으로 상기 캐필러리를 이동시킴으로써 제 2 본딩점에서의 와이어의 제 1 변형부여 부분을 형성하는 제 1 변형부여 처리 수순과,상기 캐필러리를 하강시켜서 제 2 본딩점에서의 기립 부분의 길이에 상당하는 분량의 와이어를 상기 캐필러리에 흡입시키고, 이어서 상기 제 2 본딩점과 반대측을 향하는 방향으로 상기 캐필러리를 이동시킴으로써 제 2 본딩점에서의 와이어의 기립 부분의 정점에서의 제 2 변형부여 부분을 형성하는 제 2 변형부여 처리 수순과,상기 캐필러리를 상승시켜서 상기 제 1 변형부여 부분이 상기 캐필러리 선단에 위치할 때까지 와이어를 풀어 내고 그 상태에서 와이어를 유지하고, 상기 캐필러리를 상기 제 2 본딩점까지 이동시키고, 와이어의 상기 제 1 변형부여 부분에서 제 2 본딩점에 접속하여 와이어 루프를 형성하는 루프 형성 처리 수순을 실행하는 것을 특징으로 하는 와이어본딩 장치.
- 와이어를 삽입 통과시키고 유지하는 캐필러리와, 본딩 대상을 유지하는 재물대와, 상기 캐필러리를 상기 재물대에 대하여 상대적으로 이동시키는 이동기구와, 상기 캐필러리의 상대적 이동과 상기 와이어의 유지를 제어하고 상기 본딩 대상의 제 1 본딩점과 제 2 본딩점 사이에 와이어 루프를 형성하여 접속하는 루프 형성 제어수단을 구비하는 와이어본딩 장치의 동작을 제어하는 와이어본딩 프로그램으로서,상기 루프 형성 제어수단에,제 1 본딩점에 와이어를 접속후, 제 1 본딩점에서 와이어를 기립시키는 네크 부분 형성 처리 수순과,상기 와이어 루프의 전장으로부터 상기 네크 부분을 뺀 길이에 상당하는 분량의 와이어를 풀어 내면서 상기 캐필러리를 상기 네크 부분으로부터 상승시키고, 이어서 제 2 본딩점을 향하는 방향으로 상기 캐필러리를 이동시킴으로써 제 2 본딩점에서의 와이어의 제 1 변형부여 부분을 형성하는 제 1 변형부여 처리 수순과,상기 캐필러리를 하강시켜서 제 2 본딩점에서의 기립 부분의 길이에 상당하는 분량의 와이어를 상기 캐필러리에 흡입시키고, 이어서 상기 제 2 본딩점과 반대측을 향하는 방향으로 상기 캐필러리를 이동시킴으로써 제 2 본딩점에서의 와이어의 기립 부분의 정점에서의 제 2 변형부여 부분을 형성하는 제 2 변형부여 처리 수순과,상기 캐필러리를 상승시켜서 상기 제 1 변형부여 부분이 상기 캐필러리 선단에 위치할 때까지 와이어를 풀어 내고 그 상태에서 와이어를 유지하고, 상기 캐필러리를 상기 제 2 본딩점까지 이동시키고, 와이어의 상기 제 1 변형부여 부분에서 제 2 본딩점에 접속하여 와이어 루프를 형성하는 루프 형성 처리 수순을 실행하는 것을 특징으로 하는 와이어본딩 프로그램.
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JP2002246119A JP3685779B2 (ja) | 2002-08-27 | 2002-08-27 | ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディングプログラム |
JPJP-P-2002-00246119 | 2002-08-27 |
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JP4106039B2 (ja) * | 2003-06-27 | 2008-06-25 | 株式会社新川 | ワイヤボンディング方法 |
US7494042B2 (en) * | 2003-10-02 | 2009-02-24 | Asm Technology Singapore Pte. Ltd. | Method of forming low wire loops and wire loops formed using the method |
TWI263286B (en) * | 2004-02-06 | 2006-10-01 | Siliconware Precision Industries Co Ltd | Wire bonding method and semiconductor package using the method |
JP2007019415A (ja) * | 2005-07-11 | 2007-01-25 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4881620B2 (ja) | 2006-01-06 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US7780064B2 (en) * | 2006-06-02 | 2010-08-24 | Asm Technology Singapore Pte Ltd | Wire bonding method for forming low-loop profiles |
MY152355A (en) | 2011-04-11 | 2014-09-15 | Carsem M Sdn Bhd | Short and low loop wire bonding |
JP2011244022A (ja) * | 2011-09-09 | 2011-12-01 | Renesas Electronics Corp | 半導体装置の製造方法 |
MY181180A (en) | 2011-09-09 | 2020-12-21 | Carsem M Sdn Bhd | Low loop wire bonding |
US9093515B2 (en) * | 2013-07-17 | 2015-07-28 | Freescale Semiconductor, Inc. | Wire bonding capillary with working tip protrusion |
JP6644352B2 (ja) * | 2017-09-27 | 2020-02-12 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
JP7386526B2 (ja) * | 2020-02-26 | 2023-11-27 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
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JPS6342135A (ja) | 1986-08-08 | 1988-02-23 | Shinkawa Ltd | ワイヤボンデイング方法 |
JP2883463B2 (ja) | 1991-04-17 | 1999-04-19 | 株式会社東芝 | ワイヤボンディング装置 |
JP3333413B2 (ja) * | 1996-12-27 | 2002-10-15 | 株式会社新川 | ワイヤボンディング方法 |
JP3189115B2 (ja) * | 1996-12-27 | 2001-07-16 | 株式会社新川 | 半導体装置及びワイヤボンディング方法 |
JP3455092B2 (ja) * | 1997-10-27 | 2003-10-06 | 株式会社新川 | 半導体装置及びワイヤボンディング方法 |
JP3377747B2 (ja) * | 1998-06-23 | 2003-02-17 | 株式会社新川 | ワイヤボンディング方法 |
US6176416B1 (en) * | 1999-07-02 | 2001-01-23 | Advanced Semiconductor Engineering, Inc. | Method of making low-profile wire connection |
US6391759B1 (en) * | 2000-04-27 | 2002-05-21 | Advanced Semiconductor Engineering, Inc. | Bonding method which prevents wire sweep and the wire structure thereof |
JP2002280414A (ja) * | 2001-03-22 | 2002-09-27 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
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KR100559797B1 (ko) | 2006-03-10 |
TW200403826A (en) | 2004-03-01 |
US20040041008A1 (en) | 2004-03-04 |
JP3685779B2 (ja) | 2005-08-24 |
JP2004087747A (ja) | 2004-03-18 |
US7014095B2 (en) | 2006-03-21 |
TWI264100B (en) | 2006-10-11 |
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